The XC2S200-6FGG888C is a premium field-programmable gate array (FPGA) from the renowned Xilinx FPGA Spartan-II family, engineered to deliver exceptional performance for complex digital logic implementations. This powerful FPGA combines 200,000 system gates with advanced programmable architecture, making it an ideal solution for telecommunications, industrial automation, digital signal processing, and embedded system development.
As a member of the Spartan-II family, the XC2S200-6FGG888C represents a cost-effective alternative to traditional ASICs, offering field-upgradeable programmability without the lengthy development cycles and initial costs associated with mask-programmed solutions.
Key Features and Specifications
Core Architecture Specifications
| Specification |
Value |
Description |
| Logic Cells |
5,292 cells |
Advanced configurable logic resources |
| System Gates |
200,000 gates |
Equivalent logic capacity for design complexity |
| CLB Array |
28 x 42 (1,176 CLBs) |
Configurable Logic Block matrix |
| Maximum User I/O |
284 pins |
Extensive connectivity options |
| Distributed RAM |
75,264 bits |
Integrated memory for data buffering |
| Block RAM |
56 Kbits |
Dedicated high-speed memory blocks |
| Process Technology |
0.18μm |
Advanced semiconductor fabrication |
| Core Voltage |
2.5V |
Low-power operation |
Package and Performance Details
| Parameter |
Specification |
Benefits |
| Package Type |
FGG888 (888-ball FBGA) |
Fine-pitch Ball Grid Array for high density |
| Speed Grade |
-6 |
Maximum performance specification |
| Operating Frequency |
Up to 263 MHz |
High-speed digital processing capability |
| Temperature Range |
Commercial (0°C to +85°C) |
Standard operating conditions |
| Lead-Free Option |
Yes (G designation) |
RoHS compliant, environmentally friendly |
Technical Architecture and Design Capabilities
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG888C features 1,176 Configurable Logic Blocks arranged in a 28 x 42 matrix, providing extensive resources for implementing complex digital circuits. Each CLB contains:
- Look-Up Tables (LUTs) for combinational logic
- Flip-flops for sequential logic implementation
- Multiplexers for data routing and selection
- Dedicated carry logic for arithmetic operations
Memory Resources
Distributed RAM
With 75,264 bits of distributed RAM, designers can implement flexible memory structures throughout the FPGA fabric, ideal for:
- Small buffer implementations
- Pipeline register files
- Look-up table storage
- State machine data storage
Block RAM
The device includes 56 Kbits of dedicated block RAM, organized in dual-port configurations for:
- High-bandwidth data buffering
- FIFO implementations
- Frame buffers for video applications
- Packet buffers for network designs
Input/Output Capabilities
The XC2S200-6FGG888C provides 284 maximum user I/O pins, supporting multiple I/O standards including:
- LVTTL (Low Voltage TTL)
- LVCMOS (Low Voltage CMOS)
- PCI 33/66 MHz compliance
- GTL/GTL+ termination
- SSTL and HSTL standards
Applications and Use Cases
Digital Signal Processing (DSP)
The XC2S200-6FGG888C excels in DSP applications requiring:
- Real-time audio processing and filtering
- Image processing and enhancement algorithms
- Digital communication signal manipulation
- Adaptive filtering implementations
- FFT/IFFT calculations
Industrial Automation and Control
Perfect for industrial environments demanding:
- Motor control and drive systems
- PLC (Programmable Logic Controller) implementations
- Process control and monitoring
- Sensor interface and data acquisition
- Real-time control algorithms
Communication Systems
Ideal for networking and telecommunications:
- Protocol implementation (Ethernet, USB, SPI, I2C)
- Network packet processing
- Data encoding/decoding systems
- Channel coding and error correction
- Serial-to-parallel conversion
Embedded System Development
Suitable for complex embedded applications:
- Custom processor implementations
- Co-processor acceleration
- Hardware-software co-design
- Interface bridging solutions
- System-on-Chip (SoC) prototyping
Design Features and Benefits
Programmability Advantages
| Feature |
Benefit |
| Field Upgradeable |
Update designs without hardware replacement |
| Rapid Prototyping |
Reduce development time from months to weeks |
| Design Flexibility |
Implement custom logic tailored to specific needs |
| Cost-Effective |
Eliminate mask costs and NRE charges |
| Risk Mitigation |
Modify designs post-deployment for bug fixes |
Delay-Locked Loops (DLLs)
The XC2S200-6FGG888C includes four Delay-Locked Loops positioned at each corner of the die, providing:
- Clock deskew and multiplication
- Phase shifting capabilities
- Clock distribution management
- Reduced clock-to-output delays
- Improved timing margins
Development Tool Support
ISE Design Suite Compatibility
Full support for Xilinx ISE (Integrated Software Environment) including:
- Synthesis and implementation tools
- Timing analysis and optimization
- FPGA Editor for manual placement
- ChipScope for in-system debugging
- Impact for device configuration
