The XC2S200-6FGG876C is a powerful field-programmable gate array (FPGA) from AMD Xilinx’s acclaimed Spartan-II family, engineered to deliver exceptional performance for complex digital design applications. This commercial-grade FPGA combines 200,000 system gates with advanced programmable logic capabilities, making it an ideal solution for engineers and designers seeking a cost-effective alternative to traditional ASICs.
Built on advanced 0.18-micron CMOS technology, the XC2S200-6FGG876C operates at a core voltage of 2.5V, offering an optimal balance between performance and power efficiency. The -6 speed grade designation ensures superior performance characteristics, making this FPGA suitable for demanding applications across telecommunications, industrial automation, medical equipment, and embedded systems.
Key Technical Specifications
Core Architecture Features
| Specification |
Value |
| Device Family |
Spartan-II |
| Part Number |
XC2S200-6FGG876C |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array Configuration |
28 x 42 (1,176 Total CLBs) |
| Speed Grade |
-6 (Commercial) |
| Core Voltage |
2.5V |
| Process Technology |
0.18µm CMOS |
| Package Type |
FGG876 Fine-Pitch BGA |
| Operating Temperature |
Commercial (0°C to 85°C) |
Memory and I/O Resources
| Feature |
Specification |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits (56,320 bits) |
| Maximum User I/O Pins |
284 |
| Global Clock Inputs |
4 dedicated pins |
| Delay-Locked Loops (DLLs) |
4 (one per corner) |
Advanced FPGA Capabilities
Programmable Logic Architecture
The XC2S200-6FGG876C features a sophisticated hierarchical routing architecture that interconnects 1,176 Configurable Logic Blocks (CLBs) arranged in a 28×42 array. Each CLB contains four logic slices, providing flexible implementation options for complex combinational and sequential logic functions. This Xilinx FPGA delivers the computational power needed for advanced digital signal processing, protocol implementation, and high-speed data processing applications.
Memory Infrastructure
With 56 Kbits of dual-port block RAM strategically distributed across the device, the XC2S200-6FGG876C provides high-speed data storage capabilities essential for buffering, FIFO implementation, and embedded memory applications. The additional 75,264 bits of distributed RAM within CLBs enable efficient small-memory implementations and look-up table configurations.
High-Speed I/O Performance
The 284 maximum user I/O pins support multiple I/O standards, including LVTTL, LVCMOS, PCI, GTL, and various differential signaling standards. Each I/O block includes programmable slew rate control, pull-up/pull-down resistors, and bidirectional capabilities, ensuring seamless integration with diverse system architectures.
Package and Physical Characteristics
FGG876 Fine-Pitch Ball Grid Array
| Package Attribute |
Details |
| Package Code |
FGG876 |
| Total Ball Count |
876 balls |
| Package Type |
Fine-Pitch BGA (FBGA) |
| Mounting Technology |
Surface Mount |
| Ball Material |
Lead-free (RoHS compliant) |
| Thermal Performance |
Enhanced heat dissipation |
The FGG876 package provides excellent thermal management characteristics and superior electrical performance for high-speed signal integrity. The fine-pitch ball grid array configuration enables high-density PCB routing while maintaining signal integrity across all I/O connections.
Application Areas and Use Cases
Telecommunications and Networking
The XC2S200-6FGG876C excels in telecommunications infrastructure, supporting protocol implementation, packet processing, channel coding, and baseband processing. Its high gate count and flexible I/O capabilities make it ideal for communication interface controllers, network routers, and data transmission equipment.
Industrial Control Systems
In industrial automation environments, this FPGA enables precise motor control, process automation, and real-time monitoring systems. The device’s reliability and reconfigurability support adaptive control algorithms and custom logic implementations for manufacturing equipment and robotics applications.
Medical Device Development
Medical equipment manufacturers leverage the XC2S200-6FGG876C for imaging systems, diagnostic equipment, patient monitoring devices, and laboratory instrumentation. The FPGA’s processing power enables real-time signal processing for critical healthcare applications.
Embedded Systems Design
From automotive electronics to consumer products, the XC2S200-6FGG876C provides the flexibility required for custom embedded solutions. Its programmability allows for rapid prototyping and field upgrades without hardware modifications.
Performance Specifications
Timing and Speed Characteristics
| Parameter |
Specification |
| Maximum Operating Frequency |
263 MHz (internal logic) |
| Speed Grade |
-6 (fastest commercial grade) |
| Propagation Delay |
Optimized for high-speed paths |
| Clock-to-Output Delay |
Low latency I/O performance |
| Setup and Hold Times |
Specified per speed grade |
Power Consumption Profile
| Power Type |
Typical Value |
| Static Power |
Low standby consumption |
| Dynamic Power |
Scales with switching activity |
| I/O Power |
Dependent on I/O standards used |
| Recommended Supply |
2.5V ±5% tolerance |
Design and Development Resources
Configuration Options
The XC2S200-6FGG876C supports multiple configuration modes including master/slave serial, master/slave parallel, and boundary scan (JTAG). This flexibility enables various system architectures and debugging methodologies throughout the development cycle.
