The XC2S200-6FGG890C is a powerful field-programmable gate array from the renowned Spartan-II family, manufactured by Xilinx (now part of AMD). This versatile FPGA delivers exceptional performance with 200,000 system gates and 5,292 logic cells, making it an ideal solution for embedded systems, communication infrastructure, and industrial control applications. The device comes in a 890-pin Fine-Pitch Ball Grid Array (FGG890) package with -6 speed grade, offering commercial temperature range operation.

Key Features and Specifications

Core Architecture Specifications

The XC2S200-6FGG890C represents the flagship model in the Spartan-II family, providing designers with robust programmable logic resources for complex digital implementations.

Package Details – FGG890 Configuration

Technical Capabilities and Performance

Advanced Programmable Logic Resources

The XC2S200-6FGG890C FPGA incorporates sophisticated architecture elements that enable complex digital design implementation. With 1,176 configurable logic blocks arranged in a 28×42 matrix, designers gain access to flexible logic resources for building custom digital circuits, state machines, arithmetic units, and complex control systems.

Memory Architecture

This Xilinx FPGA features dual memory structures: 75,264 bits of distributed RAM integrated within the CLB structure for small, fast memory requirements, and 56 Kbits of dedicated block RAM for larger memory implementations. This hierarchical memory architecture provides optimal performance for buffering, FIFO implementations, and lookup table storage.

High-Speed I/O Capabilities

With 284 available user I/O pins in the FGG890 package, the XC2S200-6FGG890C supports extensive peripheral connectivity. The device includes four Delay-Locked Loops (DLLs) positioned at each corner of the die for precise clock management and distribution, essential for high-speed designs requiring minimal clock skew and jitter.

Application Areas and Use Cases

Industrial Automation Systems

The XC2S200-6FGG890C excels in industrial control applications where programmability, reliability, and substantial I/O resources are critical. Common implementations include motor control systems, sensor interfaces, and programmable logic controllers (PLCs).

Communications Infrastructure

This Spartan-II FPGA serves telecommunications equipment requiring protocol conversion, data routing, and signal processing. The combination of logic resources and block RAM enables efficient implementation of communication protocols and buffering systems.

Embedded Systems Development

For embedded applications, the XC2S200-6FGG890C provides the flexibility to create custom peripherals, interface controllers, and specialized processing units that complement microprocessors in system-on-chip designs.

Digital Signal Processing

With distributed arithmetic capabilities and dedicated RAM blocks, this FPGA handles DSP algorithms including filtering, FFT operations, and real-time signal conditioning for audio, video, and instrumentation applications.

Design Implementation Features

Configuration Options

Development Tool Compatibility

The XC2S200-6FGG890C integrates seamlessly with industry-standard FPGA development tools including:

• Xilinx ISE Design Suite for synthesis and implementation
• FPGA Editor for manual routing optimization
• ChipScope for real-time debugging
• Impact for device programming

Performance Specifications

Speed and Timing Characteristics

The -6 speed grade designation indicates this device offers the fastest performance available in the Spartan-II XC2S200 family. This speed grade is exclusively available in the commercial temperature range (0°C to 85°C), providing optimal timing characteristics for demanding applications.

Power Consumption Profile

Operating at 2.5V core voltage, the XC2S200-6FGG890C achieves an excellent balance between performance and power efficiency. The 0.18µm process technology enables reduced power consumption compared to earlier FPGA generations while maintaining robust performance.

Package and PCB Design Considerations

FGG890 Ball Grid Array Advantages

PCB Layout Requirements

The 890-pin FBGA package requires careful PCB design attention. Designers should consider multi-layer board construction with appropriate power and ground planes for optimal signal integrity. The fine-pitch ball arrangement necessitates precise pad definition and controlled impedance routing for high-speed signals.

Comparison with Spartan-II Family Members

Device Selection Guide

The XC2S200-6FGG890C represents the highest capacity device in the Spartan-II family, offering maximum resources for complex designs while maintaining cost-effectiveness compared to higher-end FPGA families.

Ordering Information and Part Number Breakdown

Understanding the Part Number: XC2S200-6FGG890C

• XC: Xilinx product designation
• 2S: Spartan-II family identifier
• 200: 200,000 system gates capacity
• -6: Speed grade (fastest available)
• FGG: Fine-Pitch BGA package type
• 890: Pin count (890 pins)
• C: Commercial temperature range (0°C to 85°C)

Available Temperature Grades

The XC2S200 is offered in commercial temperature range specifically for the -6 speed grade. Industrial temperature options are available with other speed grades for extended operating conditions.

Quality and Reliability

Manufacturing Standards

Xilinx Spartan-II FPGAs undergo rigorous testing and qualification processes. The devices meet industry standards for FPGA reliability and are suitable for applications requiring long operational lifetimes and consistent performance.

RoHS Compliance

Lead-free package options are available for environmental compliance requirements. The “G” suffix in ordering codes (FGG890G) indicates RoHS-compliant, lead-free solder ball construction.

Getting Started with XC2S200-6FGG890C

Development Resources

Engineers implementing designs with the XC2S200-6FGG890C can access comprehensive documentation including:

• Complete datasheet with electrical specifications
• Application notes for design implementation
• Reference designs for common applications
• PCB layout guidelines for FGG890 package
• Configuration and programming guides

Design Workflow

Successful FPGA implementation follows a structured process: design entry using HDL or schematic capture, synthesis to netlist format, place-and-route for device-specific optimization, timing analysis to verify performance requirements, and finally device programming through JTAG or configuration modes.

Competitive Advantages

Cost-Effective Solution

The Spartan-II family provides exceptional value by delivering substantial logic resources and features at accessible pricing. The XC2S200-6FGG890C offers an economical alternative to mask-programmed ASICs, eliminating NRE costs and lengthy development cycles while maintaining upgrade flexibility.

Programmable Flexibility

Unlike fixed-function ASICs, the XC2S200-6FGG890C enables design modifications and updates even after deployment. This programmability reduces time-to-market and allows for field upgrades without hardware replacement.

Proven Technology Platform

The Spartan-II architecture represents mature, field-proven technology with extensive industry adoption. Designers benefit from established design flows, comprehensive documentation, and robust support resources.

Technical Support and Resources

Documentation Access

Complete technical documentation for the XC2S200-6FGG890C includes datasheets covering electrical characteristics, timing specifications, package information, and application guidelines. These resources support efficient design implementation and troubleshooting.

Community and Support

The extensive Xilinx user community provides valuable resources including design examples, troubleshooting advice, and implementation tips. Official technical support channels offer expert assistance for complex design challenges.

Conclusion

The XC2S200-6FGG890C Spartan-II FPGA delivers outstanding programmable logic capabilities in a high-pin-count package suitable for demanding applications. With 200,000 system gates, 5,292 logic cells, and 284 I/O pins, this device provides the resources necessary for complex digital designs across industrial, communications, and embedded system domains. The -6 speed grade ensures maximum performance, while the proven Spartan-II architecture offers reliability and cost-effectiveness for both prototype development and volume production.

For engineers seeking a versatile, high-performance FPGA solution with extensive I/O capabilities and proven reliability, the XC2S200-6FGG890C represents an excellent choice that balances functionality, performance, and value.