The XC2S200-6FGG848C is a powerful Field Programmable Gate Array (FPGA) from the renowned Spartan-II family by AMD Xilinx. This advanced programmable logic device delivers exceptional performance with 200,000 system gates, making it an ideal solution for high-speed digital signal processing, industrial automation, telecommunications, and embedded systems applications.
Overview of XC2S200-6FGG848C FPGA
The XC2S200-6FGG848C represents the pinnacle of the Spartan-II family, offering superior computational capabilities in a robust 848-ball Fine-Pitch Ball Grid Array (FBGA) package. This FPGA combines high logic density, flexible I/O options, and reliable performance, making it a cost-effective alternative to traditional ASIC designs.
Key Features of XC2S200-6FGG848C
- 200,000 System Gates: Extensive logic capacity for complex digital designs
- 5,292 Logic Cells: High-density programmable resources
- 848-Pin FGG Package: Maximum I/O availability for demanding applications
- -6 Speed Grade: Optimized for high-performance operations
- 2.5V Core Voltage: Low-power operation with excellent reliability
- Commercial Temperature Range: Stable performance from 0°C to 85°C
- 0.18µm CMOS Technology: Advanced semiconductor manufacturing process
XC2S200-6FGG848C Technical Specifications
Core Architecture Specifications
| Specification |
Value |
Description |
| Device Family |
Spartan-II |
Cost-effective FPGA series |
| Logic Cells |
5,292 |
Configurable logic resources |
| System Gates |
200,000 |
Equivalent gate count capacity |
| CLB Array |
28 x 42 |
Configurable Logic Block matrix |
| Total CLBs |
1,176 |
Individual logic blocks |
| Distributed RAM |
75,264 bits |
Integrated memory resources |
| Block RAM |
56K bits |
High-speed embedded memory |
| Maximum User I/O |
284+ |
Extensive interfacing capability |
Package and Electrical Specifications
| Parameter |
Specification |
Details |
| Package Type |
FGG848 |
Fine-Pitch Ball Grid Array |
| Pin Count |
848 pins |
Maximum connectivity options |
| Core Voltage |
2.5V |
Standard operating voltage |
| Speed Grade |
-6 |
Fastest commercial speed grade |
| Technology Node |
0.18µm |
CMOS manufacturing process |
| Temperature Range |
Commercial (C) |
0°C to +85°C operation |
| Operating Frequency |
Up to 263 MHz |
High-speed clock capability |
Memory Configuration Details
| Memory Type |
Capacity |
Application |
| Distributed RAM |
75,264 bits |
Flexible data storage within CLBs |
| Block RAM |
56 Kbits |
Dedicated high-speed memory blocks |
| Total Memory |
131,328 bits |
Combined memory resources |
XC2S200-6FGG848C Architecture and Design
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG848C features 1,176 Configurable Logic Blocks arranged in a 28×42 array, providing extensive resources for implementing complex digital circuits. Each CLB contains:
- Look-Up Tables (LUTs) for combinational logic
- Flip-flops for sequential logic operations
- Multiplexers for data routing
- Carry logic for arithmetic operations
Input/Output Block (IOB) Capabilities
The 848-pin FGG package provides maximum I/O flexibility, supporting:
- Multiple I/O standards (LVTTL, LVCMOS, PCI, GTL+)
- Programmable drive strength
- Individual pin configuration
- High-speed differential signaling options
Delay-Locked Loops (DLLs)
Four integrated DLLs enable precise clock management:
- Clock deskewing and distribution
- Frequency synthesis and division
- Phase shifting capabilities
- Reduced clock-to-output delays
Applications of XC2S200-6FGG848C
Telecommunications and Networking
The XC2S200-6FGG848C excels in communications infrastructure:
- Network routers and switches
- Protocol converters and bridges
- Baseband processing for wireless systems
- High-speed data encryption engines
- Software-defined radio (SDR) platforms
Industrial Automation and Control
Industrial applications benefit from the FPGA’s reliability:
- Motor control systems
- Process automation controllers
- Machine vision processing
- Industrial Ethernet interfaces
- Real-time monitoring systems
Medical and Healthcare Electronics
Critical medical equipment leverages the XC2S200-6FGG848C:
- Medical imaging systems (ultrasound, CT, MRI)
- Patient monitoring equipment
- Diagnostic instrumentation
- Laboratory analysis devices
- Portable medical devices
Automotive Electronics
Automotive systems utilize this FPGA for:
- Advanced Driver Assistance Systems (ADAS)
- In-vehicle infotainment systems
- Engine control units
- Automotive networking (CAN, LIN, FlexRay)
- Sensor fusion applications
Consumer Electronics
Consumer product developers choose this FPGA for:
- High-definition video processing
- Audio DSP applications
- Gaming console components
- Smart home controllers
- Digital camera image processors
Performance Advantages of XC2S200-6FGG848C
Speed Grade -6 Performance
The -6 speed grade represents the fastest commercial version available, offering:
- Maximum internal clock frequencies up to 263 MHz
- Optimized timing for critical path operations
- Reduced propagation delays
- Enhanced setup and hold time margins
Power Efficiency
Operating at 2.5V core voltage provides:
- Lower power consumption versus 3.3V devices
- Reduced thermal management requirements
- Extended battery life in portable applications
- Improved system reliability
Reprogrammability Benefits
Unlike ASICs, the XC2S200-6FGG848C offers:
- Field upgradability without hardware changes
- Rapid prototyping and development
- Design iteration flexibility
- Reduced time-to-market
- Lower non-recurring engineering (NRE) costs
XC2S200-6FGG848C vs Other Package Options
Package Comparison Table
| Package |
Pin Count |
I/O Pins |
Typical Applications |
| FGG848 |
848 |
284+ |
Maximum I/O, complex systems |
| FG456 |
456 |
176 |
Moderate I/O requirements |
| FG256 |
256 |
140 |
Compact designs |
| PQ208 |
208 |
140 |
Low-cost applications |
The FGG848 package offers the highest pin count in the Spartan-II family, providing maximum I/O capability for applications requiring extensive external interfacing.
