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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG866C: High-Performance Spartan-II FPGA for Industrial and Embedded Applications

Product Details

The XC2S200-6FGG866C is a powerful field-programmable gate array (FPGA) from the renowned Spartan-II family by AMD Xilinx. Designed for high-performance digital signal processing and embedded system applications, this FPGA delivers exceptional flexibility, reliability, and cost-effectiveness. With its 866-pin Fine-Pitch Ball Grid Array (FBGA) package and -6 speed grade, the XC2S200-6FGG866C represents an optimal solution for engineers seeking advanced programmable logic capabilities in space-constrained applications.

As a member of the Xilinx FPGA product line, the XC2S200-6FGG866C combines robust architectural features with proven technology to deliver superior performance across telecommunications, industrial automation, medical imaging, and aerospace applications.

Key Features and Specifications

Core Architecture Specifications

The XC2S200-6FGG866C is built on advanced 0.18-micron process technology, offering an impressive balance between performance, power consumption, and logic density. Here are the fundamental specifications:

Feature Specification
Logic Cells 5,292 cells
System Gates 200,000 gates
CLB Array Configuration 28 x 42 (1,176 total CLBs)
Maximum User I/O 284 pins
Distributed RAM 75,264 bits
Block RAM 56 Kbits
Speed Grade -6 (Commercial temperature)
Core Voltage 2.5V
Process Technology 0.18μm CMOS
Package Type 866-Pin Fine-Pitch BGA (FGG866)
Operating Frequency Up to 263 MHz

Advanced Memory Architecture

The XC2S200-6FGG866C FPGA features a hierarchical memory structure that provides both distributed and block RAM resources:

  • Distributed RAM: 75,264 bits configured as SelectRAM, offering 16 bits per Look-Up Table (LUT)
  • Block RAM: 56 Kbits organized in configurable 4K-bit blocks for efficient data buffering and storage
  • Dual-Port Capability: Block RAM supports simultaneous read/write operations for enhanced throughput

Package and Pinout Configuration

Package Attribute Details
Package Type Fine-Pitch Ball Grid Array (FBGA)
Total Pins 866 pins
I/O Standards Support 16 selectable standards including LVTTL, LVCMOS, SSTL, HSTL
Delay-Locked Loops (DLLs) 4 DLLs for clock management
Global Clock Inputs 4 dedicated global clock/user input pins
Lead-Free Option Available (indicated by ‘G’ in part number)

Technical Capabilities and Performance

Clock Management and Timing

The XC2S200-6FGG866C integrates four Delay-Locked Loops (DLLs) positioned at each corner of the die, providing advanced clock management capabilities:

  • Clock Distribution: Minimized clock skew across the entire device
  • Phase Shifting: Programmable clock phase adjustment
  • Clock Multiplication/Division: Flexible frequency synthesis
  • Jitter Reduction: Enhanced signal integrity for high-speed interfaces

I/O Capabilities and Standards

With 284 maximum available user I/O pins, the XC2S200-6FGG866C supports a comprehensive range of I/O standards:

I/O Standard Category Supported Standards
Single-Ended LVTTL, LVCMOS (3.3V, 2.5V, 1.8V, 1.5V)
Differential LVDS, LVPECL, Bus LVDS
Memory Interfaces SSTL-3 Class I/II, SSTL-2 Class I/II, HSTL Class I/III/IV
High-Performance GTL, GTL+, CTT

Configurable Logic Blocks (CLBs)

Each CLB in the XC2S200-6FGG866C contains:

  • 4 Logic Slices per CLB
  • 2 Look-Up Tables (LUTs) per slice
  • 2 Storage Elements (flip-flops or latches) per slice
  • Fast Carry Logic for arithmetic operations
  • Distributed SelectRAM capability

Application Areas and Use Cases

Telecommunications and Networking

The XC2S200-6FGG866C excels in telecommunications infrastructure with applications including:

