The XC2S200-6FGG879C is a powerful field-programmable gate array (FPGA) from AMD Xilinx’s renowned Spartan-II family. This advanced programmable logic device delivers exceptional performance with 200,000 system gates and 5,292 logic cells, making it an ideal solution for complex digital designs across telecommunications, industrial automation, and embedded systems applications.
As a member of the Spartan-II FPGA family, the XC2S200-6FGG879C combines high-speed performance, flexible architecture, and cost-effectiveness, providing designers with a reliable alternative to traditional ASICs without the high initial costs and lengthy development cycles.
Key Technical Specifications
| Specification |
Value |
| Part Number |
XC2S200-6FGG879C |
| Logic Cells |
5,292 |
| System Gates |
200,000 |
| CLB Array Configuration |
28 x 42 (1,176 total CLBs) |
| Speed Grade |
-6 (Commercial) |
| Core Voltage |
2.5V |
| Maximum Frequency |
263 MHz |
| Process Technology |
0.18μm CMOS |
| Package Type |
FGG879 Fine-Pitch BGA |
| Operating Temperature |
Commercial (0°C to +85°C) |
| Total Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
XC2S200-6FGG879C Architecture and Features
Advanced Logic Resources
The XC2S200-6FGG879C FPGA architecture includes:
- Configurable Logic Blocks (CLBs): 1,176 CLBs arranged in a 28×42 array provide extensive logic implementation capabilities
- Look-Up Tables (LUTs): Four-input function generators for flexible combinational logic
- Flip-Flops: Embedded storage elements within each CLB for sequential logic designs
- Distributed RAM: 75,264 bits of distributed RAM for small memory requirements
- Block SelectRAM: 56 Kbits organized in dual-port RAM blocks for efficient data storage
High-Speed Performance Capabilities
| Performance Metric |
Specification |
| System Clock Frequency |
Up to 263 MHz |
| Speed Grade |
-6 (fastest commercial grade) |
| Data Path Performance |
Optimized for high-throughput applications |
| Internal Routing |
Low-skew clock distribution network |
| Delay-Locked Loops (DLLs) |
4 DLLs for clock management |
Package and Pinout Configuration
The FGG879 package offers:
- 879-pin Fine-Pitch Ball Grid Array (BGA) for high-density mounting
- Compact footprint optimized for space-constrained designs
- High I/O count supporting complex interfacing requirements
- RoHS-compliant Pb-free packaging option (indicated by “G” in part number)
- Thermal performance suitable for commercial temperature range applications
Primary Applications for XC2S200-6FGG879C
Telecommunications Infrastructure
The XC2S200-6FGG879C excels in telecommunications applications where high-speed data processing and protocol implementation are critical:
- Digital signal processing for wireless base stations
- Network routers and switches
- Protocol converters and bridges
- Telecommunications interface modules
- Data packet processing engines
Industrial Automation and Control
Industrial applications benefit from the FPGA’s reliability and real-time processing capabilities:
- PLC (Programmable Logic Controller) implementations
- Motor control systems with precise timing
- Process control and monitoring systems
- Factory automation equipment
- Sensor interface and data acquisition
Embedded Systems Development
The XC2S200-6FGG879C serves as an excellent platform for embedded system prototyping:
- Custom processor implementations
- Hardware acceleration for embedded processors
- Peripheral controller development
- System-on-Chip (SoC) prototyping
- Real-time embedded applications
Medical Equipment Design
Medical device manufacturers utilize this FPGA for:
- Medical imaging systems (ultrasound, X-ray processing)
- Patient monitoring equipment
- Diagnostic instrument controllers
- Laboratory automation systems
- Biomedical signal processing
XC2S200-6FGG879C vs Other Spartan-II Variants
| Device |
Logic Cells |
System Gates |
CLBs |
Max User I/O |
Block RAM |
| XC2S50 |
1,728 |
50,000 |
384 |
176 |
32K |
| XC2S100 |
2,700 |
100,000 |
600 |
176 |
40K |
| XC2S150 |
3,888 |
150,000 |
864 |
260 |
48K |
| XC2S200 |
5,292 |
200,000 |
1,176 |
284 |
56K |
Programming and Development Tools
Design Software Compatibility
The XC2S200-6FGG879C is supported by industry-standard development tools:
- Xilinx ISE Design Suite: Comprehensive FPGA design environment
- Xilinx Vivado (legacy support): Modern design platform
- HDL Support: VHDL and Verilog hardware description languages
- IP Core Library: Pre-verified intellectual property blocks
- ChipScope: Built-in logic analyzer for debugging
Configuration Methods
| Configuration Method |
Description |
| JTAG Boundary Scan |
Industry-standard programming interface |
| Serial PROM |
Non-volatile configuration storage |
| Parallel Configuration |
High-speed programming option |
| SelectMAP |
Microprocessor-based configuration |
Power Consumption and Thermal Characteristics
Power Supply Requirements
| Supply |
Voltage |
Purpose |
| VCCINT |
2.5V |
Core logic power |
| VCCO |
1.5V – 3.3V |
I/O bank power (varies by bank) |
| VCCAUX |
2.5V |
DLL and auxiliary circuits |
Power Management Features
- Low static power consumption in commercial temperature range
