The XC2S200-6FGG827C represents an advanced field-programmable gate array from Xilinx’s Spartan-II family, delivering exceptional performance for embedded systems and digital logic applications. This high-density FPGA combines 200,000 system gates with 5,292 logic cells, making it an ideal choice for complex digital designs requiring substantial processing capabilities.
Key Features and Technical Specifications
The XC2S200-6FGG827C stands out as a cost-effective programmable logic solution engineered with 0.18-micron CMOS technology. This device operates reliably at 2.5V core voltage with flexible I/O voltage options of 1.5V, 2.5V, or 3.3V, ensuring broad compatibility with modern digital systems.
| Specification |
Value |
| Logic Cells |
5,292 |
| System Gates |
200,000 |
| CLB Array Configuration |
28 x 42 (1,176 total CLBs) |
| Maximum User I/O Pins |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits (14 blocks x 4096 bits) |
| Speed Grade |
-6 (highest performance) |
| Core Voltage |
2.5V |
| I/O Voltage (VCCO) |
1.5V / 2.5V / 3.3V |
| Operating Frequency |
Up to 263 MHz |
| Process Technology |
0.18µm |
| Temperature Range |
0°C to +85°C (Commercial) |
| Package Type |
827-Ball Fine-Pitch BGA |
Architecture and Design Capabilities
Configurable Logic Block Structure
The XC2S200-6FGG827C incorporates 1,176 Configurable Logic Blocks arranged in a 28 x 42 array, providing designers with flexible implementation options for complex digital circuits. Each CLB contains four logic cells with 4-input lookup tables (LUTs), enabling efficient implementation of combinational and sequential logic.
Memory Architecture Comparison
| Memory Type |
XC2S200-6FGG827C |
Capacity |
| Distributed RAM |
75,264 bits |
16 bits per LUT |
| Block RAM |
56 Kbits |
14 blocks of 4096 bits |
| RAM Configuration |
Dual-port synchronous |
1 to 16-bit width |
Advanced I/O Capabilities
With support for 16 different I/O standards, the XC2S200-6FGG827C provides exceptional interface flexibility:
- LVTTL (Low Voltage TTL)
- LVCMOS2 (2.5V CMOS)
- PCI 33/66 MHz (3.3V and 5V compliant)
- GTL/GTL+ (Gunning Transceiver Logic)
- HSTL Class I/III/IV (High-Speed Transceiver Logic)
- SSTL2/SSTL3 Class I/II (Stub Series Terminated Logic)
- CTT (Center-Tapped Termination)
- AGP-2X (Accelerated Graphics Port)
Speed Grade Performance Specifications
The -6 speed grade designation of the XC2S200-6FGG827C indicates the highest performance tier available for Spartan-II devices, exclusively offered in the commercial temperature range.
| Performance Metric |
XC2S200-6FGG827C |
| Maximum System Frequency |
263 MHz |
| Propagation Delay (typical) |
Optimized for high-speed |
| Setup/Hold Times |
Industry-leading specifications |
| Clock-to-Output |
Minimized with DLL technology |
Clock Management and Distribution
Delay-Locked Loop Technology
The XC2S200-6FGG827C integrates four fully digital Delay-Locked Loops (DLLs) positioned at each corner of the die. These DLLs provide:
- Zero propagation delay clock distribution
- Quadrature clock phases (0°, 90°, 180°, 270°)
- Clock multiplication (2x frequency doubling)
- Clock division (÷1.5, ÷2, ÷2.5, ÷3, ÷4, ÷5, ÷8, ÷16)
- Board-level clock deskew capabilities
Global Clock Network
Four dedicated global clock networks ensure high-speed, low-skew clock distribution throughout the device. Each global clock can drive all CLB, IOB, and Block RAM clock inputs simultaneously.
Target Applications and Use Cases
Industrial Automation and Control
The XC2S200-6FGG827C excels in industrial applications requiring precise digital control, including motor controllers, process automation systems, and programmable logic controllers (PLCs). The device’s robust I/O standards support various industrial communication protocols.
