The XC2S200-6FGG891C is a powerful Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Spartan-II family, engineered to deliver exceptional performance for complex digital applications. This programmable logic device combines 200,000 system gates with advanced features, making it the ideal choice for telecommunications, industrial automation, embedded systems, and signal processing applications.
What is the XC2S200-6FGG891C FPGA?
The XC2S200-6FGG891C represents a cost-effective, high-performance solution in programmable logic technology. As part of the Spartan-II FPGA family, this device offers designers unprecedented flexibility in implementing custom digital circuits without the high costs and long development cycles associated with traditional ASICs (Application-Specific Integrated Circuits).
Key Features of XC2S200-6FGG891C
This advanced Xilinx FPGA delivers professional-grade capabilities for demanding applications:
- 200,000 System Gates: Massive logic capacity for implementing complex digital designs
- 5,292 Logic Cells: Flexible programmable logic elements for versatile circuit implementation
- 1,176 Configurable Logic Blocks (CLBs): Organized in a 28 x 42 array for optimal resource distribution
- 75,264 Bits Distributed RAM: Integrated memory for high-speed data processing
- 56 Kbits Block RAM: Dedicated memory blocks for efficient data storage
- 284 Maximum User I/O Pins: Extensive connectivity options for interfacing with external components
- Speed Grade -6: High-performance timing characteristics for demanding applications
- 2.5V Core Voltage: Low power consumption with reliable operation
- 0.18μm CMOS Technology: Advanced manufacturing process for enhanced performance
Technical Specifications Table
| Specification |
Value |
| Part Number |
XC2S200-6FGG891C |
| Manufacturer |
AMD Xilinx |
| FPGA Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 (1,176 total) |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Maximum User I/O |
284 pins |
| Speed Grade |
-6 (High Performance) |
| Core Voltage |
2.5V |
| Process Technology |
0.18μm |
| Package Type |
Fine-Pitch BGA |
| Operating Frequency |
Up to 263 MHz |
| Temperature Range |
Commercial (0°C to +85°C) |
XC2S200-6FGG891C Architecture and Design
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG891C features a sophisticated CLB architecture that forms the foundation of its programmable logic capabilities. Each CLB contains:
- Look-Up Tables (LUTs): For implementing combinational logic functions
- Flip-Flops: Providing sequential logic and state machine implementation
- Multiplexers: Enabling flexible data routing and selection
- Carry Logic: Optimized for arithmetic operations and fast adder implementations
Memory Architecture
This Spartan-II FPGA incorporates a dual-memory architecture:
Distributed RAM (75,264 bits total):
- Implemented within CLB resources
- Ideal for small, fast-access memory requirements
- Perfect for FIFOs, shift registers, and small buffers
Block RAM (56 Kbits total):
- Dedicated memory columns
- High-density storage capability
- Optimized for data buffering and packet storage
Input/Output Capabilities
With 284 maximum user I/O pins, the XC2S200-6FGG891C provides extensive connectivity:
- Multiple I/O standards support
- Programmable drive strength
- Slew rate control
- Input delay compensation
- Output enable control
Performance Comparison Table
| Feature |
XC2S150 |
XC2S200 |
XC2S300E |
| System Gates |
150,000 |
200,000 |
300,000 |
| Logic Cells |
3,888 |
5,292 |
6,912 |
| CLB Array |
24 x 36 |
28 x 42 |
32 x 48 |
| Max User I/O |
260 |
284 |
329 |
| Distributed RAM |
55,296 bits |
75,264 bits |
110,592 bits |
| Block RAM |
48K |
56K |
72K |
Applications of XC2S200-6FGG891C FPGA
Telecommunications Systems
The XC2S200-6FGG891C excels in communication infrastructure:
- Protocol implementation (Ethernet, USB, UART, SPI, I2C)
- Data encoding and decoding
- Channel coding and error correction
- Baseband signal processing
- Network routing and switching
Industrial Automation and Control
Perfect for factory automation and process control:
- Programmable Logic Controllers (PLCs)
- Motor control systems
- Sensor interface and data acquisition
- Real-time monitoring and control
- Machine vision integration
Digital Signal Processing (DSP)
Advanced signal processing capabilities:
- Audio and video processing
- Image filtering and enhancement
- FFT and spectral analysis
- Digital filters (FIR, IIR)
- Software-defined radio (SDR)
Embedded Systems Development
Ideal for embedded applications:
- Custom peripheral interfaces
- Hardware acceleration
- System-on-Chip (SoC) prototyping
- Real-time data processing
- IoT gateway controllers
Medical and Instrumentation
Precision requirements met with reliability:
- Medical imaging systems
- Patient monitoring equipment
- Diagnostic instrumentation
- Laboratory test equipment
- Bio-signal processing
Benefits of Using XC2S200-6FGG891C
Cost-Effective Alternative to ASICs
The XC2S200-6FGG891C eliminates the drawbacks of traditional ASIC development:
