The XC2S200-6FGG897C is a powerful field-programmable gate array from AMD Xilinx’s renowned Spartan-II family, offering exceptional digital processing capabilities for demanding embedded applications. With 200,000 system gates and advanced packaging technology, this FPGA delivers reliable performance for industrial, telecommunications, and aerospace applications.

What is the XC2S200-6FGG897C FPGA?

Understanding Spartan-II FPGA Architecture

The XC2S200-6FGG897C represents AMD Xilinx’s commitment to delivering cost-effective, high-performance programmable logic solutions. This FPGA features a sophisticated architecture designed for complex digital designs, combining substantial gate capacity with flexible I/O options in a robust 897-ball Fine-Pitch Ball Grid Array package.

Key Features of XC2S200-6FGG897C

The XC2S200-6FGG897C stands out in the Spartan-II family with these impressive specifications:

• 200,000 system gates for implementing complex digital circuits
• 5,292 logic cells providing extensive design flexibility
• 75,264 bits of distributed RAM for on-chip data storage
• 56K bits of block RAM for high-speed memory operations
• 897-pin FBGA package offering maximum I/O connectivity
• Speed grade -6 ensuring optimal performance
• 2.5V core voltage for power-efficient operation
• 0.18μm CMOS technology for reliable manufacturing

XC2S200-6FGG897C Technical Specifications

Core Architecture Specifications

Package and Operating Parameters

Advanced Features Table

XC2S200-6FGG897C Applications and Use Cases

Industrial Automation and Control

The XC2S200-6FGG897C excels in industrial applications where reliability and flexibility are paramount. Engineers deploy this FPGA in motor control systems, process automation, robotic controllers, and programmable logic controllers (PLCs). Its robust architecture handles real-time control algorithms with precision.

Telecommunications Infrastructure

In telecommunications equipment, the XC2S200-6FGG897C processes high-speed data streams efficiently. This FPGA implements communication protocols, network routing functions, and signal processing tasks for base stations, network switches, and data transmission systems.

Medical Equipment and Imaging Systems

Medical device manufacturers utilize the XC2S200-6FGG897C for diagnostic equipment, patient monitoring systems, and medical imaging devices. The FPGA’s reconfigurability allows for software updates and feature enhancements without hardware modifications.

Aerospace and Defense Systems

The XC2S200-6FGG897C meets the demanding requirements of aerospace applications, including avionics systems, satellite communications, radar signal processing, and navigation equipment. Its proven reliability makes it suitable for mission-critical deployments.

XC2S200-6FGG897C vs Alternative FPGA Solutions

Comparison with Other Spartan-II Devices

When to Choose XC2S200-6FGG897C

Select the XC2S200-6FGG897C when your application requires:

• Maximum I/O connectivity with hundreds of available pins
• Substantial logic capacity for complex digital designs
• Reliable performance in commercial temperature ranges
• Cost-effective solution compared to ASIC development
• Field upgradability for future design enhancements

Design Resources for XC2S200-6FGG897C Development

Development Tools and Software

Engineers working with the XC2S200-6FGG897C utilize Xilinx’s comprehensive development environment:

• ISE Design Suite – Primary development platform for Spartan-II FPGAs
• Vivado Design Suite – Advanced synthesis and implementation tools
• ChipScope Pro – On-chip debugging and verification
• FPGA Editor – Manual placement and routing optimization

Programming and Configuration Options

The XC2S200-6FGG897C supports multiple configuration methods:

• JTAG boundary scan programming
• Master serial configuration mode
• Slave serial configuration interface
• SelectMAP parallel configuration
• In-system reconfiguration capability

Advantages of XC2S200-6FGG897C Over Traditional ASICs

Development Cost and Time Savings

The XC2S200-6FGG897C eliminates the substantial upfront costs associated with ASIC development. There are no expensive mask sets, no lengthy fabrication cycles, and no minimum order quantities. Design iterations happen in software, dramatically reducing time-to-market.

Design Flexibility and Updates

Unlike fixed-function ASICs, the XC2S200-6FGG897C allows field updates and design modifications. Engineers can implement bug fixes, feature enhancements, and protocol updates without replacing hardware, extending product lifecycles and reducing maintenance costs.

Risk Mitigation

ASIC development carries significant financial risk if design errors occur after fabrication. The XC2S200-6FGG897C’s reprogrammability eliminates this risk, allowing thorough testing and validation before committing to production.

