The XC2S200-6FGG839C is a premium field programmable gate array (FPGA) from the renowned Spartan-II family, manufactured by AMD Xilinx. This powerful programmable logic device delivers exceptional performance for demanding digital design applications across telecommunications, industrial automation, aerospace, and embedded systems. With its robust 839-ball fine-pitch ball grid array (FBGA) package, the XC2S200-6FGG839C offers superior I/O capabilities and enhanced thermal performance for mission-critical applications.
As a mature and proven FPGA solution, the XC2S200-6FGG839C combines reliability, cost-effectiveness, and design flexibility, making it an ideal choice for engineers seeking a dependable programmable logic solution. This comprehensive guide explores the technical specifications, applications, and advantages of implementing the XC2S200-6FGG839C in your next digital design project.
Key Technical Specifications of XC2S200-6FGG839C
Core Architecture Features
The XC2S200-6FGG839C is built on Xilinx’s proven Spartan-II architecture, incorporating advanced features that enable complex digital implementations:
| Specification |
Value |
Description |
| System Gates |
200,000 |
Equivalent logic capacity for complex designs |
| Logic Cells |
5,292 |
Configurable logic blocks for digital functions |
| CLB Array |
28 x 42 (1,176 total) |
Grid structure for logic implementation |
| Distributed RAM |
75,264 bits |
Fast local memory within CLBs |
| Block RAM |
56K bits |
Dedicated high-speed memory blocks |
| Maximum User I/O |
284+ pins |
Extensive connectivity options |
| Speed Grade |
-6 |
Optimized for high-performance applications |
Package and Physical Characteristics
| Parameter |
Specification |
| Package Type |
839-ball Fine-Pitch BGA (FBGA) |
| Pin Count |
839 balls |
| Core Voltage |
2.5V |
| Technology Node |
0.18µm CMOS |
| Operating Frequency |
Up to 263 MHz |
| Temperature Range |
Commercial (0°C to +85°C) |
Advanced I/O Capabilities
The XC2S200-6FGG839C features versatile input/output blocks that support multiple industry-standard interfaces:
- MultiVolt I/O support for interfacing with 1.8V, 2.5V, 3.3V, and 5V systems
- SelectIO technology for flexible I/O standard implementation
- Differential signaling support (LVDS, LVPECL, SSTL)
- High-speed data transfer capabilities
- Programmable slew rate control
- Bus-hold and weak pull-up/pull-down options
XC2S200-6FGG839C Architecture and Design Elements
Configurable Logic Blocks (CLBs)
The heart of the XC2S200-6FGG839C consists of 1,176 configurable logic blocks arranged in a 28×42 matrix. Each CLB contains:
- Four-input look-up tables (LUTs) for combinational logic
- Dedicated flip-flops for sequential functions
- Fast carry logic for arithmetic operations
- Multiplexers for data routing flexibility
Memory Architecture
The XC2S200-6FGG839C provides dual-layer memory architecture:
Distributed RAM (75,264 bits):
- Integrated within CLB structure
- Ultra-fast access times
- Ideal for FIFOs, small buffers, and lookup tables
- Flexible configuration options
Block RAM (56K bits):
- Dedicated synchronous memory blocks
- True dual-port capability
- Configurable width and depth
- Optimal for data buffering and storage
Clock Management System
The XC2S200-6FGG839C includes four Delay-Locked Loops (DLLs) positioned at each corner of the die, providing:
- Precise clock distribution with minimal skew
- Clock frequency synthesis and division
- Programmable phase shifting
- Clock deskewing for improved timing performance
Applications and Use Cases for XC2S200-6FGG839C
Telecommunications and Networking
The XC2S200-6FGG839C excels in communication infrastructure applications:
- Protocol converters and bridges
- Network routers and switches
- Wireless base station signal processing
- Data encryption and compression engines
- Communication interface controllers
Industrial Automation and Control
Manufacturing and process control systems benefit from the XC2S200-6FGG839C’s reliability:
- Motor control systems with PWM generation
- PLC (Programmable Logic Controller) implementations
- Sensor interface and data acquisition
- Machine vision processing
- Industrial protocol implementations (Profibus, Modbus, EtherCAT)
Automotive Electronics
The XC2S200-6FGG839C supports advanced automotive applications:
- Engine control unit (ECU) prototyping
