The XC2S200-6FGG826C is a premium field-programmable gate array (FPGA) from AMD Xilinx’s renowned Spartan-II family. Designed for engineers and developers seeking cost-effective programmable logic solutions, this FPGA delivers exceptional performance with 200,000 system gates, making it an ideal choice for digital signal processing, industrial automation, telecommunications, and embedded system development.
Overview of XC2S200-6FGG826C FPGA
The XC2S200-6FGG826C represents the pinnacle of the Spartan-II series, offering maximum configurability in an 826-ball Fine-Pitch Ball Grid Array (FBGA) package. This advanced FPGA combines high logic density with superior I/O capabilities, enabling complex digital designs while maintaining energy efficiency and cost-effectiveness.
Key Features and Specifications
The XC2S200-6FGG826C stands out with its comprehensive feature set designed for demanding applications:
| Feature |
Specification |
| Device Family |
Spartan-II |
| Manufacturer |
AMD Xilinx |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 (1,176 CLBs) |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Maximum User I/O |
284 pins |
| Package Type |
FGG826 (826-ball FBGA) |
| Speed Grade |
-6 (High Performance) |
| Core Voltage |
2.5V |
| Technology Node |
0.18μm |
| Operating Frequency |
Up to 263 MHz |
Technical Architecture and Design Capabilities
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG826C features 1,176 CLBs arranged in a 28×42 matrix, providing exceptional flexibility for implementing complex digital circuits. Each CLB contains:
- Four logic slices with look-up tables (LUTs)
- Fast carry logic for arithmetic operations
- Dedicated multiplexers for efficient data routing
- Flip-flops for sequential logic implementation
Memory Architecture
This FPGA offers dual-layer memory architecture for versatile data storage needs:
Distributed RAM:
- 75,264 bits of distributed memory
- Ideal for small, fast memory applications
- Configurable as single or dual-port RAM
Block RAM:
- 56 Kbits organized in dedicated memory blocks
- Supports high-speed data buffering
- Perfect for FIFO implementations and data caching
I/O Capabilities
With 284 maximum user I/O pins, the FGG826 package provides the highest I/O count in the XC2S200 family:
| Package |
Available I/O Pins |
Package Size |
| FGG826 |
284 |
826-ball FBGA |
| FG456 |
284 |
456-ball FBGA |
| PQ208 |
176 |
208-pin PQFP |
| FG256 |
176 |
256-ball FBGA |
Applications and Use Cases
Digital Signal Processing (DSP)
The XC2S200-6FGG826C excels in DSP applications including:
- Audio signal processing and filtering
- Image and video processing algorithms
- Software-defined radio (SDR) implementations
- Real-time data acquisition systems
- Adaptive filtering and pattern recognition
Industrial Automation and Control
Industrial applications benefit from the FPGA’s reliability and reconfigurability:
- Motor control systems with PWM generation
- Programmable logic controllers (PLCs)
- Factory automation interfaces
- Process monitoring and control
- Sensor data acquisition and processing
Telecommunications Infrastructure
The high I/O count makes this FPGA ideal for communication systems:
- Protocol conversion and implementation
- Network packet processing
- Digital baseband processing
- Channel encoding and decoding
- Interface bridging between communication standards
Embedded System Development
Developers leverage the XC2S200-6FGG826C for:
- Custom processor interfaces
- Peripheral controllers
- Hardware acceleration modules
- System-on-chip (SoC) prototyping
- Algorithm implementation and testing
Performance Specifications and Speed Grade
Speed Grade -6 Characteristics
The -6 speed grade designation indicates high-performance operation with optimized timing characteristics:
| Parameter |
Value |
| Maximum Clock Frequency |
263 MHz |
| Setup Time |
Optimized for -6 grade |
| Clock-to-Output Delay |
Minimal propagation |
| Temperature Range |
Commercial (0°C to 85°C) |
Power Consumption Profile
Operating at 2.5V core voltage, the XC2S200-6FGG826C maintains efficient power consumption:
- Low static power dissipation
- Dynamic power scaling based on utilization
- Power-down modes for unused resources
- Optimized for battery-powered applications
Package Information: FGG826 FBGA
Physical Characteristics
The Fine-Pitch Ball Grid Array package offers superior electrical and thermal performance:
| Package Attribute |
Specification |
| Package Code |
FGG826 |
| Ball Count |
826 balls |
| Package Type |
Fine-Pitch BGA |
| Form Factor |
Square |
| Ball Pitch |
Fine pitch (0.8mm typical) |
| Mounting |
Surface mount |
Thermal and Reliability Features
- Enhanced thermal dissipation through BGA structure
- Pb-free (RoHS compliant) options available
- High reliability for mission-critical applications
- Suitable for automated assembly processes
Development and Programming Support
Design Tools Compatibility
The XC2S200-6FGG826C integrates seamlessly with industry-standard development tools:
- Xilinx ISE Design Suite
- Vivado Design Suite (with legacy support)
- Third-party synthesis tools
- VHDL and Verilog HDL support
- Schematic entry options
Configuration Options
Multiple configuration methods provide flexibility:
- JTAG boundary scan programming