Programming Options
Multiple configuration methods:
- JTAG boundary-scan programming
- Master Serial mode
- Slave Serial mode
- SelectMAP parallel configuration
- Master SPI Flash mode
Comparison with Alternative Solutions
XC2S200-6FGG888C vs. Other Spartan-II Devices
| Device |
Logic Cells |
System Gates |
Block RAM |
User I/O |
Best For |
| XC2S200 |
5,292 |
200,000 |
56 Kbits |
284 |
Large-scale designs |
| XC2S150 |
3,888 |
150,000 |
48 Kbits |
260 |
Medium complexity |
| XC2S100 |
2,700 |
100,000 |
40 Kbits |
176 |
Cost-sensitive projects |
| XC2S50 |
1,728 |
50,000 |
32 Kbits |
176 |
Entry-level applications |
Design Considerations and Best Practices
Power Management
The XC2S200-6FGG888C operates at 2.5V core voltage, offering:
- Reduced power consumption compared to 3.3V alternatives
- Heat dissipation optimization
- Battery-powered application suitability
- Multiple power-down modes for inactive resources
Thermal Management
For reliable operation, consider:
- Adequate heat sinking for continuous operation
- Airflow considerations in enclosed designs
- Thermal simulation during design phase
- Junction temperature monitoring
Signal Integrity
To maximize performance:
- Follow proper PCB layout guidelines
- Implement appropriate termination schemes
- Use decoupling capacitors per Xilinx recommendations
- Consider impedance-controlled routing for high-speed signals
Ordering and Availability Information
Part Number Breakdown
XC2S200-6FGG888C decodes as:
- XC2S200: Device family and gate count (Spartan-II, 200K gates)
- 6: Speed grade (highest performance)
- FGG888: Package type (888-ball Fine-pitch Ball Grid Array, lead-free)
- C: Commercial temperature range (0°C to +85°C)
Quality and Reliability
All XC2S200-6FGG888C devices meet stringent quality standards:
- Full electrical testing and characterization
- JEDEC qualification standards compliance
- RoHS and REACH environmental compliance
- Counterfeit prevention measures
- Traceability documentation
Why Choose XC2S200-6FGG888C?
Performance Advantages
- High-Speed Operation: -6 speed grade ensures maximum performance
- Extensive Resources: 200K gates support complex designs
- Flexible I/O: 284 pins with multiple standard support
- Proven Architecture: Mature Spartan-II platform with extensive documentation
Economic Benefits
- Lower NRE Costs: No mask charges compared to ASICs
- Reduced Time-to-Market: Rapid development and deployment
- Design Reusability: Leverage existing IP and designs
- Volume Pricing: Competitive pricing for production quantities
Technical Support
Xilinx provides comprehensive support including:
- Extensive documentation and datasheets
- Application notes and reference designs
- Technical support forums and communities
- Design consultation services
- Free development tools (WebPACK edition)
Frequently Asked Questions
What makes the XC2S200-6FGG888C suitable for industrial applications?
The device offers robust performance with 200,000 system gates, extensive I/O options, and reliable operation in commercial temperature ranges, making it perfect for industrial control, automation, and monitoring systems.
Can I upgrade my design after deployment?
Yes, FPGA programmability allows field updates through various programming interfaces including JTAG, eliminating the need for hardware replacement when design modifications are required.
What development tools are compatible?
The XC2S200-6FGG888C is fully compatible with Xilinx ISE Design Suite, including synthesis, implementation, simulation, and debugging tools. Both paid and free (WebPACK) versions are available.
How does the -6 speed grade affect performance?
The -6 speed grade represents the fastest commercial grade for Spartan-II devices, offering maximum operating frequencies up to 263 MHz for optimal performance in time-critical applications.
Is the device RoHS compliant?
Yes, the “G” designation in FGG888 indicates lead-free, RoHS-compliant packaging, meeting current environmental regulations for electronic components.
Conclusion
The XC2S200-6FGG888C represents an exceptional choice for engineers and designers requiring high-performance programmable logic solutions. With its combination of 200,000 system gates, 5,292 logic cells, extensive memory resources, and flexible I/O capabilities, this FPGA delivers the computational power needed for demanding digital design applications across telecommunications, industrial automation, signal processing, and embedded systems.
Whether you’re developing next-generation communication protocols, implementing sophisticated control algorithms, or prototyping complex digital systems, the XC2S200-6FGG888C provides the perfect balance of performance, flexibility, and cost-effectiveness. Its mature architecture, comprehensive tool support, and proven reliability make it a trusted solution for both prototype development and volume production.
For more information about this and other high-performance programmable logic devices, explore our complete selection of Xilinx FPGA solutions designed to accelerate your digital design innovation.
