The XC2S200-6FGG873C is a powerful field-programmable gate array (FPGA) from AMD Xilinx’s renowned Spartan-II family. This versatile programmable logic device delivers exceptional performance with 200,000 system gates, 5,292 logic cells, and advanced features that make it ideal for complex digital designs across telecommunications, industrial automation, medical devices, and consumer electronics applications.
Manufactured using advanced 0.18-micron CMOS technology, the XC2S200-6FGG873C combines high-speed operation with low power consumption, offering engineers a cost-effective solution for demanding applications requiring reconfigurable logic capabilities.
Key Features and Specifications
Core Architecture Specifications
| Feature |
Specification |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array Configuration |
28 x 42 (1,176 total CLBs) |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (56,000 bits) |
| Maximum User I/O |
284 pins |
| Technology Node |
0.18µm CMOS |
| Core Voltage |
2.5V |
| Speed Grade |
-6 (highest performance) |
Package Details
| Parameter |
Value |
| Package Type |
FGG873 – Fine-Pitch Ball Grid Array |
| Total Pins |
873 |
| Package Form |
FBGA (Fine Ball Grid Array) |
| Operating Temperature |
Commercial (0°C to +85°C) |
| RoHS Compliance |
Pb-free (G designation) |
Technical Capabilities of XC2S200-6FGG873C
Advanced Logic Resources
The XC2S200-6FGG873C features 1,176 Configurable Logic Blocks (CLBs) arranged in a 28×42 array, providing extensive logic capacity for implementing complex digital circuits. Each CLB contains multiple logic cells with look-up tables (LUTs), flip-flops, and multiplexers, enabling flexible circuit implementation.
Memory Architecture
This Spartan-II FPGA incorporates dual memory systems:
- Distributed RAM: 75,264 bits integrated within CLBs for fast, localized data storage
- Block RAM: 56K bits organized in dedicated memory blocks for efficient data buffering and processing
High-Speed Performance
The -6 speed grade designation indicates this device operates at the highest performance tier within the Spartan-II family, supporting maximum operating frequencies up to 263 MHz. This high-speed capability makes the XC2S200-6FGG873C suitable for time-critical applications requiring rapid data processing.
XC2S200-6FGG873C Applications
Telecommunications and Networking
The XC2S200-6FGG873C excels in communication systems, supporting:
- Protocol implementation for network switches and routers
- Data encoding and decoding circuits
- Channel coding and error correction
- High-speed data transmission interfaces
- Wireless communication infrastructure
Industrial Automation and Control
Engineers deploy this FPGA in industrial environments for:
- Motor control systems with precise timing requirements
- Process automation and control logic
- Sensor interfacing and data acquisition
- Programmable logic controllers (PLCs)
- Real-time monitoring systems
Medical Device Development
The reconfigurable nature and reliability of the XC2S200-6FGG873C make it valuable for:
- Medical imaging equipment signal processing
- Patient monitoring device logic circuits
- Diagnostic instrument control systems
- Laboratory equipment automation
- Portable medical device development
Consumer Electronics
Product designers utilize this FPGA for:
- Audio/video processing applications
- Gaming console peripheral controllers
- Smart home device logic
- Display controller implementations
- Interface protocol conversion
Design Advantages of Spartan-II FPGAs
Reconfigurability and Flexibility
Unlike traditional ASICs (Application-Specific Integrated Circuits), the XC2S200-6FGG873C offers in-field reprogrammability, allowing design updates without hardware replacement. This flexibility reduces development costs and enables rapid prototyping.
Cost-Effective Development
The XC2S200-6FGG873C eliminates the high non-recurring engineering (NRE) costs associated with ASIC development, making it economical for low to medium volume production runs and projects requiring design iteration.
Rapid Time-to-Market
Programmable logic devices accelerate product development cycles by eliminating lengthy ASIC fabrication processes. Engineers can implement, test, and modify designs quickly using industry-standard development tools.
Development Tools and Support
Xilinx ISE Design Suite
The XC2S200-6FGG873C is supported by Xilinx ISE (Integrated Software Environment), providing comprehensive tools for:
- HDL synthesis (VHDL and Verilog)
- Design implementation and place-and-route
- Timing analysis and optimization
- Device programming and configuration
- Simulation and verification
For comprehensive resources on Xilinx FPGA development and programming, engineers can access extensive documentation, application notes, and design examples.
