The XC2S200-6FGG829C is a powerful field-programmable gate array (FPGA) from AMD Xilinx’s renowned Spartan-II family, designed to deliver exceptional performance and flexibility for complex digital designs. This 829-ball fine-pitch BGA package FPGA combines 200,000 system gates with advanced programmable logic capabilities, making it an ideal solution for telecommunications, industrial automation, embedded systems, and high-speed data processing applications.

Overview of XC2S200-6FGG829C FPGA

The XC2S200-6FGG829C represents a superior alternative to traditional mask-programmed ASICs, offering engineers the ability to implement, test, and modify designs without the lengthy development cycles and high initial costs associated with custom silicon. This reconfigurable device enables field upgrades and design iterations, providing unprecedented flexibility for evolving project requirements.

Key Features and Specifications

The XC2S200-6FGG829C delivers robust functionality through its comprehensive feature set, optimized for demanding applications across multiple industries.

Technical Architecture and Performance

Logic Capacity and Processing Power

The XC2S200-6FGG829C features 5,292 logic cells organized in a 28 x 42 configurable logic block (CLB) array, providing substantial resources for implementing complex digital circuits. Each CLB contains multiple logic elements with look-up tables (LUTs), flip-flops, and multiplexers, enabling efficient implementation of arithmetic functions, state machines, and custom logic operations.

Memory Resources

The dual-memory architecture provides designers with flexible storage options, allowing distributed RAM for localized data storage within the logic fabric and dedicated block RAM for larger memory requirements.

Speed Grade and Timing Performance

The -6 speed grade designation indicates the XC2S200-6FGG829C operates at the highest performance level within the Spartan-II family, supporting system clock frequencies up to 200 MHz. This speed grade is exclusively available in the commercial temperature range, optimized for applications requiring maximum throughput and minimal propagation delays.

FGG829 Package Specifications

Package Dimensions and Thermal Characteristics

The FGG829 package (Fine-Pitch Ball Grid Array with 829 balls) offers excellent signal integrity and thermal performance for high-density applications. This advanced packaging technology provides superior electrical characteristics compared to traditional packages.

Pin Configuration and I/O Capabilities

The XC2S200-6FGG829C provides 284 user I/O pins, offering extensive connectivity options for interfacing with external components, peripherals, and communication buses. The multi-voltage I/O architecture supports various logic levels, enabling direct interfacing with 3.3V, 2.5V, and other voltage domains.

Applications and Use Cases

Telecommunications Infrastructure

The XC2S200-6FGG829C excels in telecommunications applications, including:

• Network routers and switches
• Protocol converters and bridges
• Digital signal processing (DSP) for voice/data
• Baseband processing for wireless systems
• SDH/SONET framing and multiplexing

Industrial Automation and Control

Industrial applications benefit from the FPGA’s reliability and real-time processing capabilities:

• Programmable logic controllers (PLCs)
• Motion control systems
• Machine vision processing
• Sensor data acquisition and processing
• Industrial protocol implementation (Modbus, PROFIBUS, EtherCAT)

Embedded Systems Development

The device serves as an excellent platform for embedded system designs:

• Custom processor implementations
• Hardware acceleration engines
• Peripheral interface controllers
• Real-time signal processing
• Prototype development and testing

High-Speed Data Acquisition

With its high-speed capabilities and abundant I/O resources, the XC2S200-6FGG829C is ideal for:

• Multi-channel data acquisition systems
• High-speed ADC/DAC interfaces
• Test and measurement equipment
• Scientific instrumentation
• Medical imaging systems

Design and Development Tools

FPGA Development Environment

Designers working with the XC2S200-6FGG829C can leverage AMD Xilinx’s comprehensive development tools:

ISE Design Suite provides complete design flow support including:

• Synthesis and implementation
• Timing analysis and optimization
• Place and route algorithms
• Bitstream generation
• Hardware debugging capabilities

Programming and Configuration

Performance Advantages

Reconfigurability Benefits

Unlike traditional ASICs, the XC2S200-6FGG829C offers:

1. Zero NRE Costs – Eliminate expensive mask costs and long fabrication cycles
2. Rapid Prototyping – Test and validate designs in real hardware immediately
3. Field Upgrades – Implement bug fixes and feature enhancements without hardware changes
4. Design Iteration – Quickly modify and optimize designs based on testing results
5. Reduced Time-to-Market – Deploy products faster with programmable logic

