The XC2S200-6FGG871C is a member of the renowned Spartan-II FPGA family from AMD Xilinx, representing a powerful solution for designers seeking cost-effective programmable logic with robust performance capabilities. This field-programmable gate array delivers 200,000 system gates and operates with a 2.5V core voltage, making it ideal for applications ranging from telecommunications to industrial automation.
As part of the Spartan-II series, this FPGA provides engineers with a flexible platform that eliminates the lengthy development cycles and high initial costs associated with traditional ASICs. The programmable nature of this device enables field upgrades without hardware replacement, offering unprecedented design flexibility.
Key Technical Specifications
Core Features and Performance Metrics
| Specification |
Value |
| System Gates |
200,000 gates |
| Logic Cells |
5,292 logic cells |
| CLB Array Configuration |
28 x 42 (1,176 total CLBs) |
| Speed Grade |
-6 (high performance) |
| Operating Voltage |
2.5V core (VCCINT) |
| Process Technology |
0.18μm CMOS |
| Maximum Frequency |
Up to 263 MHz |
| Temperature Range |
Commercial (0°C to 85°C) |
Memory Architecture
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits (56,576 bits) |
| Total Embedded Memory |
131,840 bits |
The dual-memory architecture provides flexibility for buffering, data processing, and temporary storage within complex digital designs.
Package Configuration: FGG871 Fine-Pitch BGA
Package Specifications
| Parameter |
Specification |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Pin Count |
871 balls |
| Package Code |
FGG871 |
| Ball Pitch |
1.0mm typical |
| RoHS Compliance |
Yes (lead-free, indicated by “G”) |
| Mounting Type |
Surface Mount Technology (SMT) |
The FGG871 package features lead-free (Pb-free) construction with high-quality SnAgCu solder balls, ensuring environmental compliance and reliable solder joint formation during reflow assembly processes.
Architecture and Logic Resources
Configurable Logic Block (CLB) Structure
The XC2S200-6FGG871C features 1,176 CLBs arranged in a 28 x 42 array, providing extensive logic implementation capabilities. Each CLB contains:
- Look-Up Tables (LUTs) for combinational logic
- Flip-flops for sequential logic operations
- Multiplexers for data routing
- Fast carry logic for arithmetic operations
Input/Output Capabilities
| I/O Feature |
Specification |
| Maximum User I/O |
284 pins |
| I/O Standards Support |
Multiple voltage standards |
| Global Clock Inputs |
4 dedicated clock pins |
| DLL Resources |
4 Delay-Locked Loops |
The device supports various I/O standards, enabling seamless integration with diverse system architectures and communication protocols.
Applications and Use Cases
Primary Application Domains
The XC2S200-6FGG871C excels in numerous industrial and commercial applications:
- Communication Systems: Protocol implementation, data encoding/decoding, network packet processing
- Digital Signal Processing: Audio/video processing, filtering algorithms, real-time data analysis
- Industrial Control: Motor control, process automation, sensor interface systems
- Medical Equipment: Diagnostic imaging, patient monitoring, laboratory instrumentation
- Consumer Electronics: Set-top boxes, gaming peripherals, multimedia processing
- Automotive Systems: Advanced driver assistance, infotainment systems, control modules
Performance Advantages
Why Choose XC2S200-6FGG871C?
Speed Grade -6 Benefits: The -6 speed grade represents the fastest option in the commercial temperature range, delivering optimal performance for time-critical applications.
Cost-Effective Alternative to ASICs: Unlike mask-programmed ASICs, this FPGA eliminates:
- High non-recurring engineering (NRE) costs
- Extended development timelines (often 6-12 months)
- Risk of design errors becoming permanent
- Inability to update designs post-manufacturing
Field Reconfigurability: Design updates can be implemented through simple reprogramming, allowing for:
- Bug fixes without hardware replacement
- Feature additions after deployment
- Protocol updates as standards evolve
- Product customization for different markets
Design and Implementation Considerations
Power Management
| Power Parameter |
Typical Value |
| Core Voltage (VCCINT) |
2.5V ±5% |
| I/O Voltage (VCCO) |
1.5V to 3.3V (bank dependent) |
| Quiescent Power |
Low power consumption in standby |
| Dynamic Power |
Proportional to switching frequency |
Thermal Characteristics
The 871-ball FBGA package provides excellent thermal dissipation through its ball grid array structure, enabling reliable operation in demanding thermal environments when proper PCB thermal management is implemented.