Development Tool Support
Engineers can utilize AMD Xilinx’s comprehensive design tools including:
- Vivado Design Suite for synthesis and implementation
- ISE Design Suite (legacy support)
- ChipScope Pro for in-system debugging
- Timing analysis and constraint validation tools
- IP core libraries for common functions
Advantages Over Traditional ASICs
Cost-Effective Solution
| Benefit |
Description |
| No NRE Costs |
Eliminates non-recurring engineering expenses |
| Rapid Time-to-Market |
Accelerates product development cycles |
| Field Upgradability |
Enables firmware updates without hardware changes |
| Risk Mitigation |
Reduces development and market timing risks |
| Volume Flexibility |
Economical from prototyping through production |
Reconfigurability Benefits
Unlike mask-programmed ASICs, the XC2S200-6FGG876C allows design modifications, feature enhancements, and bug fixes through simple reconfiguration. This programmability extends product lifecycle and enables continuous improvement without costly silicon respins.
Quality and Reliability Standards
Manufacturing Excellence
The XC2S200-6FGG876C is manufactured using advanced semiconductor processes with rigorous quality control throughout production. AMD Xilinx maintains strict adherence to industry standards ensuring consistent performance and reliability.
Environmental Compliance
| Compliance |
Status |
| RoHS Directive |
Lead-free package options available |
| REACH Compliance |
Meets European chemical regulations |
| Conflict Minerals |
Responsibly sourced materials |
| Temperature Range |
Commercial: 0°C to +85°C |
Integration Considerations
PCB Design Guidelines
When implementing the XC2S200-6FGG876C in your system design, consider:
- Adequate power supply decoupling with multiple bypass capacitors
- Controlled impedance routing for high-speed signals
- Thermal management provisions for optimal junction temperature
- JTAG chain connectivity for programming and debugging
- Proper ground plane design for signal integrity
System Configuration
The FPGA requires external configuration memory (PROM or Flash) or connection to a system processor for bitstream loading. Multiple configuration modes provide flexibility for various system architectures.
Comparison with Related Devices
Spartan-II Family Positioning
| Device |
System Gates |
Logic Cells |
CLBs |
User I/O |
Block RAM |
| XC2S50 |
50,000 |
1,728 |
384 |
176 |
32 Kbits |
| XC2S100 |
100,000 |
2,700 |
600 |
176 |
40 Kbits |
| XC2S150 |
150,000 |
3,888 |
864 |
260 |
48 Kbits |
| XC2S200 |
200,000 |
5,292 |
1,176 |
284 |
56 Kbits |
The XC2S200 represents the flagship device in the Spartan-II family, offering maximum logic density and I/O resources within this product line.
Ordering Information and Availability
Part Number Breakdown
XC2S200-6FGG876C
- XC2S200: Device type (Spartan-II, 200K gates)
- -6: Speed grade (commercial, fastest)
- FGG876: Package type (876-ball Fine-Pitch BGA)
- C: Commercial temperature range (0°C to +85°C)
Package Variants
While the FGG876 package provides maximum I/O access, the XC2S200 is also available in alternative packages including FG456/FGG456 (456-ball FBGA), PQ208/PQG208 (208-pin PQFP), and FG256/FGG256 (256-ball FBGA) for different application requirements.
Technical Support and Documentation
Available Resources
Engineers implementing the XC2S200-6FGG876C can access comprehensive documentation including:
- Complete device datasheets with AC/DC specifications
- Package mechanical drawings and PCB footprints
- Application notes for specific use cases
- Reference designs and example projects
- Errata documentation and design advisories
Community and Support
AMD Xilinx provides extensive technical support through online forums, application engineering assistance, and comprehensive documentation libraries to ensure successful design implementation.
Frequently Asked Questions
Is the XC2S200-6FGG876C suitable for new designs?
The Spartan-II family represents mature technology. For new designs, consider current-generation Spartan-7 or Artix-7 families offering enhanced performance and features. However, the XC2S200 remains excellent for existing design support, upgrades, and cost-sensitive applications.
What development tools are required?
The device can be designed using Xilinx ISE Design Suite (legacy) or Vivado Design Suite. Configuration requires external programming hardware such as Platform Cable USB or compatible JTAG programmers.
What configuration memory options are compatible?
The XC2S200-6FGG876C is compatible with Xilinx Platform Flash PROMs and standard SPI Flash devices. Configuration memory size should be selected based on bitstream compression and design complexity.
Can I migrate from other Spartan-II devices?
Yes, the Spartan-II family offers pin-compatible migration paths for many package types, allowing designers to scale logic resources while maintaining PCB compatibility.
Conclusion
The XC2S200-6FGG876C delivers outstanding value for engineers requiring high-performance programmable logic in a proven, reliable platform. With 200,000 system gates, 5,292 logic cells, and 284 user I/O pins, this FPGA provides the resources necessary for sophisticated digital designs across multiple industries.
Whether you’re developing telecommunications equipment, industrial control systems, medical devices, or embedded applications, the XC2S200-6FGG876C offers the perfect combination of performance, flexibility, and cost-effectiveness. Its superior alternative to traditional ASICs eliminates NRE costs, accelerates time-to-market, and enables field upgradability throughout your product’s lifecycle.
For procurement, technical specifications, and design support for the XC2S200-6FGG876C and other Xilinx FPGA solutions, consult with authorized distributors and AMD Xilinx technical resources to ensure optimal implementation in your next-generation digital design project.
