The XC2S200-6FGG854C is a powerful member of the Spartan-II FPGA family, manufactured by Xilinx (now part of AMD). This advanced field-programmable gate array delivers exceptional performance for demanding digital design applications, combining cost-effectiveness with robust programmable logic capabilities. Featuring 200,000 system gates and housed in an 854-ball Fine-Pitch Ball Grid Array (FBGA) package, this FPGA provides designers with the flexibility and resources needed for complex embedded systems, telecommunications, industrial automation, and digital signal processing projects.
Key Technical Specifications
Core Performance Characteristics
| Specification |
Value |
| Device Family |
Spartan-II |
| Part Number |
XC2S200-6FGG854C |
| Logic Cells |
5,292 |
| System Gates |
200,000 (Logic and RAM) |
| CLB Array Configuration |
28 x 42 |
| Total CLBs |
1,176 |
| Speed Grade |
-6 (Fastest commercial grade) |
| Package Type |
FGG854 (854-ball Fine-Pitch BGA) |
| Operating Temperature |
Commercial (0°C to +85°C) |
Memory and I/O Resources
| Resource Type |
Capacity |
| Maximum User I/O |
284 pins |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits |
| Global Clock Networks |
4 dedicated low-skew networks |
| DLL (Delay-Locked Loops) |
4 units |
Advanced Features and Capabilities
Programmable Logic Architecture
The XC2S200-6FGG854C incorporates Xilinx’s second-generation ASIC replacement technology, built on a proven 0.18-micron CMOS process. This Xilinx FPGA delivers high-density programmable logic with unlimited reprogrammability, making it ideal for iterative design processes and field upgrades.
SelectRAM™ Hierarchical Memory System
- Distributed RAM: 16 bits per Look-Up Table (LUT) for efficient small memory implementations
- Block RAM: Configurable 4K-bit blocks totaling 56K bits for larger data storage requirements
- Dual-port capability: Enables simultaneous read/write operations for enhanced throughput
High-Speed Interface Support
The XC2S200-6FGG854C supports multiple industry-standard I/O interfaces:
| Interface Standard |
Voltage Level |
Application |
| LVTTL |
3.3V |
General-purpose logic |
| LVCMOS |
2.5V, 3.3V |
Low-voltage CMOS |
| PCI 33/66 |
3.3V |
Peripheral Component Interconnect |
| LVDS |
Differential |
High-speed serial data |
| SSTL |
2.5V |
Memory interfaces |
| GTL/GTL+ |
Terminated |
Backplane applications |
Performance Specifications
Speed Grade -6 Performance Metrics
The -6 speed grade represents the fastest commercially available option for the XC2S200 device, offering:
- Maximum operating frequency: 263 MHz (internal logic)
- Minimum clock-to-out delay: Industry-leading propagation times
- Setup and hold times: Optimized for high-speed synchronous designs
- Fast carry chain: Dedicated logic for high-performance arithmetic operations
Power Consumption Profile
| Operating Mode |
Typical Power |
Maximum Power |
| Core Voltage (VCCINT) |
2.5V |
2.5V |
| I/O Voltage (VCCO) |
1.5V – 3.3V |
Varies by bank |
| Static Power |
Low standby |
Minimal leakage |
| Dynamic Power |
Design-dependent |
Activity-based |
Package Information: FGG854 Ball Grid Array
Physical Characteristics
The FGG854 package provides an optimal balance between I/O density and thermal performance:
- Total ball count: 854 balls
- Ball pitch: Fine-pitch for high-density routing
- Package dimensions: Optimized for PCB layout efficiency
- Thermal characteristics: Enhanced heat dissipation for reliable operation
- RoHS compliance: Lead-free (Pb-free) construction with “G” designation
Pin Configuration Benefits
| Feature |
Advantage |
| High I/O count |
Up to 284 user-configurable pins |
| Ball grid layout |
Reduced inductance and improved signal integrity |
| Power/ground distribution |
Multiple VCCINT and GND balls for low impedance |
| Corner DLL placement |
Optimal clock distribution topology |
Design Tools and Development Support
ISE Design Suite Integration
The XC2S200-6FGG854C is fully supported by Xilinx ISE (Integrated Software Environment) development system, providing:
- Automatic synthesis: Transforms HDL code into optimized netlists
- Place and route: Fully automated implementation flow
- Timing analysis: Comprehensive static timing verification
- Power estimation: Accurate power consumption modeling
- Simulation support: Integration with industry-standard simulators
Hardware Description Language Support
| HDL Type |
Support Level |
| VHDL |
Full synthesis and simulation |
| Verilog |
Complete language coverage |
| Schematic capture |
Legacy design migration |
| IP cores |
Xilinx and third-party libraries |
Target Applications and Use Cases
Industrial Automation Systems
The XC2S200-6FGG854C excels in industrial control applications:
- Motor control and drive systems
- Programmable logic controllers (PLCs)
- Factory automation and robotics
- Sensor interface and data acquisition
- Real-time monitoring and diagnostics
Telecommunications Infrastructure
Communications applications benefit from high-speed I/O and flexible architecture:
- Protocol conversion and bridging
- Digital signal processing blocks
- Data packet routing and switching
- Wireless base station components
- Network interface controllers
Consumer Electronics
Cost-effective implementation for volume production:
- Video processing and display controllers
- Audio/video encoding and decoding
- Gaming console peripherals
