The XC2S200-6FGG840C represents a powerful member of the Xilinx Spartan-II FPGA family, designed to deliver exceptional programmable logic performance in an 840-pin Fine-Pitch Ball Grid Array (FBGA) package. This field-programmable gate array combines 200,000 system gates with advanced 0.18µm process technology to provide engineers with a cost-effective, high-density solution for complex digital designs.
As part of the renowned Spartan-II series, the XC2S200-6FGG840C offers superior flexibility compared to traditional ASICs while maintaining competitive pricing and performance metrics. This FPGA is engineered for applications demanding extensive I/O capabilities, substantial logic resources, and reliable operation across commercial temperature ranges.
Key Specifications and Technical Features
Core Performance Specifications
| Parameter |
Specification |
Description |
| Logic Cells |
5,292 cells |
Provides extensive logic capacity for complex designs |
| System Gates |
200,000 gates |
Equivalent gate count for design estimation |
| CLB Array |
28 × 42 (1,176 CLBs) |
Configurable Logic Block architecture |
| Maximum User I/O |
284 pins |
High pin count for extensive connectivity |
| Speed Grade |
-6 |
Commercial temperature, highest performance grade |
| Operating Voltage |
2.5V (2.375V – 2.625V) |
Standard LVTTL/LVCMOS compatible |
| Package Type |
FGG840 |
840-pin Fine-Pitch BGA |
Memory Resources and Architecture
| Memory Type |
Capacity |
Implementation |
| Distributed RAM |
75,264 bits |
Embedded within CLBs for flexible storage |
| Block RAM |
56K bits (56,576 bits) |
Dedicated memory blocks for efficient data buffering |
| SelectRAM Hierarchy |
Dual-level |
16 bits/LUT distributed + 4K bit blocks |
| Total RAM Bits |
57,344 bits |
Combined distributed and block memory |
Advanced FPGA Capabilities
The XC2S200-6FGG840C integrates several advanced features that distinguish it from competing programmable logic devices:
Clock Management System
- Four Delay-Locked Loops (DLLs) positioned at die corners
- Precise clock distribution and phase management
- Support for high-frequency design implementation
- Enhanced timing closure capabilities
I/O Performance Characteristics
- 284 maximum user I/O pins (excluding global clocks)
- Multiple I/O standards support
- Advanced signal integrity features
- Optimized for high-speed data interfaces
XC2S200-6FGG840C Package Information
FGG840 Fine-Pitch BGA Details
| Package Attribute |
Specification |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Total Pin Count |
840 pins |
| Ball Pitch |
Fine-pitch spacing for high-density routing |
| Package Designation |
FGG840 |
| Mounting Type |
Surface Mount Technology (SMT) |
| RoHS Compliance |
Pb-free option available (FGG840 designation) |
The 840-pin configuration provides exceptional I/O density, making this FPGA ideal for applications requiring numerous external connections, such as high-speed communication systems, data acquisition platforms, and complex embedded processing solutions.
Operating Conditions and Environmental Specifications
Temperature and Voltage Requirements
| Parameter |
Minimum |
Typical |
Maximum |
Unit |
| Core Voltage (VCCINT) |
2.375 |
2.5 |
2.625 |
V |
| I/O Voltage (VCCO) |
2.375 |
2.5 |
2.625 |
V |
| Operating Temperature |
0 |
25 |
85 |
°C (Commercial) |
| Junction Temperature |
— |
— |
125 |
°C |
Speed Grade Characteristics: The -6 speed grade designation indicates this device operates exclusively within the commercial temperature range (0°C to 85°C), optimized for maximum performance in standard operating environments.
Application Areas and Use Cases
Industrial and Commercial Applications
The XC2S200-6FGG840C excels in diverse application domains:
Digital Signal Processing
- Real-time signal filtering and analysis
- Audio and video processing pipelines
- Communication protocol implementation
- High-bandwidth data streaming
Control Systems
- Industrial automation controllers
- Motor control and drive systems
- Process monitoring and management
- Programmable logic controller (PLC) replacement
Communication Infrastructure
- Network interface cards
- Protocol converters and bridges
- Telecommunications equipment
- Data acquisition systems
Embedded Systems
- System-on-Chip (SoC) integration
- Custom peripheral interfaces
- Rapid prototyping platforms
- Hardware acceleration modules
Design and Development Advantages
FPGA Benefits Over ASIC Implementation
| Advantage |
Benefit |
| No NRE Costs |
Eliminates expensive mask charges and setup fees |
| Rapid Prototyping |
Immediate design iteration without fabrication delays |
| Field Upgradability |
In-system reprogrammability for feature updates |
| Lower Risk |
No commitment to fixed silicon implementation |
| Shorter Time-to-Market |
Accelerated development cycles compared to ASIC |
Development Tool Compatibility
The XC2S200-6FGG840C integrates seamlessly with Xilinx development tools:
- ISE Design Suite: Complete design entry, synthesis, and implementation
- ChipScope Pro: In-system debugging and verification
- Configuration Tools: Multiple programming interfaces supported
- IP Core Library: Pre-verified functional blocks for rapid integration
Technical Comparison with Related Devices
Spartan-II Family Context
| Device |
Logic Cells |
System Gates |
CLBs |
Max I/O |
Block RAM |
| XC2S50 |
1,728 |
50,000 |
384 |
176 |
32K |
| XC2S100 |
2,700 |
100,000 |
600 |
176 |
40K |
| XC2S150 |
3,888 |
150,000 |
864 |
260 |
48K |
| XC2S200 |
5,292 |
200,000 |
1,176 |
284 |
56K |
The XC2S200-6FGG840C represents the flagship device in the Spartan-II family, offering maximum logic capacity and I/O resources.
