The XC2S200-6FGG899C is a powerful field-programmable gate array (FPGA) from the renowned Spartan-II family, manufactured by Xilinx (now part of AMD). This versatile FPGA chip delivers exceptional performance with 200,000 system gates, 5,292 logic cells, and advanced programmable logic capabilities. Designed for engineers and system designers who demand flexibility, reliability, and cost-effectiveness, the XC2S200-6FGG899C represents an ideal solution for a wide range of embedded applications.
The XC2S200-6FGG899C features a fine-pitch ball grid array (FGG899) package with 899 balls, offering superior I/O density and thermal performance compared to traditional package types. This FPGA operates at a core voltage of 2.5V and incorporates 0.18μm CMOS technology, making it suitable for both commercial and industrial applications requiring robust digital signal processing.
Key Technical Specifications
Core Architecture and Performance
| Specification |
Value |
| Device Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| Configurable Logic Blocks (CLBs) |
1,176 (28 x 42 array) |
| Maximum Operating Frequency |
263 MHz |
| Technology Node |
0.18μm CMOS |
| Core Voltage |
2.5V |
| Speed Grade |
-6 (Commercial temperature range) |
Memory and Storage Resources
| Memory Type |
Capacity |
| Total Distributed RAM |
75,264 bits |
| Total Block RAM |
56 Kbits (56,320 bits) |
| Maximum Available User I/O |
284 pins |
Package Details: FGG899 Ball Grid Array
| Package Feature |
Specification |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Ball Count |
899 balls |
| Package Designation |
FGG899 |
| Mounting Technology |
Surface Mount Technology (SMT) |
| Temperature Range |
Commercial (0°C to +85°C) |
What Makes the XC2S200-6FGG899C Stand Out?
Superior Alternative to ASICs
The XC2S200-6FGG899C FPGA provides significant advantages over traditional mask-programmed ASICs. Unlike ASICs, this programmable device eliminates substantial upfront costs, lengthy development cycles, and inherent manufacturing risks. The reconfigurability of the XC2S200-6FGG899C allows for design upgrades and modifications in the field without hardware replacement—a capability impossible with conventional ASIC solutions.
Advanced Ball Grid Array Benefits
The FGG899 package utilizes ball grid array technology, which offers several critical advantages:
- Enhanced I/O Density: The 899-ball configuration provides exceptional pin count and routing flexibility
- Superior Electrical Performance: Shorter signal paths reduce inductance and improve high-speed signal integrity
- Improved Thermal Management: Direct heat dissipation path from die to PCB enhances thermal performance
- Space Efficiency: Compact footprint maximizes board real estate utilization
- Reliable Solder Joints: Automated reflow soldering ensures consistent, high-quality connections
Flexible Logic Architecture
The XC2S200-6FGG899C integrates 1,176 configurable logic blocks arranged in a 28 x 42 array, providing extensive resources for implementing complex digital designs. Each CLB contains look-up tables (LUTs), flip-flops, and multiplexers that enable efficient logic implementation. This architecture supports sophisticated state machines, arithmetic functions, data path operations, and custom logic circuits.
Target Applications and Use Cases
Communications and Networking Equipment
The XC2S200-6FGG899C excels in telecommunications infrastructure where high-speed data processing and protocol implementation are essential. Applications include:
- Network routers and switches
- Protocol converters and bridges
- Digital signal processing for communications
- Wireless base station components
- Broadband access equipment
Industrial Automation and Control
Industrial environments benefit from the XC2S200-6FGG899C’s reliability and programmability:
- Motor control systems
- Process automation controllers
- Programmable logic controllers (PLCs)
- Factory automation equipment
- Sensor interface and data acquisition systems
Medical Device Electronics
The reconfigurable nature and reliability of the XC2S200-6FGG899C make it suitable for medical applications:
- Medical imaging systems
- Patient monitoring equipment
- Diagnostic instruments
- Laboratory test equipment
- Portable medical devices
Consumer Electronics and Embedded Systems
Engineers designing consumer products leverage the XC2S200-6FGG899C for:
- Digital video processing
- Audio/video equipment
- Gaming consoles and controllers
- Smart home devices
- Automotive infotainment systems
XC2S200-6FGG899C Design Features
Programmable Logic Resources
The device architecture incorporates multiple programmable elements that provide design flexibility:
Logic Elements Overview:
| Resource Type |
Quantity |
Function |
| 4-Input LUTs |
10,584 |
Combinatorial logic implementation |
| Flip-Flops |
10,584 |
Sequential logic and state storage |
| Block RAM Blocks |
14 blocks |
High-speed memory storage |
| Delay-Locked Loops (DLLs) |
4 |
Clock management and distribution |
Input/Output Capabilities
The XC2S200-6FGG899C supports various I/O standards, enabling interfacing with different voltage levels and signaling protocols. The 284 user I/O pins can be configured for:
- LVTTL (Low-Voltage TTL)
- LVCMOS (Low-Voltage CMOS)
- PCI bus interface
- SSTL (Stub Series Terminated Logic)
- HSTL (High-Speed Transceiver Logic)
- GTL/GTL+ (Gunning Transceiver Logic)
