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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XA3S500E-4FT256Q: Automotive-Grade FPGA for Advanced Driver Systems

Product Details

The XA3S500E-4FT256Q is a powerful automotive-qualified field-programmable gate array from the Xilinx FPGA XA Spartan-3E family. Designed specifically for demanding automotive applications, this 500K gate FPGA delivers exceptional performance, reliability, and cost-efficiency for infotainment systems, advanced driver assistance systems (ADAS), and critical vehicle control modules.

Overview of XA3S500E-4FT256Q Automotive FPGA

The XA3S500E-4FT256Q represents a significant advancement in automotive programmable logic solutions. Built on advanced 90nm CMOS technology, this automotive-grade FPGA offers designers a flexible, field-upgradeable alternative to traditional ASICs and ASSPs, eliminating high mask costs and enabling rapid design iterations without hardware changes.

Key Features and Benefits

This automotive FPGA provides engineers with a robust platform for implementing complex digital logic in vehicle electronics. The device combines high logic density with extensive I/O capabilities, making it ideal for applications requiring real-time processing and multiple interface standards.

Technical Specifications

Core Performance Characteristics

Specification Value
Part Number XA3S500E-4FT256Q
Family XA Spartan-3E
System Gates 500,000 (500K)
Logic Cells 10,476
Maximum Frequency 572 MHz
Process Technology 90nm CMOS
Operating Voltage 1.2V Core

Package and Environmental Specifications

Parameter Specification
Package Type 256-Pin Fine-Pitch BGA (FTBGA)
Package Dimensions 17mm x 17mm
Operating Temperature -40°C to +125°C TJ (Q-Grade)
Automotive Qualification AEC-Q100 Certified
RoHS Compliance Lead-Free / RoHS Compliant
Speed Grade -4 (Industrial Grade)

Memory and Logic Resources

On-Chip Memory Configuration

Memory Type Capacity Details
Block RAM 73 Kbits Configurable dual-port RAM blocks
Distributed RAM 360 Kbits Flexible LUT-based memory
Total Memory 433 Kbits Combined embedded memory resources

Programmable Logic Architecture

Resource Quantity Description
CLB Slices 4,656 Configurable Logic Blocks
4-Input LUTs 1,164 Look-Up Tables for logic implementation
Flip-Flops 10,476 Synchronous storage elements
DCMs 4 Digital Clock Managers for timing
DSP Slices 20 18×18 multipliers for signal processing

I/O Capabilities and Interface Standards

User I/O Resources (FT256 Package)

The XA3S500E-4FT256Q offers comprehensive I/O capabilities for automotive connectivity:

I/O Type Quantity
User I/O Pins 190
Differential I/O Pairs 77
Multi-Standard I/O Banks Multiple voltage support

Supported I/O Standards

This automotive FPGA supports a wide range of industry-standard interfaces:

Single-Ended Standards:

  • LVTTL (Low-Voltage TTL)
  • LVCMOS (1.5V, 1.8V, 2.5V, 3.3V)
  • PCI 33/66 MHz
  • HSTL (High-Speed Transceiver Logic)
  • SSTL (Stub Series Terminated Logic)

Differential Standards:

  • LVDS (Low-Voltage Differential Signaling)
  • Bus LVDS
  • mini-LVDS
  • RSDS (Reduced Swing Differential Signaling)
  • Differential HSTL (1.8V)
  • Differential SSTL (2.5V, 1.8V)
  • LVPECL inputs

Automotive Applications and Use Cases

Advanced Driver Assistance Systems (ADAS)

The XA3S500E-4FT256Q excels in ADAS applications requiring real-time sensor fusion, image processing, and decision-making algorithms. Its automotive qualification ensures reliable operation in harsh vehicle environments.

Infotainment and Cluster Systems

With ample logic resources and high-speed I/O, this FPGA powers sophisticated infotainment displays, instrument clusters, and human-machine interfaces in modern vehicles.

Vehicle Communication Interfaces

The device’s multi-standard I/O support enables implementation of various automotive communication protocols including CAN, LIN, FlexRay, and emerging Ethernet-based standards.

Motor Control and Powertrain

DSP slices and high-speed logic make the XA3S500E-4FT256Q suitable for motor control algorithms, power management, and electric vehicle applications.

