The XC2S200-6FGG892C is a premium field-programmable gate array from the renowned Spartan-II family, delivering exceptional performance for complex digital designs. This commercial-grade FPGA combines 200,000 system gates with advanced configurability, making it the ideal solution for telecommunications, industrial automation, and high-speed data processing applications.
Manufactured using advanced 0.18-micron CMOS technology, the XC2S200-6FGG892C provides engineers with a cost-effective alternative to traditional ASICs while offering unlimited reprogrammability and faster time-to-market. The -6 speed grade ensures maximum performance at 263 MHz, making this device perfect for demanding real-time applications.
Key Technical Specifications
Core Performance Features
| Specification |
Value |
Details |
| Logic Cells |
5,292 cells |
High-density programmable logic |
| System Gates |
200,000 gates |
Equivalent ASIC gate count |
| Speed Grade |
-6 (Commercial) |
Maximum performance variant |
| Operating Frequency |
263 MHz |
Industry-leading clock speed |
| Technology Node |
0.18 µm |
Advanced CMOS process |
| Supply Voltage |
2.5V core |
Low power consumption |
| Package Type |
FGG892 |
Fine-pitch BGA configuration |
| Total Pins |
892 pins |
Maximum I/O capability |
| Temperature Range |
Commercial (0°C to +85°C) |
Standard operating conditions |
Memory Architecture Specifications
| Memory Type |
Capacity |
Configuration |
| Distributed RAM |
33,792 bits |
LUT-based flexible memory |
| Block RAM |
56 Kbits |
Dedicated dual-port SRAM |
| Configurable Logic Blocks |
1,176 CLBs |
Advanced logic resources |
| RAM Blocks |
14 blocks |
4K-bit blocks available |
Advanced Architecture Features
Programmable Logic Resources
The XC2S200-6FGG892C leverages the proven Virtex architecture foundation, delivering exceptional flexibility for digital design implementations. Each Configurable Logic Block (CLB) contains four logic slices, with each slice providing two 4-input lookup tables (LUTs), two storage elements, wide-function multiplexers, and dedicated carry logic for arithmetic operations.
This hierarchical memory architecture enables designers to implement:
- High-speed data buffering systems
- FIFO queue implementations
- Flexible embedded memory structures
- Distributed RAM configurations up to 64 bits deep
High-Performance I/O Capabilities
| I/O Feature |
Specification |
Application Benefit |
| User I/O Pins |
Up to 656 I/Os |
Maximum connectivity options |
| I/O Standards |
16 supported standards |
Universal interface compatibility |
| I/O Banks |
Multiple voltage banks |
Mixed-voltage system support |
| Voltage Levels |
1.5V, 2.5V, 3.3V |
Flexible power design |
| Differential Pairs |
LVDS support |
High-speed serial communication |
| Hot Swap Support |
CompactPCI compatible |
Live insertion capability |
Clock Management and Distribution
Dedicated DLL Resources
The XC2S200-6FGG892C integrates four Delay-Locked Loops (DLLs) providing advanced clock management capabilities essential for modern FPGA designs:
- Clock Deskewing: Eliminates distribution delays
- Clock Multiplication/Division: Flexible frequency synthesis
- Phase Shifting: Precise timing control (±180°)
- Duty Cycle Correction: Ensures 50% duty cycles
- Low-Skew Distribution: Four global clock networks
| Clock Feature |
Specification |
Performance Impact |
| Global Clocks |
4 primary nets |
Minimal clock skew |
| DLL Precision |
±50 ps jitter |
Excellent timing accuracy |
| Clock Frequency Range |
25 MHz to 263 MHz |
Wide operating range |
Design Tools and Development Support
Industry-Leading Software Ecosystem
Development for the XC2S200-6FGG892C is streamlined through the comprehensive <a href=”https://pcbsync.com/xilinx-fpga/”>Xilinx FPGA</a> ISE development system, providing:
- Automated Place and Route: Optimized resource utilization
- Timing-Driven Compilation: Meets critical path requirements
- Built-in Simulation: Comprehensive verification tools
- IP Core Library: Pre-designed functional blocks
- Constraint Management: Advanced timing control
Application Areas and Use Cases
Telecommunications Infrastructure
The XC2S200-6FGG892C excels in telecommunications applications requiring high-speed signal processing:
- Digital signal processing (DSP) implementations
- Protocol conversion and bridging
- Base station signal processing
- Network packet processing engines
- Software-defined radio platforms
Industrial Automation Systems
| Application |
XC2S200-6FGG892C Advantage |
| Motor Control |
Real-time PWM generation, encoder interfaces |
| Machine Vision |
Parallel image processing pipelines |
| PLC Systems |
Fast I/O response, deterministic timing |
| Robotics |
Sensor fusion, motion control algorithms |
| Test Equipment |
High-speed data acquisition, pattern generation |
Consumer Electronics Applications
- High-definition video processing and scaling
- Audio/video codec implementations
- Display controller interfaces
- Gaming console graphics acceleration
- Digital camera image processing pipelines
Power Management and Efficiency
Optimized Power Consumption
| Power Metric |