Development Tools and Design Support
Design Software
Xilinx ISE Design Suite supports the XC2S200-6FGG848C with:
- Schematic and HDL entry (VHDL, Verilog)
- Synthesis and implementation tools
- Timing analysis and constraint management
- Simulation environments
- Bitstream generation
Programming and Configuration
Multiple configuration options include:
- JTAG boundary scan programming
- Master/Slave serial configuration
- SelectMAP parallel configuration
- Configuration PROM support
Quality and Reliability Standards
Manufacturing Quality
The XC2S200-6FGG848C meets stringent quality standards:
- ISO 9001 certified manufacturing
- RoHS compliant materials (Pb-free “G” option)
- Comprehensive testing and screening
- Long-term reliability testing
Operating Environment
Designed for commercial applications with:
- Operating temperature: 0°C to +85°C
- Extended temperature options available
- Moisture sensitivity level (MSL) rated packaging
- ESD protection on all pins
Ordering Information and Part Number Breakdown
Part Number Decoder
XC2S200-6FGG848C breakdown:
- XC2S200: Device family and gate count (200K gates)
- -6: Speed grade (fastest commercial)
- FGG: Package type (Fine-Pitch Ball Grid Array)
- 848: Pin count
- C: Commercial temperature range
Lead-Free Options
The “G” designation indicates Pb-free packaging:
- Standard: XC2S200-6FGG848C
- Pb-free: XC2S200-6FGGG848C
Getting Started with XC2S200-6FGG848C
Design Considerations
When implementing designs with the XC2S200-6FGG848C:
- Power Supply Design: Ensure stable 2.5V core and appropriate I/O voltages
- PCB Layout: Follow Xilinx PCB design guidelines for BGA packages
- Thermal Management: Provide adequate cooling for high-utilization designs
- Clock Distribution: Utilize DLLs for optimal clock performance
- I/O Planning: Optimize pin assignments for signal integrity
Resource Estimation
Plan your design resources effectively:
- Logic utilization: Target 70-80% for optimal routing
- Memory allocation: Distribute between block RAM and distributed RAM
- I/O buffer requirements: Account for voltage translation needs
- Clock resource usage: Plan global and regional clock networks
Frequently Asked Questions
What makes the XC2S200-6FGG848C different from other Spartan-II variants?
The FGG848 package provides the maximum I/O count available in the XC2S200 device, offering 284+ user I/O pins compared to smaller packages. This makes it ideal for applications requiring extensive external connectivity.
Is the XC2S200-6FGG848C suitable for new designs?
While the Spartan-II family is considered mature technology, it remains an excellent choice for cost-sensitive applications, legacy system maintenance, and projects requiring proven, reliable FPGA solutions.
What development boards support the XC2S200-6FGG848C?
Several third-party development platforms support the XC2S200 series. Custom boards are often developed for specific applications due to the specialized FGG848 package.
Can I migrate from other XC2S200 packages to FGG848?
Yes, the core logic and resources are identical across packages. Migration requires updating the pinout and PCB layout while maintaining the same HDL code and design constraints.
What is the typical power consumption?
Power consumption varies with utilization, clock frequency, and I/O activity. Typical static power is approximately 50-100mW, with dynamic power scaling based on design complexity and operating frequency.
Why Choose XC2S200-6FGG848C for Your Project
The XC2S200-6FGG848C delivers exceptional value through:
- Maximum I/O Flexibility: 848-pin package accommodates complex interfacing
- Proven Reliability: Mature technology with extensive field deployment
- Cost-Effective Solution: Lower total cost versus ASIC development
- Design Flexibility: Reprogrammable architecture for upgrades
- Comprehensive Support: Extensive documentation and design resources
Where to Buy XC2S200-6FGG848C
For authentic XC2S200-6FGG848C FPGAs and comprehensive Xilinx FPGA solutions, work with authorized distributors to ensure genuine components, full manufacturer warranty, and technical support.
Conclusion
The XC2S200-6FGG848C stands as a powerful, versatile FPGA solution for demanding digital design applications. With 200,000 system gates, 848-pin connectivity, and proven Spartan-II architecture, this device enables engineers to implement complex systems with confidence. Whether developing telecommunications equipment, industrial controllers, medical devices, or automotive systems, the XC2S200-6FGG848C provides the performance, flexibility, and reliability needed for successful product deployment.
The combination of high logic density, extensive I/O options, integrated memory, and advanced features like DLLs makes the XC2S200-6FGG848C an outstanding choice for both new designs and system upgrades. Its reprogrammable nature eliminates the risks and costs associated with ASIC development while providing superior time-to-market advantages.
For engineers seeking a robust, high-performance FPGA with maximum connectivity options, the XC2S200-6FGG848C delivers exceptional value and capabilities that continue to serve mission-critical applications across multiple industries worldwide.