Configuration and Programming

Configuration Options

The XA3S500E-4FT256Q supports multiple configuration modes for flexible system integration:

  • Master Serial Mode: Direct configuration from SPI Flash
  • Slave Serial Mode: Configuration via external controller
  • Master SelectMAP: Parallel configuration for faster boot
  • Slave SelectMAP: Host-controlled parallel loading
  • JTAG Mode: In-system programming and debugging

Development Tools

Engineers can develop designs for this automotive FPGA using Xilinx ISE Design Suite or Vivado Design Suite, which provide comprehensive synthesis, implementation, and verification tools tailored for Spartan-3E devices.

Advantages Over ASICs and ASSPs

Design Flexibility

Unlike mask-programmed ASICs, the XA3S500E-4FT256Q allows field updates and design modifications without hardware replacement, significantly reducing development risk and enabling continuous improvement.

Cost Efficiency

The FPGA eliminates high NRE costs associated with ASIC development, making it economical for medium to high-volume automotive applications. The 90nm process technology delivers excellent cost per logic cell.

Faster Time to Market

Designers can iterate quickly without waiting for fabrication cycles, accelerating product development and enabling rapid response to changing automotive requirements.

Quality and Reliability

Automotive-Grade Qualification

AEC-Q100 certification ensures the XA3S500E-4FT256Q meets stringent automotive reliability standards, including extended temperature operation, humidity resistance, and long-term stability.

Extended Temperature Range

Q-Grade devices operate from -40°C to +125°C junction temperature, covering the full automotive temperature spectrum from cold-start conditions to under-hood environments.

RoHS Compliance

Lead-free, RoHS-compliant construction meets global environmental regulations for automotive electronics manufacturing.

Comparison with Related Devices

XA3S500E Family Members

Device Gates Logic Cells Block RAM Package Options
XA3S100E 100K 2,160 15 Kbits VQG100, CPG132, TQG144, PQG208
XA3S250E 250K 5,508 36 Kbits Multiple packages available
XA3S500E 500K 10,476 73 Kbits FT256, FGG400, FGG484
XA3S1200E 1.2M 19,512 136 Kbits Larger packages
XA3S1600E 1.6M 33,192 231 Kbits Larger packages

Design Considerations

Power Management

The 1.2V core voltage and advanced power management features help minimize power consumption in battery-sensitive automotive applications. Multiple power domains enable efficient operation across varying workload conditions.

Thermal Design

The FTBGA-256 package provides good thermal characteristics. Designers should consider junction temperature limits when implementing high-utilization designs in high-ambient-temperature automotive environments.

Signal Integrity

The 17mm x 17mm package footprint balances I/O density with signal integrity requirements. Proper PCB design practices, including controlled impedance routing and power distribution, ensure reliable high-speed operation.

Ordering Information

Part Number Breakdown

XA3S500E-4FT256Q

  • XA: Automotive-qualified product line
  • 3S500E: Spartan-3E family, 500K gates
  • 4: Speed grade (industrial)
  • FT256: Fine-Pitch BGA, 256 pins
  • Q: Temperature grade (-40°C to +125°C)

Frequently Asked Questions

What is the difference between XA and XC Spartan devices?

XA devices are automotive-qualified to AEC-Q100 standards with extended temperature ranges, while XC devices are standard commercial/industrial parts. XA devices undergo additional testing and qualification for automotive use.

Can I upgrade from a standard Spartan-3E to the automotive version?

Yes, XA Spartan-3E devices are pin-compatible with commercial XC Spartan-3E counterparts in the same package, allowing easy migration to automotive-grade components.

What development tools are required?

Xilinx ISE Design Suite (version 14.7 or earlier) or Vivado Design Suite supports the XA Spartan-3E family. Free WebPACK editions provide basic functionality for this device family.

How does this compare to newer FPGA families?

While newer families like Spartan-7 offer higher performance, the XA Spartan-3E remains a cost-effective, automotive-qualified solution for many applications, with excellent tool support and proven reliability.

What configuration memory is recommended?

SPI Flash devices from manufacturers like Micron, Winbond, or Macronix work well. Size depends on your design but typically ranges from 4 to 16 Mbit for most applications.

Conclusion

The XA3S500E-4FT256Q automotive FPGA delivers a compelling combination of performance, reliability, and cost-effectiveness for demanding automotive applications. With AEC-Q100 qualification, extensive I/O capabilities, and flexible configuration options, this device enables engineers to implement sophisticated digital logic in safety-critical and harsh-environment automotive systems. Its programmability advantage over traditional ASICs, combined with automotive-grade reliability, makes it an excellent choice for infotainment, ADAS, vehicle communications, and motor control applications.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.