Overview: AMD Xilinx XC3S500E-4FTG256I FPGA Specifications
The XC3S500E-4FTG256I is a high-performance Field Programmable Gate Array (FPGA) from AMD’s renowned Spartan-3E family. This industrial-grade programmable logic device delivers exceptional flexibility and processing power for demanding embedded systems applications. Featuring 500,000 system gates and operating across an extended temperature range, this FPGA provides the perfect balance of performance, power efficiency, and cost-effectiveness for modern digital designs.
Built on advanced 90nm CMOS technology, the XC3S500E-4FTG256I offers superior reliability and energy efficiency. Whether you’re designing telecommunications equipment, industrial automation systems, automotive control modules, or advanced consumer electronics, this Xilinx FPGA delivers the configurable logic resources and I/O flexibility your project demands.
Key Features and Benefits
Core FPGA Specifications
The XC3S500E-4FTG256I incorporates cutting-edge features that make it ideal for complex digital logic implementations:
- 500,000 System Gates: Ample logic capacity for sophisticated designs
- 10,476 Logic Cells: Provides extensive configurable logic resources
- Speed Grade -4: Industrial-grade performance with reliable operation
- 190 User I/O Pins: Flexible connectivity for diverse interface requirements
- 256-pin FTBGA Package: Space-efficient Fine-Pitch Ball Grid Array footprint
- 90nm CMOS Technology: Enhanced power efficiency and performance
- 1.2V Core Voltage: Low power consumption for battery-operated applications
Extended Temperature Range Performance
The “I” designation in XC3S500E-4FTG256I signifies Industrial temperature grade operation:
- Operating Temperature: -40°C to +100°C (TJ)
- Voltage Supply Range: 1.14V to 1.26V
- Maximum System Frequency: 572MHz
- Enhanced Reliability: Designed for harsh environmental conditions
Technical Specifications Table
| Parameter |
Specification |
| Part Number |
XC3S500E-4FTG256I |
| Manufacturer |
AMD (formerly Xilinx Inc.) |
| Product Family |
Spartan-3E FPGA |
| System Gates |
500,000 |
| Logic Cells |
10,476 |
| Maximum Frequency |
572 MHz |
| Technology Node |
90nm CMOS |
| Core Voltage |
1.2V (1.14V – 1.26V) |
| I/O Pins |
190 |
| Package Type |
256-FTBGA (Fine-Pitch Ball Grid Array) |
| Temperature Grade |
Industrial (-40°C to +100°C) |
| Mounting Type |
Surface Mount |
| RoHS Compliance |
RoHS3 Compliant |
| Lead Time |
12 weeks (typical) |
Pin Configuration and Package Details
256-FTBGA Package Information
| Package Attribute |
Details |
| Total Pins |
256 |
| Package Format |
FTBGA (Fine-Pitch Ball Grid Array) |
| Mounting |
Surface Mount Technology (SMT) |
| Pin Pitch |
Fine-pitch configuration for high-density boards |
| User I/O |
190 configurable I/O pins |
| Footprint |
Compact design optimized for space-constrained applications |
I/O Capabilities
The XC3S500E-4FTG256I provides versatile I/O options including:
- Multiple I/O standards support (LVTTL, LVCMOS, LVDS, etc.)
- Differential signaling capabilities
- Programmable drive strength
- Configurable pull-up/pull-down resistors
- Hot-swappable I/O support
Memory and Logic Resources
On-Chip Memory Architecture
| Memory Type |
Capacity |
| Total Memory Bits |
368,640 bits |
| Block RAM |
Distributed throughout logic fabric |
| Configuration Memory |
Non-volatile programming storage |
| Embedded RAM Blocks |
Configurable dual-port RAM |
Logic Resource Distribution
- Configurable Logic Blocks (CLBs): Core building blocks for digital logic
- Distributed RAM: Flexible memory implementation
- Digital Clock Managers (DCMs): Advanced clock management and distribution
- Multipliers: Dedicated DSP48 slices for arithmetic operations
- Look-Up Tables (LUTs): Efficient logic function implementation
Application Areas and Use Cases
Primary Applications
The XC3S500E-4FTG256I excels in diverse application domains:
Telecommunications and Networking
- Protocol converters and bridges
- Network packet processing
- Baseband processing
- Software-defined radio (SDR) systems
- Telecommunications infrastructure equipment
Industrial Automation
- Motor control systems
- Programmable Logic Controllers (PLCs)
- Process monitoring and control
- Industrial communication interfaces
- Machine vision systems
Automotive Electronics
- Advanced Driver Assistance Systems (ADAS)
- Electronic Control Units (ECUs)
- Infotainment system processing
- Vehicle network gateways
- Diagnostic interfaces
Consumer Electronics
- High-definition video processing
- Audio/video encoding and decoding
- Gaming systems and peripherals
- Smart home automation hubs
- Digital signal processing applications
Design and Development Tools
Software Development Environment
Xilinx provides comprehensive development tools for the XC3S500E-4FTG256I:
- Vivado Design Suite: Modern FPGA design platform with intuitive workflow
- ISE Design Tools: Legacy toolchain for Spartan-3E family support
- Embedded Development Kit: Complete solution for embedded processor design
- IP Core Library: Pre-verified intellectual property blocks
- Simulation Tools: ModelSim, ISIM for design verification
Evaluation and Development Boards
Several development platforms support the Spartan-3E family:
- Spartan-3E Starter Kit
- Custom evaluation boards
- Third-party development platforms
- Compatible with standard JTAG programmers
Comparison with Alternative Models
XC3S500E Family Variants
| Model |
Temperature Grade |
Package |
| XC3S500E-4FTG256I |
Industrial (-40°C to +100°C) |
256-FTBGA |
| XC3S500E-4FTG256C |
Commercial (0°C to +85°C) |
256-FTBGA |
| XC3S500E-4PQ208I |
Industrial (-40°C to +100°C) |
208-PQFP |
| XC3S500E-5FTG256I |
Industrial (Speed Grade -5) |
256-FTBGA |
Key Differentiators
The industrial-grade XC3S500E-4FTG256I offers:
- Extended temperature range for harsh environments
- Enhanced reliability specifications
- Greater operating margin versus commercial variants