- Advanced driver-assistance systems (ADAS)
- In-vehicle infotainment systems
- CAN bus and LIN bus controllers
- Instrument cluster controllers
Medical and Healthcare Equipment
Healthcare technology leverages the XC2S200-6FGG839C for critical applications:
- Medical imaging systems (ultrasound, CT, MRI)
- Patient monitoring equipment
- Diagnostic test instruments
- Laboratory automation systems
- Medical device control interfaces
Aerospace and Defense
The XC2S200-6FGG839C’s proven reliability serves aerospace applications:
- Avionics systems and flight controllers
- Radar signal processing
- Navigation systems
- Satellite communication equipment
- Ground support equipment
Development Tools and Design Resources
Xilinx ISE Design Suite Support
The XC2S200-6FGG839C is fully supported by Xilinx ISE Design Suite, providing comprehensive development capabilities:
- Design Entry: Schematic capture, HDL editors (VHDL/Verilog)
- Synthesis: XST (Xilinx Synthesis Technology) optimization
- Implementation: Place-and-route with timing-driven algorithms
- Simulation: Integrated behavioral and timing simulation
- Programming: Device configuration and bitstream generation
Hardware Description Language Programming
Engineers can program the XC2S200-6FGG839C using industry-standard HDLs:
- VHDL: IEEE 1076 compliant synthesis
- Verilog: IEEE 1364 HDL support
- ABEL: For simple logic equations
- Schematic Entry: Graphical design capture
IP Core Library Access
Accelerate development with pre-verified intellectual property cores:
- Digital signal processing (DSP) functions
- Communication protocol stacks
- Memory controllers
- Math functions and algorithms
- Video and image processing cores
XC2S200-6FGG839C vs. Alternative Package Options
Package Comparison Table
| Package Code |
Ball Count |
Typical Applications |
I/O Availability |
| FG256 |
256 |
Compact designs, limited I/O |
Up to 176 |
| FGG839 |
839 |
Maximum I/O, complex systems |
Up to 284+ |
| PQ208 |
208 |
Cost-sensitive applications |
Up to 176 |
The XC2S200-6FGG839C’s 839-ball package provides the maximum pin count option for this device, enabling designers to utilize all available I/O resources and supporting the most complex interface requirements.
Performance Optimization Strategies
Timing Closure Techniques
Achieve optimal performance from your XC2S200-6FGG839C design:
- Pipelining: Insert registers to break long combinational paths
- Retiming: Redistribute registers for balanced pipeline stages
- Clock Domain Crossing: Implement proper synchronization
- Constraint Definition: Apply comprehensive timing constraints
Resource Utilization Guidelines
Maximize XC2S200-6FGG839C resource efficiency:
- Utilize block RAM for large memory structures
- Reserve distributed RAM for small, fast access memories
- Implement DSP functions using dedicated carry logic
- Balance logic distribution across CLB array
Power Management Considerations
Optimize power consumption in XC2S200-6FGG839C designs:
- Clock gating for unused logic sections
- Multi-voltage I/O standards selection
- Dynamic voltage scaling where applicable
- Careful I/O standard selection
Quality, Reliability, and Compliance
Environmental Standards
The XC2S200-6FGG839C meets stringent environmental requirements:
- RoHS Compliance: Lead-free manufacturing process
- REACH Compliance: Restricted substance regulations
- Conflict Minerals: Responsible sourcing certification
Quality Assurance
Xilinx manufacturing ensures high reliability:
- ISO 9001 certified production facilities
- Comprehensive electrical testing
- Environmental stress screening available
- Long-term product availability commitment
Export Compliance
The XC2S200-6FGG839C follows international trade regulations:
- ECCN classification for export control
- Standard commercial export documentation
- Country-specific restrictions may apply
Programming and Configuration Options
Configuration Modes
The XC2S200-6FGG839C supports multiple configuration methods:
| Mode |
Interface |
Use Case |
| Master Serial |
SPI Flash |
Standalone operation |
| Slave Serial |
External controller |
System-controlled config |
| JTAG |
Boundary scan |
Development and debugging |
| SelectMAP |
Parallel interface |
Fast configuration |
Configuration Memory Options
Compatible configuration storage devices:
- Xilinx Platform Flash PROMs