- Set-top box functionality
- Digital camera image processing
Automotive Electronics
Reliable operation in harsh environments:
- Engine control units (ECU)
- Advanced driver assistance systems (ADAS)
- Infotainment system controllers
- Body electronics management
- Diagnostic interfaces
Configuration and Programming Options
Configuration Modes
| Mode |
Description |
Data Width |
CCLK Direction |
| Master Serial |
FPGA controls configuration |
1-bit |
Output |
| Slave Serial |
External controller |
1-bit |
Input |
| Slave Parallel |
Fast parallel loading |
8-bit |
Input |
| Boundary Scan (JTAG) |
IEEE 1149.1 compliant |
1-bit |
N/A |
Configuration Memory Requirements
The XC2S200 requires approximately 1,335,840 configuration bits, which can be stored in:
- External Platform Flash PROMs
- System flash memory
- Microcontroller-based configuration
- JTAG programming cable (development)
Design Implementation Best Practices
Clock Management Strategies
The four integrated Delay-Locked Loops (DLLs) provide advanced clock management:
- Clock deskewing: Eliminates clock distribution delays
- Frequency synthesis: Generates multiple clock domains
- Phase shifting: Precise timing alignment
- Duty cycle correction: 50% clock duty cycle guarantee
Resource Optimization Techniques
| Design Aspect |
Optimization Strategy |
| Logic utilization |
Balance between LUTs and registers |
| RAM allocation |
Distributed vs. block RAM selection |
| I/O planning |
Bank voltage assignment and placement |
| Timing closure |
Constraint-driven implementation |
| Power reduction |
Clock gating and unused logic trimming |
Quality and Reliability Standards
Manufacturing Quality
Xilinx Spartan-II devices undergo rigorous quality assurance:
- Wafer fabrication: Advanced 0.18μm CMOS process
- Testing protocols: 100% electrical parametric testing
- Burn-in procedures: Extended reliability verification
- Quality certifications: ISO 9001 compliant manufacturing
Environmental Compliance
| Standard |
Compliance Status |
| RoHS |
Fully compliant (Pb-free) |
| REACH |
Substance restriction adherence |
| Moisture sensitivity |
MSL rated packaging |
| Temperature cycling |
Industrial-grade qualification |
Competitive Advantages
Why Choose XC2S200-6FGG854C?
- Highest speed grade: The -6 speed grade offers maximum performance for time-critical applications
- Extensive I/O capability: 284 user I/Os accommodate complex system interfaces
- Large package option: 854-ball BGA provides maximum pin-out flexibility
- Proven architecture: Mature Spartan-II platform with extensive design heritage
- Cost-effective: Optimal price-performance ratio for high-volume production
- Development ecosystem: Comprehensive tool support and IP library
Migration and Compatibility
Family Footprint Compatibility
The Spartan-II family offers pin-compatible migration paths:
- Scale down to XC2S150 in same package
- Scale up to larger Spartan families with minimal redesign
- Maintain consistent I/O banking across devices
- Preserve power supply architecture
Upgrade Path Considerations
| Migration Target |
Benefit |
| Spartan-3 series |
Enhanced features, lower power |
| Spartan-6 family |
6-input LUTs, DSP blocks |
| Artix-7 devices |
28nm technology, gigabit transceivers |
Ordering Information and Availability
Part Number Breakdown
XC2S200-6FGG854C decoding:
- XC2S200: Device type (Spartan-II, 200K gates)
- -6: Speed grade (fastest commercial)
- FG: Fine-pitch Ball Grid Array package type
- G: Lead-free (Pb-free) designation
- 854: Total ball count
- C: Commercial temperature range (0°C to +85°C)
Package Alternatives for XC2S200
While the FGG854 offers maximum I/O, other packages are available:
- FGG456: 456-ball BGA (reduced I/O count)
- FGG256: 256-ball BGA (compact footprint)
- PQG208: 208-pin PQFP (through-hole friendly)
Technical Support and Resources
Documentation Library
Engineers implementing the XC2S200-6FGG854C have access to:
- Comprehensive product datasheet (DS001)
- User guides and application notes
- PCB layout guidelines
- Power supply design recommendations
- Thermal management specifications
Online Design Resources
- Xilinx Answer Database for common design questions
- Reference designs and example projects
- Training videos and webinars
- Community forums and knowledge base
- FAE (Field Application Engineer) support
Conclusion: Maximizing XC2S200-6FGG854C Performance
The XC2S200-6FGG854C represents an excellent choice for designers requiring high-performance programmable logic in a feature-rich package. With its combination of substantial logic resources, extensive I/O capabilities, advanced clock management, and proven reliability, this FPGA enables rapid development of sophisticated digital systems across diverse application domains.
Whether you’re developing industrial control systems, telecommunications equipment, consumer electronics, or automotive solutions, the XC2S200-6FGG854C provides the flexibility, performance, and cost-effectiveness needed for successful product deployment. The mature development ecosystem, comprehensive documentation, and family migration options ensure long-term design sustainability and future scalability.
For more information about Xilinx FPGA solutions and to explore the complete Spartan-II family portfolio, visit Xilinx FPGA resources and connect with authorized distributors for pricing, availability, and technical consultation.