Clock Management System
Four delay-locked loops (DLLs) positioned at each corner of the die provide advanced clock management capabilities:
- Clock de-skewing and distribution
- Clock multiplication and division
- Phase shifting
- Duty cycle correction
- Low-jitter clock generation
Development and Programming Support
Design Software Tools
The XC2S200-6FGG899C is supported by Xilinx ISE Design Suite, which provides comprehensive tools for:
- HDL synthesis (VHDL and Verilog)
- Logic simulation and verification
- Place and route optimization
- Timing analysis
- Bitstream generation
Programming and Configuration
Multiple configuration options are available for the XC2S200-6FGG899C:
- JTAG boundary-scan programming
- Master/Slave serial configuration
- SelectMAP parallel configuration
- Configuration PROM support
Performance Characteristics
Speed Grade and Timing
The “-6” speed grade designation indicates this device is optimized for commercial temperature range operation with the following characteristics:
| Timing Parameter |
Specification |
| Maximum System Frequency |
263 MHz |
| Pin-to-Pin Delay |
As low as 5ns |
| Clock-to-Output Delay |
Optimized for high-speed operation |
| Setup/Hold Times |
Minimal for maximum performance |
Power Consumption Profile
Operating at 2.5V core voltage, the XC2S200-6FGG899C provides excellent power efficiency:
- Static power consumption minimized through CMOS technology
- Dynamic power scales with operating frequency
- Power management features for low-power applications
- Multiple power domains for optimized energy usage
Xilinx has established itself as the industry leader in FPGA technology, pioneering programmable logic since 1985. The Spartan-II family, including the XC2S200-6FGG899C, represents decades of innovation in reconfigurable computing. When you select a Xilinx FPGA, you gain access to:
- Proven reliability in mission-critical applications
- Extensive ecosystem of development tools
- Comprehensive technical documentation and support
- Long product lifecycle support
- Strong global supply chain
Comparison with Related Spartan-II Devices
XC2S200 Package Variants
| Part Number |
Package Type |
Ball/Pin Count |
Key Difference |
| XC2S200-6FGG899C |
Fine BGA |
899 |
Highest I/O density, largest package |
| XC2S200-6FG456C |
Fine BGA |
456 |
Medium I/O count, compact size |
| XC2S200-6FG256C |
Fine BGA |
256 |
Lower I/O count, smallest BGA |
| XC2S200-6PQ208C |
PQFP |
208 |
Quad flat package, easier inspection |
Spartan-II Family Comparison
| Device |
System Gates |
Logic Cells |
CLBs |
Block RAM |
User I/O (Max) |
| XC2S50 |
50,000 |
1,728 |
384 |
32K |
176 |
| XC2S100 |
100,000 |
2,700 |
600 |
40K |
176 |
| XC2S150 |
150,000 |
3,888 |
864 |
48K |
260 |
| XC2S200 |
200,000 |
5,292 |
1,176 |
56K |
284 |
Quality and Reliability Standards
The XC2S200-6FGG899C is manufactured under strict quality control processes:
- ISO 9001 certified manufacturing
- RoHS compliance available in “G” suffix variants
- Automotive grade options for enhanced reliability
- Extended temperature variants for industrial applications
- Comprehensive reliability testing and qualification
Procurement and Availability
Ordering Information Breakdown
The part number XC2S200-6FGG899C decodes as follows:
- XC = Xilinx product prefix
- 2S = Spartan-II family
- 200 = 200,000 system gates
- -6 = Speed grade (commercial temperature)
- FGG899 = Fine-pitch BGA, 899 balls
- C = Commercial temperature range (0°C to +85°C)
Supply Chain Considerations
When sourcing the XC2S200-6FGG899C, consider:
- Verification of authentic Xilinx components
- Lead times for volume orders
- Moisture sensitivity level (MSL) rating
- Storage and handling requirements
- ESD protection during assembly
Technical Support and Resources
Documentation Available
Engineers working with the XC2S200-6FGG899C can access:
- Complete datasheet specifications
- Application notes and design guides
- Reference designs and IP cores
- PCB layout guidelines
- Thermal management recommendations
Development Resources
- Xilinx Answer Database for technical questions
- Community forums and user groups
- Training materials and webinars
- Evaluation boards and starter kits
- Third-party IP and tool support
Conclusion: Maximizing Value with XC2S200-6FGG899C
The XC2S200-6FGG899C represents an excellent balance of performance, flexibility, and cost-effectiveness for digital design projects. With its 200,000 system gates, 899-ball fine-pitch BGA package, and robust Spartan-II architecture, this FPGA delivers the resources needed for demanding applications across telecommunications, industrial automation, medical devices, and consumer electronics.
The reconfigurable nature of the XC2S200-6FGG899C provides significant advantages over fixed-function ASICs, enabling rapid prototyping, field upgrades, and design iterations without costly hardware changes. Combined with comprehensive development tool support and Xilinx’s industry-leading expertise, the XC2S200-6FGG899C offers a proven platform for bringing innovative digital designs to market.
Whether you’re developing next-generation communications equipment, implementing sophisticated industrial control systems, or creating cutting-edge embedded applications, the XC2S200-6FGG899C provides the programmable logic resources, I/O flexibility, and performance characteristics necessary for success.