- No NRE Costs: Zero non-recurring engineering expenses
- Rapid Prototyping: Instant design implementation and testing
- Field Upgradability: In-system reconfiguration capability
- Lower Risk: No commitment to fixed silicon
- Shorter Time-to-Market: Immediate deployment after design completion
Flexibility and Reconfigurability
Unmatched design flexibility advantages:
- Unlimited design iterations without hardware changes
- Easy feature updates and bug fixes
- Adaptive functionality for changing requirements
- Multiple configuration storage options
- Remote reprogramming capabilities
High Performance and Reliability
Enterprise-grade performance characteristics:
- 263 MHz maximum operating frequency
- Low propagation delays
- Predictable timing characteristics
- Industrial-grade reliability
- Proven manufacturing quality
Package and Physical Specifications
| Package Parameter |
Specification |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Total Pins |
891 (FGG891) |
| Body Size |
Contact manufacturer for dimensions |
| Ball Pitch |
Fine-pitch spacing |
| Mounting |
Surface mount technology (SMT) |
| RoHS Compliance |
Check current compliance status |
| Moisture Sensitivity |
MSL 3 (typical for FBGA packages) |
Development Tools and Support
Design Software
Programming and development tools:
- Xilinx ISE Design Suite: Comprehensive FPGA development environment
- Vivado Design Suite: Advanced design and synthesis
- ChipScope Pro: Integrated logic analyzer
- FPGA Editor: Detailed design viewing and editing
Programming Options
Multiple configuration methods:
- JTAG boundary scan programming
- Slave serial configuration
- Master serial configuration
- SelectMAP parallel configuration
- SPI flash memory boot
Power Consumption Characteristics
| Power Parameter |
Typical Value |
| Core Voltage (VCCINT) |
2.5V ± 5% |
| I/O Voltage (VCCO) |
1.5V to 3.3V (bank dependent) |
| Quiescent Power |
Low (design dependent) |
| Dynamic Power |
Varies with switching activity |
| Power Estimation Tools |
XPower Analyzer supported |
Quality and Reliability
The XC2S200-6FGG891C meets stringent quality standards:
- Automotive-grade variants available
- Extended temperature range options
- Long-term product availability
- Comprehensive testing and validation
- Industry-standard quality certifications
Competitive Advantages
Why Choose XC2S200-6FGG891C?
Proven Technology: Spartan-II FPGAs have powered countless successful products worldwide
Extensive Ecosystem: Comprehensive IP cores, reference designs, and community support
Cost Performance: Optimal balance of features and affordability
Scalability: Easy migration path within Spartan family
Design Security: Bitstream encryption and copy protection options
Frequently Asked Questions (FAQ)
What is the difference between speed grades?
Speed grade -6 indicates the device’s maximum operating frequency and timing performance. Higher numbers represent faster timing specifications, with -6 being a high-performance grade suitable for demanding applications.
Can the XC2S200-6FGG891C be reprogrammed?
Yes, the device supports unlimited reprogramming cycles, allowing for design updates, bug fixes, and feature enhancements throughout the product lifecycle.
What voltage levels are supported on I/O pins?
The XC2S200-6FGG891C supports multiple I/O standards with voltage levels ranging from 1.5V to 3.3V, configurable per I/O bank.
Is the XC2S200 suitable for beginners?
While the XC2S200 is a professional-grade device, it’s accessible to beginners with basic knowledge of digital design and FPGA development tools. Extensive documentation and tutorials are available.
What is the typical lead time for ordering?
Lead times vary by distributor and market conditions. Contact authorized distributors for current availability and delivery schedules.
Ordering Information and Availability
The XC2S200-6FGG891C is available through authorized AMD Xilinx distributors worldwide. When ordering, verify:
- Correct part number and speed grade
- Package type (FGG891)
- Temperature range requirements
- Lead-free/RoHS compliance needs
- Quantity and delivery schedule
Conclusion: Why XC2S200-6FGG891C is Your Ideal FPGA Solution
The XC2S200-6FGG891C Spartan-II FPGA represents an exceptional combination of performance, flexibility, and value. With 200,000 system gates, 5,292 logic cells, and 284 user I/O pins, this programmable logic device delivers the resources needed for sophisticated digital designs across telecommunications, industrial, medical, and embedded applications.
Whether you’re developing next-generation communication systems, implementing advanced control algorithms, or creating innovative embedded solutions, the XC2S200-6FGG891C provides the programmable logic foundation for success. Its proven architecture, comprehensive development tools, and field-proven reliability make it the smart choice for engineers and designers worldwide.
Ready to start your next FPGA project? Contact authorized distributors today to order the XC2S200-6FGG891C and experience the power of professional-grade programmable logic.