Cost-Effective Solution

The Spartan-II family delivers exceptional price-performance ratio, making the XC2S200-6FGG829C an economical choice for:

• High-volume production runs
• Cost-sensitive applications
• Educational and research projects
• Prototype development
• Legacy system upgrades

Power Management Features

Supply Voltage Requirements

Power Optimization Techniques

The XC2S200-6FGG829C incorporates several power-saving features:

• Clock management with DLLs for reduced power consumption
• Selective I/O standard configuration
• Unused logic automatic power-down
• Multi-voltage I/O for interface optimization

Quality and Reliability

Manufacturing Standards

The XC2S200-6FGG829C is manufactured using AMD Xilinx’s proven 0.18μm CMOS process technology, ensuring:

• High reliability and long operational life
• Excellent temperature stability
• Low defect rates
• Comprehensive testing and qualification

Environmental Compliance

Available in both standard and lead-free (RoHS-compliant) versions, the device meets international environmental regulations and industry standards.

Comparison with Alternative Packages

Package Selection Guide

The FGG829 package offers the highest pin count in the XC2S200 series, providing maximum flexibility for power distribution, ground connections, and signal routing, resulting in superior electrical performance and thermal dissipation.

Getting Started with XC2S200-6FGG829C

Design Considerations

When implementing designs with the XC2S200-6FGG829C, consider:

1. Power Supply Design – Ensure stable, low-noise power delivery for VCCINT and VCCO
2. Decoupling Capacitors – Place multiple capacitors near power pins for optimal performance
3. Clock Distribution – Utilize on-chip DLLs for clock multiplication and phase shifting
4. I/O Planning – Assign pins strategically to minimize routing congestion
5. Thermal Management – Provide adequate cooling for the FGG829 package

Development Resources

Engineers can access comprehensive support materials for the XC2S200-6FGG829C:

• Detailed datasheets and technical reference manuals
• Application notes and design guides
• Reference designs and example projects
• Online community forums and technical support
• Third-party IP cores and design tools

Where to Buy XC2S200-6FGG829C

The XC2S200-6FGG829C is available through authorized distributors and electronic component suppliers worldwide. For a comprehensive selection of Xilinx FPGA products, including the complete Spartan-II family, visit specialized FPGA distributors who can provide:

• Competitive pricing for volume orders
• Technical support and application assistance
• Genuine AMD Xilinx components
• Flexible shipping options
• Stock availability information

Frequently Asked Questions

What is the main advantage of the FGG829 package over smaller packages?

The FGG829 package provides superior signal integrity, enhanced thermal dissipation, and more robust power distribution compared to smaller packages. With 829 balls, it offers additional ground and power connections that reduce noise and improve overall system reliability.

Can the XC2S200-6FGG829C be used for new designs?

While the Spartan-II family is a mature product line, the XC2S200-6FGG829C remains suitable for applications where its specifications meet requirements. For new high-performance designs, consider evaluating newer FPGA families that offer enhanced features and performance.

What development tools are required?

The ISE Design Suite from AMD Xilinx is the primary development environment. Designers need a JTAG programming cable for device configuration and debugging. Third-party synthesis tools like Synplify Pro can also be used.

How does the -6 speed grade compare to other grades?

The -6 speed grade represents the fastest performance option in the Spartan-II family, offering the shortest propagation delays and highest maximum operating frequencies. It is exclusively available in the commercial temperature range.

What support resources are available?

AMD Xilinx provides extensive documentation including datasheets, user guides, application notes, and reference designs. Online technical forums, authorized distributors, and field application engineers offer additional support.

Conclusion

The XC2S200-6FGG829C stands as a proven FPGA solution delivering 200,000 system gates, 5,292 logic cells, and 284 user I/O pins in a high-performance FGG829 package. Its combination of substantial logic resources, flexible memory architecture, and -6 speed grade performance makes it an excellent choice for telecommunications, industrial automation, embedded systems, and high-speed data processing applications. The device’s reconfigurability, cost-effectiveness, and comprehensive development tool support enable rapid design implementation and deployment across diverse applications requiring reliable programmable logic solutions.