- Long-term availability for industrial applications
Quality and Compliance
Industry Standards and Certifications
- RoHS3 Compliant: Lead-free and environmentally friendly
- ISO 9001 Manufacturing: Quality management certified production
- Automotive Grade Options: AEC-Q100 qualified variants available
- Military/Aerospace Versions: XQR variants for defense applications
Quality Assurance
AMD Xilinx implements rigorous quality control:
- 100% electrical testing
- Temperature cycling qualification
- Moisture sensitivity level classification
- Electrostatic discharge (ESD) protection
- Long-term reliability testing
Ordering and Availability
Part Number Breakdown
XC3S500E-4FTG256I nomenclature explained:
- XC: Xilinx Commercial/Industrial product line
- 3S: Spartan-3 FPGA family
- 500E: Enhanced version with 500K gates
- -4: Speed grade (performance level)
- FTG256: Fine-pitch BGA with 256 pins
- I: Industrial temperature grade
Package and Delivery
- Standard Packaging: Tray packaging for automated pick-and-place
- Tube Packaging: Available upon request
- Lead Time: Typically 12 weeks from major distributors
- Stock Availability: Check with authorized distributors for current inventory
Installation and Integration
PCB Design Considerations
When designing with the XC3S500E-4FTG256I:
Layout Requirements
- Multi-layer PCB recommended (minimum 4 layers)
- Controlled impedance traces for high-speed signals
- Adequate power plane design for stable voltage distribution
- Thermal vias under BGA package for heat dissipation
Power Supply Design
- Decoupling capacitors near each power pin
- Dedicated voltage regulators for core and I/O supplies
- Power sequencing considerations
- Inrush current management
Signal Integrity
- Length matching for differential pairs
- Proper termination for high-speed interfaces
- Ground plane continuity
- EMI/EMC compliance measures
Programming and Configuration
Configuration Options
The XC3S500E-4FTG256I supports multiple configuration modes:
- JTAG Programming: Development and debugging
- Serial Flash: Boot from external SPI memory
- Parallel Flash: High-speed configuration
- Platform Flash PROM: Dedicated configuration memory
- SystemACE: Compact Flash-based configuration
Configuration Memory Requirements
- Configuration bitstream size varies by design utilization
- External configuration memory selection based on application
- Optional compression for reduced memory footprint
- Multi-boot configuration support
Performance Optimization Tips
Maximizing FPGA Performance
To achieve optimal results with the XC3S500E-4FTG256I:
- Clock Domain Management: Proper synchronization between clock domains
- Pipelining: Insert registers to improve maximum frequency
- Resource Utilization: Balance logic, memory, and DSP resources
- Timing Constraints: Define accurate timing requirements
- Power Optimization: Enable clock gating and power reduction features
Design Best Practices
- Partition design into functional modules
- Use hierarchical design methodology
- Implement comprehensive testbenches
- Perform timing analysis at multiple corners
- Validate design with hardware-in-the-loop testing
Support and Documentation
Technical Resources
AMD Xilinx provides extensive documentation:
- Product datasheet with electrical characteristics
- User guide for Spartan-3E family architecture
- Application notes for specific implementations
- Reference designs and example projects
- Technical support through community forums
Community and Ecosystem
- Active TechForum community support
- Third-party IP vendors
- Design service partners
- Training and certification programs
- Regular webinars and technical workshops
Frequently Asked Questions
What is the difference between XC3S500E-4FTG256I and XC3S500E-4FTG256C?
The primary difference is the temperature grade. The “I” variant operates across industrial temperature range (-40°C to +100°C), while the “C” variant is commercial grade (0°C to +85°C). Industrial-grade devices offer enhanced reliability for harsh environments.
Can I use Vivado Design Suite for the XC3S500E-4FTG256I?
While Vivado is Xilinx’s current design platform, the Spartan-3E family is primarily supported by ISE Design Tools. However, you can use IP cores and convert designs between toolchains with proper migration procedures.
What development boards support the XC3S500E-4FTG256I?
The Spartan-3E Starter Kit (available from distributors) supports the XC3S500E family. Additionally, various third-party boards and custom evaluation platforms are available from design partners.
Is the XC3S500E-4FTG256I suitable for automotive applications?
While this is an industrial-grade device, automotive applications typically require AEC-Q100 qualified components. Consult with AMD Xilinx or authorized distributors for automotive-grade variants if required.
What is the expected product lifespan?
The XC3S500E-4FTG256I is currently listed as “Last Time Buy” status, indicating it’s approaching end-of-life. For new designs requiring long-term availability, consider migration to current Spartan-7 or Artix-7 families.
Conclusion
The XC3S500E-4FTG256I represents a mature, reliable FPGA solution for industrial applications requiring extended temperature operation and proven technology. With 500,000 system gates, 190 I/O pins, and comprehensive design tool support, this industrial-grade device continues to serve critical roles in telecommunications, industrial automation, automotive systems, and embedded applications worldwide.
Whether you’re maintaining existing designs or evaluating FPGA solutions for new projects, the XC3S500E-4FTG256I delivers the performance, flexibility, and reliability that engineers expect from the Spartan-3E family. For the latest Xilinx FPGA solutions and comprehensive technical support, explore the full range of AMD programmable logic devices available through authorized distributors.