- Dynamic power scaling based on design utilization
- Power-down modes for unused logic blocks
- Optimized routing for reduced switching power
Advantages of Using XC2S200-6FGG879C FPGA
Cost-Effective Alternative to ASICs
The XC2S200-6FGG879C offers significant advantages over traditional Application-Specific Integrated Circuits:
- Zero NRE Costs: Eliminates expensive mask sets and tooling fees
- Rapid Time-to-Market: Programmable nature enables quick design iterations
- Field Upgradability: Update functionality without hardware replacement
- Lower Risk: Avoid commitment to fixed silicon designs
- Scalability: Migrate to different FPGA densities as needs evolve
Design Flexibility and Reconfigurability
- In-System Reprogrammability: Update designs in deployed products
- Partial Reconfiguration: Modify portions of design while maintaining operation
- Multiple Design Iterations: Test and refine without fabrication delays
- Hardware/Software Co-Design: Implement custom hardware accelerators
Proven Reliability
The Spartan-II architecture has demonstrated exceptional reliability in demanding applications:
- Mature 0.18μm process technology
- Extensive qualification testing
- Wide commercial temperature range support
- Long product lifecycle support
Integration Guidelines and Best Practices
PCB Design Considerations
When designing with the XC2S200-6FGG879C, consider:
- Decoupling Capacitors: Place close to power pins for noise reduction
- Power Plane Design: Separate analog and digital power domains
- High-Speed Routing: Maintain controlled impedance for critical signals
- Thermal Management: Ensure adequate airflow and heat dissipation
- Signal Integrity: Follow recommended trace lengths and termination
Clock Distribution Strategy
- Utilize dedicated global clock networks for low skew
- Implement DLLs for clock multiplication and phase shifting
- Route critical clocks on dedicated resources
- Consider clock domain crossing carefully
Ordering Information and Support
Part Number Breakdown
XC2S200-6FGG879C decodes as:
- XC2S200: Device family and gate count (200K gates)
- -6: Speed grade (fastest commercial grade)
- FGG879: Fine-pitch BGA package with 879 pins
- C: Commercial temperature range (0°C to +85°C)
Package Dimensions
| Parameter |
Specification |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Total Pins |
879 |
| Ball Pitch |
1.0mm (typical for fine-pitch) |
| Package Profile |
Low-profile BGA design |
Why Choose Xilinx FPGA from PCBSync?
When sourcing the XC2S200-6FGG879C and other Xilinx FPGA components, partnering with a trusted distributor ensures you receive:
- Authentic Components: Factory-certified genuine parts
- Technical Support: Expert guidance for design challenges
- Competitive Pricing: Volume discounts and flexible payment terms
- Fast Delivery: Expedited shipping options available
- Quality Assurance: Rigorous inspection and testing protocols
Frequently Asked Questions
What is the difference between XC2S200-6FGG879C and XC2S200-5FGG879C?
The primary difference is the speed grade. The “-6” variant offers faster performance (higher maximum frequency) compared to the “-5” speed grade, making it suitable for more demanding high-speed applications.
Can I use XC2S200-6FGG879C for automotive applications?
The “C” designation indicates commercial temperature range (0°C to +85°C). For automotive applications requiring extended or industrial temperature ranges, consider industrial-grade variants with “I” designation.
What programming tools are compatible with this FPGA?
The XC2S200-6FGG879C is fully supported by Xilinx ISE Design Suite (versions 10.1 through 14.7) and has legacy support in newer Vivado versions for migration purposes.
Is the XC2S200-6FGG879C still in production?
The Spartan-II family is considered a mature product line. Check with authorized distributors for current availability and recommended alternatives from newer FPGA families for new designs.
Technical Resources and Documentation
For comprehensive technical information about the XC2S200-6FGG879C:
- Datasheet: DS001 Spartan-II FPGA Family Complete Data Sheet
- User Guide: UG002 Spartan-II FPGA Family User Guide
- Application Notes: Various AN documents for specific implementations
- Development Kits: Spartan-II evaluation boards and starter kits
Conclusion: XC2S200-6FGG879C for Next-Generation Designs
The XC2S200-6FGG879C represents an excellent choice for engineers seeking a balance of performance, flexibility, and cost-effectiveness in FPGA technology. With 200,000 system gates, 5,292 logic cells, and robust architecture, this Spartan-II device continues to serve critical applications across multiple industries.
Whether you’re developing telecommunications equipment, industrial control systems, medical devices, or embedded platforms, the XC2S200-6FGG879C delivers the programmable logic resources and performance capabilities needed for successful product development.
For pricing, availability, and technical support for the XC2S200-6FGG879C and other Xilinx FPGA components, contact our experienced team today to discuss your specific application requirements.