Development and Programming
Configuration Options
The XC2S200-6FGG871C supports multiple configuration modes:
- Master Serial Mode: FPGA controls configuration from external PROM
- Slave Serial Mode: External processor manages configuration
- Boundary Scan (JTAG): IEEE 1149.1 compliant for programming and testing
- SelectMAP Mode: Parallel configuration for rapid loading
Design Tools and Software
Xilinx ISE Design Suite provides comprehensive development support including:
- Synthesis and implementation tools
- Timing analysis and constraint management
- Simulation and verification capabilities
- IP core library access
For modern development workflows, consider exploring Xilinx FPGA resources and documentation.
Quality and Reliability
Manufacturing Standards
| Quality Metric |
Specification |
| Package Moisture Sensitivity |
MSL 3 typical |
| ESD Protection |
Human Body Model compliant |
| Operating Life |
Designed for 10+ years |
| Assembly Process |
Lead-free compatible |
Testing and Validation
All devices undergo rigorous testing including:
- Functional testing at speed
- Boundary scan testing
- Thermal cycling verification
- Quality assurance sampling
Ordering Information and Part Number Breakdown
XC2S200-6FGG871C decodes as follows:
- XC: Xilinx commercial product
- 2S: Spartan-II family
- 200: 200,000 system gates
- -6: Speed grade (fastest commercial grade)
- FGG: Fine-pitch BGA package, lead-free
- 871: 871-ball count
- C: Commercial temperature range (0°C to 85°C)
PCB Design Recommendations
Layout Guidelines
When implementing the XC2S200-6FGG871C in your design:
- Power Distribution: Use dedicated power planes for VCCINT and VCCO
- Decoupling: Place 0.1μF and 0.01μF capacitors near each power pin cluster
- Thermal Management: Ensure adequate airflow or heat sinking
- Signal Integrity: Maintain controlled impedance for high-speed signals
- Via Planning: Use NSMD (non-solder mask defined) pads for BGA connections
Recommended PCB Stackup
For optimal signal integrity and routability with the 871-ball package:
- Minimum 8-layer PCB recommended
- Signal-Ground-Power-Signal core structure
- 1.0mm ball pitch requires careful trace routing
- Via-in-pad may be beneficial for high-density designs
Competitive Advantages
Spartan-II Family Strengths
Compared to competing FPGA solutions, the Spartan-II architecture offers:
- Proven Reliability: Mature technology with extensive field deployment
- Comprehensive IP Support: Access to verified IP cores and reference designs
- Industry Standard Tools: Xilinx ISE provides robust development environment
- Migration Path: Pin compatibility within Spartan-II family for easy upgrades
- Supply Chain Stability: Widely available through authorized distributors
Technical Support and Resources
Getting Started
Engineers implementing the XC2S200-6FGG871C can access:
- Comprehensive datasheets and application notes
- Reference designs and evaluation boards
- Technical support forums and communities
- Training materials and webinars
- Third-party IP and development tools
Frequently Asked Questions
What makes the -6 speed grade significant?
The -6 speed grade represents the highest performance option for commercial temperature range Spartan-II devices, offering faster propagation delays and higher maximum operating frequencies compared to -5 or -4 grades.
Can this FPGA be reconfigured in the field?
Yes, the XC2S200-6FGG871C supports in-system programming, allowing design updates without removing the device from the circuit board.
What development tools are required?
Xilinx ISE Design Suite (or compatible tools) is required for design entry, synthesis, implementation, and bitstream generation.
Is this device suitable for automotive applications?
While the “C” commercial temperature grade is specified, extended temperature variants may be available. Consult with your supplier for automotive-qualified versions if required.
What package alternatives exist for the XC2S200?
The XC2S200 is available in various packages including FG456, FG256, and PQ208, offering different pin counts and physical sizes to suit diverse PCB requirements.
Summary and Conclusion
The XC2S200-6FGG871C represents a powerful, versatile FPGA solution combining 200,000 system gates with high-speed performance in a comprehensive 871-ball package. Its extensive logic resources, dual-memory architecture, and flexible I/O capabilities make it suitable for applications across telecommunications, industrial automation, consumer electronics, and medical instrumentation.
With the programmability advantage over traditional ASICs, designers gain the flexibility to iterate designs rapidly, implement field updates, and reduce time-to-market while maintaining cost effectiveness. The mature Spartan-II architecture, backed by comprehensive development tools and extensive community support, ensures successful project implementation.
For engineers seeking reliable, high-performance programmable logic with proven field deployment, the XC2S200-6FGG871C delivers exceptional value. Whether implementing complex digital signal processing, communications protocols, or control systems, this FPGA provides the resources and performance necessary for demanding modern applications.