  • Protocol Processing: Implementation of TCP/IP, Ethernet, and custom communication protocols
  • Base Station Equipment: Signal processing for wireless communication systems
  • Network Routing: High-speed packet switching and routing logic
  • Software-Defined Radio (SDR): Flexible RF signal processing chains

Industrial Automation and Control

Manufacturing and industrial systems benefit from the XC2S200-6FGG866C’s reliability:

  • Motor Control Systems: PWM generation and closed-loop control algorithms
  • PLC Replacement: Flexible logic for programmable logic controllers
  • Process Monitoring: Real-time sensor data acquisition and processing
  • Machine Vision: Image preprocessing and pattern recognition

Medical Equipment and Instrumentation

Healthcare applications leverage the FPGA’s processing power and reconfigurability:

  • Medical Imaging: CT scan image reconstruction and MRI signal processing
  • Patient Monitoring: Real-time physiological signal analysis
  • Diagnostic Equipment: Ultrasound beamforming and signal enhancement
  • Laboratory Instruments: High-speed data acquisition and analysis

Aerospace and Defense Systems

Mission-critical applications rely on the XC2S200-6FGG866C’s proven architecture:

  • Avionics Systems: Flight control and navigation processing
  • Radar Signal Processing: Real-time target detection and tracking
  • Secure Communications: Encryption and signal scrambling
  • Satellite Systems: Payload data processing and telemetry

Performance Comparison Table

Parameter XC2S200-6FGG866C Typical Competitor
Logic Cells 5,292 5,000
System Gates 200,000 180,000
Block RAM 56 Kbits 48 Kbits
Maximum I/O 284 256
DLLs 4 2
Speed Grade Performance 263 MHz 250 MHz
Power Efficiency Optimized Standard
Package Pin Count 866 676

Design Advantages and Benefits

Reprogrammability and Flexibility

Unlike traditional ASICs, the XC2S200-6FGG866C offers:

  • Unlimited Reprogrammability: Update designs in the field without hardware replacement
  • No NRE Costs: Eliminate mask costs associated with ASIC development
  • Rapid Prototyping: Accelerate time-to-market with iterative design refinement
  • Future-Proof Designs: Adapt to changing requirements and standards

Cost-Effective ASIC Alternative

The XC2S200-6FGG866C provides significant economic advantages:

  • Lower Initial Investment: No expensive mask tooling or minimum order quantities
  • Reduced Development Risk: Test and validate before committing to production
  • Shorter Development Cycles: Weeks instead of months for design iterations
  • Inventory Flexibility: Single device supports multiple product variants

Proven Virtex-Based Architecture

Based on the successful Virtex FPGA architecture, the Spartan-II family inherits:

  • Mature Design Tools: Comprehensive support through ISE Design Suite
  • Extensive IP Library: Pre-verified cores for common functions
  • Established Methodology: Well-documented design flows and best practices
  • Long-Term Availability: Sustained support for legacy applications

Development Tools and Software Support

Design Entry and Synthesis

Tool/Software Capability
ISE Design Suite Complete FPGA design environment
Xilinx Platform Studio Embedded processor system integration
ChipScope Pro On-chip logic analyzer for debugging
ModelSim/Vivado Simulator HDL simulation and verification

Programming and Configuration

The XC2S200-6FGG866C supports multiple configuration modes:

  • JTAG Configuration: Boundary-scan programming for development
  • Master Serial Mode: Boot from external SPI Flash
  • Slave Serial Mode: Configuration from external controller
  • SelectMAP Mode: High-speed parallel configuration

Power Consumption and Thermal Characteristics

Voltage Requirements

Supply Rail Voltage Purpose
VCCINT 2.5V Core logic power
VCCAUX 2.5V or 3.3V Auxiliary functions and DLLs
VCCO 1.5V to 3.3V I/O bank supplies (per bank)