Communications Infrastructure
This FPGA serves telecommunications equipment, network routers, and protocol converters effectively. With high-speed I/O capabilities and substantial logic resources, the XC2S200-6FGG827C handles complex data processing and protocol implementation.
Medical Instrumentation
Medical device manufacturers leverage the XC2S200-6FGG827C for imaging systems, diagnostic equipment, and patient monitoring devices where reliability, reprogrammability, and signal processing capabilities are essential.
Automotive Electronics
The automotive sector utilizes this FPGA in infotainment systems, advanced driver assistance systems (ADAS), and electronic control units (ECUs) where field upgradability provides significant advantages.
Development and Configuration Options
Configuration Modes Table
| Mode |
Data Width |
Clock Source |
Typical Application |
| Master Serial |
1 bit |
Internal oscillator |
Standalone configuration |
| Slave Serial |
1 bit |
External controller |
Daisy-chain setups |
| Slave Parallel |
8 bits |
External controller |
High-speed programming |
| Boundary-Scan (JTAG) |
1 bit |
TCK |
In-system programming |
Configuration File Size
The XC2S200-6FGG827C configuration bitstream contains 1,335,840 bits, requiring approximately 167 KB of non-volatile storage when using external configuration memory.
Package and Pinout Specifications
FGG827 Ball Grid Array Package
The 827-ball Fine-Pitch Ball Grid Array package provides maximum I/O density and excellent thermal characteristics:
- High pin count enables maximum I/O utilization
- Fine-pitch ball configuration optimizes board space
- Enhanced thermal dissipation through large package footprint
- Pb-free (Green) package option available with “G” designation
- Compatible with standard BGA assembly processes
I/O Banking Architecture
The XC2S200-6FGG827C divides I/O pins into eight independent banks, enabling mixed-voltage operation and flexible I/O standard assignment. This banking structure allows:
- Independent VCCO supplies per bank
- Mixed I/O standards within voltage-compatible groups
- Optimized signal integrity through proper bank planning
- Reference voltage (VREF) sharing within banks
Competitive Advantages Over ASIC Solutions
| Feature |
XC2S200-6FGG827C FPGA |
Traditional ASIC |
| Development Time |
Weeks to months |
6-18 months |
| Initial Costs |
Low (no NRE) |
High ($100K-$1M+) |
| Reprogrammability |
Unlimited |
None (fixed design) |
| Design Iteration |
Immediate |
Costly mask changes |
| Volume Economics |
Cost-effective for medium runs |
Better only at very high volume |
| Time-to-Market |
Rapid prototyping enabled |
Extended development cycle |
| Risk Level |
Minimal (design changes supported) |
High (costly errors) |
Programming and Development Ecosystem
ISE Development Suite Support
The XC2S200-6FGG827C receives comprehensive support from Xilinx ISE Design Suite, providing:
- Schematic and HDL design entry (VHDL, Verilog)
- Synthesis optimization for Spartan-II architecture
- Timing-driven place and route algorithms
- Comprehensive timing analysis tools
- In-system debugging capabilities
- ChipScope Pro logic analyzer integration
Design Implementation Flow
- Design Entry: HDL coding or schematic capture
- Synthesis: Logic optimization and technology mapping
- Implementation: Place and route with timing closure
- Verification: Functional and timing simulation
- Configuration: Bitstream generation and device programming
Power Consumption Characteristics
Voltage and Current Requirements
| Supply |
Voltage |
Typical Current |
Purpose |
| VCCINT |
2.5V |
Design-dependent |
Core logic power |
| VCCO Bank 0-7 |
1.5V-3.3V |
I/O-dependent |
Output driver power |
| VCCAUX |
2.5V |
~30-50 mA |
Auxiliary circuits |
The XC2S200-6FGG827C implements segmented routing architecture to minimize dynamic power consumption while maintaining high performance. Actual power requirements depend heavily on design complexity, operating frequency, and I/O activity.