Typical Value |
Optimization Strategy |
| Core Voltage |
2.5V ±5% |
Regulated supply required |
| I/O Voltage |
1.5V to 3.3V |
Bank-specific configuration |
| Standby Current |
<1 mA |
Low-power sleep mode |
| Dynamic Power |
Design-dependent |
Clock gating recommended |
Package and Thermal Characteristics
FGG892 Package Details
The Fine-Pitch Grid Array (FGG) package offers superior thermal performance and maximum pin density:
| Package Parameter |
Specification |
| Package Type |
BGA (Ball Grid Array) |
| Total Balls |
892 connections |
| Ball Pitch |
Fine-pitch configuration |
| Thermal Resistance (θJA) |
Depends on airflow |
| Moisture Sensitivity |
MSL 3 rating |
| RoHS Compliance |
Pb-free option available |
Quality and Reliability Standards
Manufacturing Excellence
Every XC2S200-6FGG892C undergoes rigorous quality control:
- Full functional testing at rated speed
- Temperature cycling qualification
- ESD protection on all I/O pins
- JEDEC-compliant boundary scan (IEEE 1149.1)
- Automotive-grade options available
Configuration and Programming
Flexible Configuration Options
| Configuration Mode |
Interface |
Application |
| Master Serial |
SPI Flash |
Stand-alone operation |
| Slave Serial |
External controller |
System integration |
| JTAG |
Boundary scan |
Development/debug |
| SelectMAP |
Parallel 8-bit |
High-speed programming |
Configuration Memory Support
- Platform Flash PROMs compatibility
- Third-party flash memory support
- Bitstream compression enabled
- Partial reconfiguration capability
- Readback and verify functions
Design Migration and Compatibility
Spartan-II Family Ecosystem
The XC2S200-6FGG892C maintains pin compatibility within the Spartan-II family where applicable, enabling:
- Scalable design implementations
- Easy capacity upgrades
- Common PCB footprint utilization
- Reduced development costs
- Faster product iterations
Comparison with Other Spartan-II Devices
| Device |
Logic Cells |
System Gates |
Block RAM |
Max User I/O |
| XC2S50 |
1,728 |
50,000 |
32 Kbits |
176 |
| XC2S100 |
2,700 |
100,000 |
40 Kbits |
176 |
| XC2S150 |
3,888 |
150,000 |
48 Kbits |
260 |
| XC2S200 |
5,292 |
200,000 |
56 Kbits |
284 |
Compliance and Certifications
International Standards
- CE marking compliant
- FCC Part 15 Class B certified
- RoHS directive conformant (Pb-free variants)
- REACH regulation compliant
- ISO 9001:2015 manufacturing facilities
Getting Started with XC2S200-6FGG892C
Development Resources
To begin your design with the XC2S200-6FGG892C, access these essential resources:
- Reference Designs: Proven starting points for common applications
- Application Notes: Design best practices and optimization techniques
- Evaluation Boards: Hardware platforms for rapid prototyping
- Online Training: Video tutorials and webinars
- Technical Support: Direct engineering assistance
PCB Design Considerations
| Design Aspect |
Recommendation |
| Decoupling |
0.1µF per power pin, 10µF bulk capacitors |
| Power Planes |
Separate analog and digital planes |
| Signal Integrity |
Controlled impedance for high-speed signals |
| Thermal Management |
Adequate copper pour, thermal vias |
| EMI Mitigation |
Ground plane continuity, proper termination |
Ordering Information and Availability
Part Number Breakdown
XC2S200-6FGG892C decodes as:
- XC2S200: Spartan-II family, 200K gate device
- -6: Speed grade (commercial, maximum performance)
- FGG892: Package type and pin count
- C: Commercial temperature range (0°C to +85°C)
Lead-Free Options
For RoHS-compliant applications, specify the “G” suffix: XC2S200-6FGG892CG
Technical Support and Resources
Documentation Library
Access comprehensive technical documentation:
- Complete datasheet with AC/DC specifications
- User guides for architecture and resources
- Programming specifications and file formats
- Design constraint guidelines
- PCB layout recommendations
Why Choose XC2S200-6FGG892C?
Competitive Advantages
- Proven Architecture: Based on successful Virtex technology
- Cost-Effective: Lower total system cost versus ASICs
- Rapid Development: Immediate design iteration capability
- Field Upgradable: Update functionality without hardware changes
- Comprehensive Support: Extensive tools and documentation
- Industry Standard: Wide adoption across multiple sectors
- Reliable Supply: Established manufacturing infrastructure
Conclusion: Optimal FPGA Solution for Modern Designs
The XC2S200-6FGG892C represents the pinnacle of the Spartan-II family, combining high logic density, exceptional speed performance, and comprehensive I/O capabilities in a single device. Whether you’re developing telecommunications equipment, industrial control systems, or consumer electronics, this FPGA delivers the performance, flexibility, and reliability your application demands.
With support from industry-leading development tools, extensive reference designs, and a robust technical ecosystem, the XC2S200-6FGG892C accelerates your time-to-market while reducing development risk. Its proven architecture, backed by Xilinx’s decades of FPGA innovation, ensures your design will meet today’s requirements and tomorrow’s challenges.