XC2S200-6FGG897C Power Consumption and Thermal Management

Power Supply Requirements

Thermal Considerations

The XC2S200-6FGG897C’s 897-ball FBGA package provides excellent thermal dissipation characteristics. The large package size distributes heat effectively across the PCB, and the multiple ground balls enhance thermal conductivity. Designers should implement proper PCB thermal management for optimal reliability.

Board Design Guidelines for XC2S200-6FGG897C

PCB Layout Recommendations

Successful XC2S200-6FGG897C implementation requires careful PCB design:

• Multi-layer boards with dedicated power and ground planes
• Controlled impedance traces for high-speed signals
• Proper decoupling capacitors near power pins
• Thermal vias for enhanced heat dissipation
• JTAG test point access for programming and debugging

Signal Integrity Considerations

The 897-ball package demands attention to signal integrity:

• Minimize trace lengths for high-frequency signals
• Implement proper termination for long traces
• Use differential pair routing for sensitive signals
• Maintain consistent ground referencing
• Follow manufacturer’s fanout recommendations

Quality and Reliability of XC2S200-6FGG897C

Manufacturing Quality Standards

AMD Xilinx manufactures the XC2S200-6FGG897C using mature 0.18μm CMOS technology with rigorous quality control. Each device undergoes extensive testing to ensure specification compliance and long-term reliability.

Long-Term Availability and Support

While the Spartan-II family represents mature technology, the XC2S200-6FGG897C remains available for legacy system support and maintenance. Engineers should consult with authorized distributors for current stock availability and lead times.

Purchasing XC2S200-6FGG897C FPGAs

Sourcing Considerations

When procuring XC2S200-6FGG897C devices:

• Purchase from authorized AMD Xilinx distributors
• Verify part marking and authenticity
• Request certificates of conformance
• Consider lead times for large quantities
• Evaluate pricing for volume purchases

Package Marking and Identification

Authentic XC2S200-6FGG897C devices include:

• Complete part number marking
• Date code and lot code
• Country of origin
• Xilinx branding (or AMD after acquisition)
• RoHS compliance marking (when applicable)

Migration and Alternative Options

Newer FPGA Alternatives

For new designs, engineers might consider modern alternatives to the XC2S200-6FGG897C:

• Spartan-6 family – Improved performance and lower power
• Spartan-7 family – Latest generation cost-effective FPGAs
• Artix-7 family – Enhanced capabilities with modern features

Explore the complete range of Xilinx FPGA solutions to find the optimal device for your specific application requirements.

Design Migration Strategies

Migrating existing XC2S200-6FGG897C designs to newer devices requires careful planning:

• Evaluate pin compatibility and package options
• Review updated I/O standards and voltage requirements
• Update development tools to support new families
• Test thoroughly before production migration
• Maintain documentation of changes and validations

Frequently Asked Questions About XC2S200-6FGG897C

What makes the XC2S200-6FGG897C unique?

The XC2S200-6FGG897C offers the highest I/O count in the Spartan-II XC2S200 series with its 897-ball FBGA package, providing maximum connectivity for complex interfacing requirements.

Is the XC2S200-6FGG897C suitable for new designs?

While functional and reliable, the Spartan-II family is considered mature technology. New designs typically benefit from newer FPGA families offering better performance-per-watt and additional features.

What development tools support XC2S200-6FGG897C?

The primary development environment is Xilinx ISE Design Suite, which provides complete support for design entry, synthesis, implementation, and programming of Spartan-II devices.

Can the XC2S200-6FGG897C be reprogrammed?

Yes, the XC2S200-6FGG897C supports full in-system reconfiguration through JTAG and other configuration interfaces, allowing unlimited design updates throughout the product lifecycle.

What temperature ranges are available?

The XC2S200-6FGG897C with speed grade -6 is available in commercial temperature range (0°C to +85°C). Industrial temperature options may be available in other speed grades.

Conclusion: XC2S200-6FGG897C for Your FPGA Projects

The XC2S200-6FGG897C delivers proven FPGA performance for applications demanding substantial logic capacity and maximum I/O connectivity. With 200,000 system gates, 5,292 logic cells, and 897-ball packaging, this Spartan-II device provides the resources needed for complex digital designs.

Whether you’re maintaining existing systems or evaluating options for new projects, the XC2S200-6FGG897C represents AMD Xilinx’s commitment to reliable, cost-effective programmable logic solutions. Its mature technology, comprehensive development tool support, and flexible architecture make it a dependable choice for industrial, telecommunications, medical, and aerospace applications.

For current availability, pricing, and additional technical resources, consult with authorized distributors and visit AMD Xilinx’s technical documentation portal for detailed datasheets and application notes.