Programming and Configuration
| Configuration Method |
Description |
| JTAG Programming |
Standard boundary scan interface for device programming |
| Serial Configuration |
SPI-compatible serial PROM support |
| SelectMAP |
Parallel configuration interface for fast programming |
| Slave Serial |
Compact serial configuration option |
Pin Configuration and I/O Features
Flexible I/O Standards
The 284 user I/O pins on the XC2S200-6FGG873C support multiple voltage standards:
- LVTTL (Low Voltage TTL)
- LVCMOS (Low Voltage CMOS) at various levels
- PCI 33MHz and 66MHz compatible
- GTL and GTL+ signaling
- SSTL and HSTL standards
I/O Capabilities Table
| I/O Feature |
Specification |
| Maximum User I/Os |
284 |
| I/O Voltage Range |
1.5V to 3.3V |
| Output Drive Strength |
Programmable (2mA to 24mA) |
| Input Threshold |
Programmable |
| Slew Rate Control |
Fast or slow options |
Power Consumption and Thermal Management
Power Requirements
| Power Parameter |
Typical Value |
| Core Voltage (VCCINT) |
2.5V ±5% |
| I/O Voltage (VCCO) |
1.5V to 3.3V (selectable) |
| Static Power |
Low standby current |
| Dynamic Power |
Design and frequency dependent |
Thermal Characteristics
The commercial temperature grade (-6C suffix) operates reliably from 0°C to +85°C ambient temperature. Proper thermal management through adequate airflow or heat sinking ensures optimal performance in demanding environments.
Comparison with Related Spartan-II Devices
| Device |
System Gates |
Logic Cells |
CLBs |
Block RAM |
Max I/O |
| XC2S50 |
50,000 |
1,728 |
384 |
32K |
176 |
| XC2S100 |
100,000 |
2,700 |
600 |
40K |
176 |
| XC2S150 |
150,000 |
3,888 |
864 |
48K |
260 |
| XC2S200 |
200,000 |
5,292 |
1,176 |
56K |
284 |
Design Considerations and Best Practices
Successful Implementation Tips
- Resource Planning: Utilize logic synthesis tools to estimate resource utilization before implementation
- Timing Closure: Employ timing constraints and optimization techniques to meet performance requirements
- Power Optimization: Implement clock gating and power management strategies for low-power designs
- I/O Planning: Carefully allocate I/O pins considering signal integrity and PCB routing constraints
- Verification: Conduct thorough simulation and hardware testing to validate functionality
Common Design Challenges
Engineers should address these considerations when working with the XC2S200-6FGG873C:
- Clock Distribution: Utilize dedicated clock resources (DLLs) for optimal clock distribution
- Signal Integrity: Implement proper termination and impedance matching for high-speed signals
- Configuration Reliability: Ensure robust configuration storage and error detection mechanisms
- Thermal Management: Monitor junction temperature in high-utilization designs
Ordering Information and Part Number Breakdown
Understanding the Part Number
XC2S200-6FGG873C breaks down as follows:
- XC2S200: Device family (Spartan-II) and gate count (200K)
- -6: Speed grade (highest performance)
- FGG873: Package type (873-ball Fine-pitch BGA with Pb-free)
- C: Commercial temperature range (0°C to +85°C)
Package Availability
The XC2S200 is available in multiple package options to suit various design requirements:
- FG(G)456: 456-ball FBGA
- PQ(G)208: 208-pin PQFP
- FG(G)256: 256-ball FBGA
- FGG873: 873-ball FBGA (this variant)
Quality and Reliability Standards
Manufacturing Excellence
AMD Xilinx Spartan-II FPGAs undergo rigorous quality control processes, including:
- Comprehensive functional testing at multiple voltage and temperature points
- Burn-in testing for enhanced reliability
- Quality certifications meeting international standards
- Environmental compliance (RoHS, REACH)
Long-Term Support
The Spartan-II family maintains extensive documentation and community support, ensuring engineers have access to:
- Detailed datasheets and technical reference manuals
- Application notes and design guides
- Reference designs and IP cores
- Active user forums and technical support
Conclusion: Why Choose XC2S200-6FGG873C
The XC2S200-6FGG873C represents an excellent choice for engineers requiring high-performance programmable logic with extensive I/O capabilities. Its combination of 200,000 system gates, 5,292 logic cells, 284 user I/O pins, and the large 873-ball package make it ideal for complex, I/O-intensive applications.
Whether developing telecommunications equipment, industrial control systems, medical devices, or advanced consumer electronics, the XC2S200-6FGG873C delivers the flexibility, performance, and reliability needed for successful product development. The reconfigurable nature of this FPGA, combined with comprehensive development tool support, enables rapid prototyping and cost-effective production deployment.
For engineers seeking a proven, reliable FPGA solution with extensive logic resources and maximum I/O flexibility, the XC2S200-6FGG873C from AMD Xilinx’s Spartan-II family continues to serve as a versatile platform for innovative digital design.