Ordering and Availability Information
Part Number Breakdown
XC2S200-6FGG840C
- XC2S200: Device family and gate count (Spartan-II, 200K gates)
- -6: Speed grade (highest commercial performance)
- FGG840: Package type (840-pin Fine-Pitch BGA)
- C: Commercial temperature range (0°C to 85°C)
Package Variants
For applications with different I/O or footprint requirements, the XC2S200 is available in multiple package options, though the FGG840 variant offers the maximum pin count and connectivity options.
Design Considerations for XC2S200-6FGG840C Implementation
PCB Layout Guidelines
When implementing the XC2S200-6FGG840C in your design, consider:
Power Distribution
- Adequate decoupling capacitors near power pins
- Proper power plane design for VCCINT and VCCO
- Separate analog and digital ground planes where applicable
Signal Integrity
- Controlled impedance routing for high-speed signals
- Proper termination of unused I/O pins
- Ground plane continuity for return paths
Thermal Management
- Appropriate thermal vias in BGA footprint
- Heat sink consideration for high-utilization applications
- Airflow analysis for convection cooling
Configuration and Programming
The device supports multiple configuration modes:
- Master Serial mode
- Slave Serial mode
- Boundary-Scan (JTAG) programming
- SelectMAP interface
Why Choose XC2S200-6FGG840C for Your Project?
Performance and Flexibility
The XC2S200-6FGG840C delivers an optimal balance of logic resources, memory capacity, and I/O connectivity. Its 840-pin package provides exceptional flexibility for complex interfacing requirements while maintaining a manageable footprint for professional PCB designs.
Cost-Effective Development
Compared to custom ASIC development, the XC2S200-6FGG840C enables:
- Zero mask costs and NRE expenses
- Rapid design iterations
- Risk-free specification changes
- Proven silicon with established reliability
Long-Term Support
As part of the Xilinx legacy product line (now AMD), the Spartan-II family benefits from extensive documentation, proven design examples, and a mature ecosystem of third-party IP and development tools.
Frequently Asked Questions
What is the difference between speed grades?
The -6 speed grade represents the fastest commercial-temperature variant of the XC2S200, offering the lowest propagation delays and highest operating frequencies. This grade is exclusive to the commercial (C) temperature range.
Can the XC2S200-6FGG840C be reprogrammed?
Yes, the device features unlimited reprogrammability. You can reconfigure the FPGA as many times as needed during development or deploy field updates to systems already in production.
What development tools are required?
The Xilinx ISE Design Suite (version compatible with Spartan-II devices) provides all necessary tools for design entry, synthesis, implementation, and device programming. Free WebPACK versions support Spartan-II devices with some limitations.
How does this compare to modern FPGAs?
While newer FPGA families offer higher performance and more advanced features, the XC2S200-6FGG840C remains suitable for many applications where proven technology, cost optimization, and adequate logic resources align with project requirements.
Related Products and Alternatives
For designers exploring Xilinx FPGA options, consider evaluating requirements against available Spartan-II variants to ensure optimal device selection for your specific application needs.
Conclusion: Maximizing Value with XC2S200-6FGG840C
The XC2S200-6FGG840C stands as a robust, reliable FPGA solution for applications demanding substantial logic resources, extensive I/O capabilities, and proven technology. Its 840-pin Fine-Pitch BGA package accommodates complex interfacing requirements while the Spartan-II architecture delivers dependable performance for industrial, commercial, and embedded applications.
Whether you’re developing communication systems, control platforms, or custom digital logic implementations, the XC2S200-6FGG840C provides a cost-effective path from concept to production with the flexibility only programmable logic can deliver.