- Serial peripheral interface (SPI) configuration
- Slave parallel configuration
- Master serial configuration mode
- In-system reconfiguration capability
Comparison with Other Spartan-II Devices
XC2S200 Family Variants
| Part Number |
Package |
I/O Pins |
Best For |
| XC2S200-6FGG826C |
826-ball FBGA |
284 |
Maximum I/O applications |
| XC2S200-6FG456 |
456-ball FBGA |
284 |
High-density designs |
| XC2S200-6PQ208 |
208-pin PQFP |
176 |
Standard applications |
| XC2S200-6FG256 |
256-ball FBGA |
176 |
Compact solutions |
Quality and Reliability Standards
Manufacturing Excellence
AMD Xilinx ensures exceptional quality through:
- ISO 9001:2015 certified manufacturing
- Comprehensive testing and validation
- Extended temperature range options
- Long-term availability commitment
- Authentic component traceability
Industry Certifications
- RoHS compliant options (lead-free)
- Commercial temperature grade certified
- ESD protection standards compliance
- Automotive-grade variants available for specific applications
Integration with FPGA Ecosystems
For comprehensive solutions and broader Xilinx FPGA product portfolios, designers can explore the full range of Spartan, Artix, Kintex, and Virtex families to match specific application requirements. The Spartan-II series remains a proven choice for legacy system support and cost-sensitive new designs.
Advantages Over Alternative Solutions
Versus ASICs
The XC2S200-6FGG826C provides significant benefits compared to mask-programmed ASICs:
- Zero NRE costs: No initial development expenses
- Rapid prototyping: Instant design iteration
- Field upgradability: Update logic without hardware changes
- Lower risk: Test before committing to production
- Faster time-to-market: Weeks instead of months
Versus Other FPGAs
Competitive advantages within the FPGA market:
- Optimal price-performance ratio
- Proven reliability in high-volume production
- Extensive documentation and support
- Large installed base and community resources
- Compatible with established design methodologies
Ordering and Availability Information
Part Number Breakdown
Understanding the XC2S200-6FGG826C designation:
- XC2S200: Device family and gate count (200K gates)
- -6: Speed grade (high performance)
- FGG826: Package type (826-ball fine-pitch BGA)
- C: Commercial temperature range (0°C to 85°C)
Procurement Considerations
When sourcing the XC2S200-6FGG826C:
- Verify authentic AMD Xilinx components
- Check date codes for recent production
- Confirm lead-free requirements if needed
- Request certificates of conformance
- Consider authorized distributor channels
Technical Support and Resources
Documentation Access
Essential resources for developers:
- Spartan-II Family Data Sheet (DS001)
- FGG826 package specifications
- Pin assignment diagrams
- Timing analysis reports
- Application notes and design guides
Community and Support
- AMD Xilinx technical forums
- Design consultation services
- Reference designs and IP cores
- Training and certification programs
- Migration guides from legacy devices
Frequently Asked Questions
Q: What is the difference between FGG826 and FG456 packages? A: Both support 284 I/O pins for the XC2S200, but the FGG826 offers a larger ball count (826 vs 456) with different ball pitch and physical dimensions, providing options for different PCB design requirements.
Q: Can the XC2S200-6FGG826C be used for high-speed serial communications? A: While capable of parallel I/O at high speeds, this Spartan-II device does not include dedicated high-speed serial transceivers. For gigabit serial links, consider newer Xilinx families like Artix or Kintex.
Q: What is the maximum operating frequency? A: The -6 speed grade supports clock frequencies up to 263 MHz, with actual performance dependent on design complexity and routing efficiency.
Q: Is this FPGA suitable for new designs? A: While the Spartan-II family is mature and considered legacy, it remains excellent for cost-sensitive applications, legacy system support, and educational purposes. For new high-performance designs, newer families offer enhanced capabilities.
Q: What development tools are required? A: The Xilinx ISE Design Suite (ISE 14.7 is the final version) fully supports the Spartan-II family, including synthesis, implementation, and programming tools.
Conclusion: Why Choose XC2S200-6FGG826C
The XC2S200-6FGG826C represents a mature, reliable FPGA solution backed by decades of proven performance in production environments. Its combination of 200,000 system gates, 284 I/O pins, and the high-density FGG826 package makes it an exceptional choice for applications requiring extensive I/O connectivity and moderate logic complexity.
Whether you’re developing industrial control systems, telecommunications equipment, or embedded processing platforms, the XC2S200-6FGG826C delivers the programmability, performance, and cost-effectiveness needed for successful product deployment. The extensive documentation, mature tool support, and large knowledge base ensure streamlined development from concept to production.
For engineers seeking a dependable FPGA with maximum I/O capabilities in the Spartan-II family, the XC2S200-6FGG826C stands as the optimal selection, combining proven technology with exceptional value.