Power Optimization Features

  • Standby Mode: Reduced power consumption when inactive
  • Selective I/O Standards: Choose lower-voltage standards to minimize power
  • Clock Gating: Disable unused clock networks
  • Power Estimation Tools: XPower analyzer for accurate power budgeting

Quality and Reliability

Temperature Ranges

Grade Temperature Range Application
Commercial (C) 0°C to +85°C Standard industrial applications
Industrial (I) -40°C to +100°C Extended temperature environments

Compliance and Standards

The XC2S200-6FGG866C meets stringent quality standards:

  • ISO 9001 Certified Manufacturing
  • RoHS Compliant (lead-free packaging option)
  • JEDEC Standards Conformance
  • Automotive-Grade Testing (for qualified variants)

Ordering Information and Part Number Breakdown

Part Number Decoding: XC2S200-6FGG866C

Position Code Meaning
XC Device Type Xilinx Commercial FPGA
2S Family Spartan-II Generation
200 Density 200,000 system gates
-6 Speed Grade Fastest commercial grade
FGG Package Fine-Pitch BGA (lead-free)
866 Pin Count 866-pin package
C Temperature Commercial (0°C to +85°C)

Migration and Compatibility

Pin-Compatible Devices

The FGG866 package allows easy migration between different Spartan-II densities, facilitating design scalability and product line flexibility.

Virtex Family Compatibility

Designs can be migrated to higher-performance Virtex FPGAs with minimal modification, providing an upgrade path for demanding applications.

Technical Support and Resources

Documentation Available

  • Data Sheet: Complete electrical and timing specifications
  • User Guide: Detailed architectural description and design guidelines
  • Application Notes: Industry-specific implementation examples
  • Reference Designs: Proven starter designs for common applications

Community and Ecosystem

Access to comprehensive support resources:

  • Xilinx Forums: Peer-to-peer technical discussions
  • Design Hub: Downloadable reference designs and IP cores
  • Training Materials: Video tutorials and online courses
  • FAE Support: Direct access to field application engineers

Frequently Asked Questions

What is the main difference between speed grades?

The XC2S200-6FGG866C’s -6 speed grade represents the fastest commercial option, providing maximum performance for time-critical applications. Lower speed grades (-5, -4) offer the same functionality at reduced operating frequencies and typically lower cost.

Can I upgrade from a smaller Spartan-II device?

Yes, the Spartan-II family offers pin-compatible migration paths within the same package type, allowing seamless upgrades to higher-density devices as design requirements grow.

What configuration memory is required?

Configuration memory size depends on the chosen configuration mode. For serial configuration, a minimum 1.7 Mbit configuration PROM is required for the XC2S200 device.

Is the XC2S200-6FGG866C suitable for new designs?

While newer FPGA families offer enhanced features and higher performance, the XC2S200-6FGG866C remains an excellent choice for cost-sensitive applications requiring proven, mature technology with established supply chains.

Conclusion

The XC2S200-6FGG866C FPGA delivers an exceptional combination of performance, flexibility, and value for embedded system designers. With 200,000 system gates, 5,292 logic cells, and 56 Kbits of block RAM packaged in an 866-pin FBGA, this device provides ample resources for complex digital designs. The -6 speed grade ensures maximum performance for demanding applications across telecommunications, industrial control, medical instrumentation, and aerospace systems.

As a proven alternative to custom ASICs, the XC2S200-6FGG866C eliminates costly NRE expenses and lengthy development cycles while offering unlimited reprogrammability and field upgrades. Backed by comprehensive development tools, extensive documentation, and AMD Xilinx’s global support network, this Spartan-II FPGA represents a reliable, cost-effective solution for current and future programmable logic applications.

For engineers seeking a powerful, flexible FPGA with substantial I/O capability and proven reliability, the XC2S200-6FGG866C stands as an optimal choice in the Spartan-II family, delivering professional-grade performance at an exceptional price point.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.