- SPI serial Flash memories
- External microcontroller programming
- JTAG chain programming
Design Migration and Upgrade Paths
Forward Compatibility
Designers using the XC2S200-6FGG839C can migrate to newer architectures:
- Spartan-3 family for cost reduction
- Spartan-6 for enhanced performance
- 7 Series for advanced features
- Modern alternatives from Xilinx FPGA portfolio
Legacy Support
The XC2S200-6FGG839C provides a bridge for legacy system maintenance:
- Long-term availability through authorized distributors
- Comprehensive documentation archive
- Application note library
- Community support forums
Procurement and Availability
Sourcing Recommendations
To ensure authentic XC2S200-6FGG839C components:
- Purchase from authorized Xilinx distributors
- Verify device markings and lot codes
- Request certificates of conformance
- Implement counterfeit mitigation procedures
Lead Time Considerations
Plan procurement with these factors in mind:
- Standard lead times: 8-12 weeks for large quantities
- Stock availability varies by distributor
- Minimum order quantities may apply
- Consult with suppliers for volume pricing
Frequently Asked Questions (FAQ)
What is the difference between XC2S200-6FGG839C and other speed grades?
The “-6” speed grade in the XC2S200-6FGG839C designation indicates this is the fastest commercial-temperature variant available. The speed grade affects maximum operating frequency and timing performance, with -6 being the premium option for high-performance applications.
Can the XC2S200-6FGG839C operate in industrial temperature ranges?
The XC2S200-6FGG839C is specified for commercial temperature range (0°C to +85°C). The -6 speed grade is exclusively available in commercial temperature range. For industrial applications requiring -40°C to +100°C operation, alternative speed grades should be considered.
What development boards support XC2S200-6FGG839C?
While specific development boards for the 839-ball package may be limited, Xilinx and third-party vendors offer Spartan-II evaluation platforms. Custom PCB development is common for production applications utilizing the XC2S200-6FGG839C’s extensive I/O capabilities.
Is the XC2S200-6FGG839C suitable for new designs?
The Spartan-II family is a mature product line. While fully functional and reliable, newer FPGA families offer enhanced features, lower power consumption, and improved performance. Evaluate current Xilinx offerings for new designs while considering the XC2S200-6FGG839C for legacy system support or cost-optimized applications.
What power supply requirements does the XC2S200-6FGG839C have?
The XC2S200-6FGG839C requires a core voltage (VCCINT) of 2.5V and I/O voltages (VCCO) that vary based on the selected I/O standards, typically ranging from 1.8V to 3.3V. Proper power supply sequencing and decoupling capacitor placement are critical for reliable operation.
Conclusion: Why Choose XC2S200-6FGG839C for Your FPGA Project
The XC2S200-6FGG839C represents a proven, reliable FPGA solution from the Spartan-II family, offering substantial logic capacity, extensive I/O resources, and robust performance characteristics. With 200,000 system gates, 5,292 logic cells, and an 839-ball package providing maximum connectivity options, this device serves complex digital design requirements across multiple industries.
The XC2S200-6FGG839C’s architecture delivers the flexibility inherent to FPGA technology—programmable logic, reconfigurability, and rapid prototyping capabilities—while avoiding the high costs and lengthy development cycles associated with ASIC implementations. Its support for industry-standard development tools, comprehensive IP core libraries, and multiple configuration options streamlines the design process from concept to production.
Whether developing telecommunications infrastructure, industrial control systems, automotive electronics, or aerospace applications, the XC2S200-6FGG839C provides a cost-effective, high-performance programmable logic solution. With proper design techniques, resource optimization, and adherence to best practices, engineers can maximize the capabilities of this versatile FPGA platform.
For additional information on Xilinx FPGA solutions and to explore the complete portfolio of programmable logic devices, visit the comprehensive Xilinx FPGA resource center.