Quality and Reliability Standards
Manufacturing and Testing
Every XC2S200-6FGG827C device undergoes rigorous quality assurance:
- 100% functional testing at multiple temperature points
- Scan-based manufacturing test coverage
- IEEE 1149.1 JTAG boundary-scan compliance
- Electrical parameter verification
- Package integrity inspection
Environmental Compliance
- RoHS compliant (lead-free option with “G” designation)
- REACH regulation compliance
- Moisture Sensitivity Level (MSL) rated
- Halogen-free options available
Storage and Ordering Information
Part Number Breakdown
XC2S200-6FGG827C
- XC2S200: Device family and gate count
- -6: Speed grade (highest performance)
- FGG: Fine-pitch BGA package (Green/Pb-free)
- 827: Pin count
- C: Commercial temperature range (0°C to +85°C)
Recommended Storage Conditions
| Parameter |
Specification |
| Storage Temperature |
-65°C to +150°C |
| Operating Temperature |
0°C to +85°C (C grade) |
| Moisture Sensitivity |
MSL 3 (168 hours floor life) |
| ESD Sensitivity |
Class 1 (>1000V HBM) |
Design Resources and Documentation
Essential Documentation
- DS001 Spartan-II Family Datasheet (complete specifications)
- UG002 Spartan-II Platform FPGA User Guide
- XAPP176 Configuration and Readback Application Note
- Package and Pinout Specifications
- IEEE 1149.1 BSDL Files
Community and Support
Engineers selecting the XC2S200-6FGG827C gain access to extensive resources including reference designs, application notes, technical forums, and FAE support through authorized distributors.
Migration Path and Design Scalability
Device Family Comparison
| Device |
Logic Cells |
System Gates |
Block RAM |
Max I/O |
| XC2S50 |
1,728 |
50,000 |
32 Kbits |
176 |
| XC2S100 |
2,700 |
100,000 |
40 Kbits |
176 |
| XC2S150 |
3,888 |
150,000 |
48 Kbits |
260 |
| XC2S200 |
5,292 |
200,000 |
56 Kbits |
284 |
The Spartan-II family architecture ensures pin-compatible migration paths within common package options, enabling design scalability without PCB redesign.
Why Choose the XC2S200-6FGG827C
Key Value Propositions
- Maximum Logic Density: Largest Spartan-II device with 200K gates
- Highest Performance: -6 speed grade delivers 263 MHz operation
- Extensive I/O Options: 284 user I/O pins with 16 standard support
- Advanced Features: Four DLLs, 56 Kbits Block RAM, ISE tool support
- Cost-Effective: Superior price-performance vs. competing solutions
- Proven Reliability: Mature Spartan-II architecture with extensive deployment history
Industry Recognition
The Spartan-II family has established itself as an industry-standard FPGA solution, with millions of units deployed across diverse applications worldwide. The XC2S200-6FGG827C represents the flagship device in this proven family.
Getting Started with XC2S200-6FGG827C
Recommended Development Path
- Evaluation: Obtain development board with XC2S200 device
- Tool Setup: Install Xilinx ISE Design Suite
- Tutorial Completion: Work through basic design examples
- Reference Design: Adapt application-specific reference designs
- Prototyping: Implement and test core functionality
- Optimization: Refine timing, resource utilization, power
- Production: Scale to manufacturing volumes
Procurement Considerations
When sourcing the XC2S200-6FGG827C, consider:
- Lead times from authorized distributors
- Minimum order quantities for best pricing
- Configuration memory requirements (PROM sizing)
- Development kit availability
- Technical support access
For comprehensive information about Xilinx FPGA product selection, cross-reference alternatives, and design resources, consult with authorized distributors and technical representatives who can provide application-specific guidance.
Technical Support and Resources
Getting Technical Assistance
Designers implementing the XC2S200-6FGG827C can access multiple support channels:
- Authorized distributor FAE teams
- Xilinx online technical support portal
- Community forums and user groups
- Third-party design service providers
- University programs and training workshops
Continuous Innovation
While the Spartan-II family represents a mature, stable platform, ongoing software updates continue to enhance design tools, provide new reference designs, and address customer-reported issues, ensuring long-term support for deployed designs.
