The XC2S200-6FGG823C represents a powerful and versatile field-programmable gate array (FPGA) solution from the renowned Spartan-II family. Manufactured using advanced 0.18-micron CMOS technology, this FPGA delivers exceptional performance for complex digital designs, embedded systems, and industrial automation applications. With 200,000 system gates and 5,292 configurable logic cells, the XC2S200-6FGG823C provides engineers with substantial programmable resources to implement sophisticated digital circuits efficiently.
This FPGA features a premium 823-ball Fine-pitch Ball Grid Array (FBGA) package, offering superior I/O density and enhanced thermal performance for demanding applications. The -6 speed grade ensures optimal performance across commercial temperature ranges, making it an ideal choice for telecommunications, industrial control systems, and high-speed data processing applications.
Key Technical Specifications
Core Architecture and Logic Resources
| Specification |
Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array Configuration |
28 x 42 (1,176 total CLBs) |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits (56,000 bits) |
| Maximum User I/O Pins |
284 |
| Speed Grade |
-6 (High Performance) |
| Core Voltage |
2.5V ± 5% |
| Technology Node |
0.18µm CMOS |
Package Information
| Package Parameter |
Specification |
| Package Type |
FGG823 Fine-pitch Ball Grid Array |
| Total Balls |
823 |
| Package Technology |
Pb-free (RoHS Compliant) |
| Temperature Range |
Commercial (0°C to +85°C) |
| Mounting Type |
Surface Mount |
Performance Characteristics
| Performance Metric |
Specification |
| Maximum Frequency |
Up to 263 MHz |
| Pin-to-Pin Delay |
As low as 3.8ns |
| Clock Distribution |
4 Delay-Locked Loops (DLLs) |
| I/O Standards Support |
LVTTL, LVCMOS, SSTL, HSTL, GTL+ |
| Voltage Compatibility |
Multi-voltage I/O interface |
Advanced Features and Capabilities
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG823C incorporates 1,176 Configurable Logic Blocks arranged in a 28×42 array, providing exceptional flexibility for implementing complex digital logic. Each CLB contains:
- Four 4-input Look-Up Tables (LUTs) for combinatorial logic
- Two flip-flops for sequential logic implementation
- Dedicated carry logic for efficient arithmetic operations
- Multiplexer resources for data routing optimization
Memory Architecture
The device features a robust dual-tier memory architecture:
Distributed RAM: 75,264 bits of flexible distributed memory integrated within CLBs, ideal for small buffers, FIFOs, and lookup tables.
Block RAM: 56 Kbits organized in dual-port synchronous RAM blocks, perfect for larger data storage requirements, packet buffers, and high-speed data caching.
Clock Management System
Four independent Delay-Locked Loops (DLLs) provide sophisticated clock management capabilities:
- Precise clock de-skewing and phase shifting
- Clock frequency multiplication and division
- Low-jitter clock distribution across the entire FPGA
- Support for multiple independent clock domains
Primary Applications and Use Cases
Telecommunications and Networking
The XC2S200-6FGG823C excels in telecommunications infrastructure, enabling implementation of:
- Protocol converters and translators
- Network packet processing engines
- Digital signal processing for communication systems
- Baseband processing for wireless applications
- High-speed data serialization/deserialization
Industrial Automation and Control
Industrial applications benefit from the FPGA’s reliability and configurability:
- Motor control systems with precision timing
- PLC (Programmable Logic Controller) implementations
- Industrial protocol interfaces (Profibus, CANbus, Modbus)
- Machine vision and image processing
- Real-time sensor data acquisition systems
Digital Signal Processing
DSP applications leverage the FPGA’s computational resources:
- Digital filtering and signal conditioning
- FFT (Fast Fourier Transform) implementations
- Audio and video processing pipelines
- Software-defined radio components
- Radar and sonar signal processing
Consumer Electronics
Consumer applications requiring programmable logic:
- High-definition video processing and conversion
- Gaming console interfaces
- Digital camera image processing
- Set-top box functionality
- Display controllers and interfaces
Design and Development Ecosystem
Software Tools and Support
Designers working with the XC2S200-6FGG823C have access to comprehensive development tools:
- ISE Design Suite: Industry-standard FPGA design software for synthesis, implementation, and verification
- ChipScope Pro: Integrated logic analyzer for real-time debugging
- IP Core Libraries: Pre-verified IP blocks for common functions
- Simulation Tools: ModelSim integration for behavioral and timing simulation
Design Resources
Extensive documentation and support materials include:
- Comprehensive datasheets with AC/DC specifications
- Application notes covering common design patterns
- Reference designs for rapid prototyping
- Technical support from authorized distributors
Pin Configuration and I/O Standards
Flexible I/O Banking
The XC2S200-6FGG823C features multiple I/O banks, each supporting independent voltage levels and I/O standards. This flexibility enables:
- Mixed-voltage interface designs (1.5V to 3.3V)
- Direct interfacing with various components
- Reduced need for external level shifters
- Enhanced signal integrity through matched impedance
Supported I/O Standards
| I/O Standard |
Voltage Level |
Application |
| LVTTL |
3.3V |
General purpose logic |
| LVCMOS33 |
3.3V |
CMOS interfaces |
| LVCMOS25 |
2.5V |
Low voltage CMOS |
| LVCMOS18 |
1.8V |
Advanced low voltage |
| SSTL-2/3 |
Various |
DDR memory interfaces |
| HSTL |
Various |
High-speed transceiver logic |
| GTL+ |
1.5V |
Backplane applications |
Comparison with Alternative Solutions
XC2S200-6FGG823C vs. Standard ASIC
| Feature |
XC2S200-6FGG823C |
Standard ASIC |
| Development Time |
Weeks |
6-18 months |
| Initial Cost |
Low |
Very High (NRE) |
| Flexibility |
Full reprogramming |
Fixed design |
| Design Updates |
Field-upgradable |
Requires new fabrication |
| Time-to-Market |
Fast |
Slow |
| Volume Economics |
Cost-effective for low-medium |
Better for very high volume |
Performance Advantages
The XC2S200-6FGG823C delivers superior value through:
- Rapid prototyping: Design iterations in hours instead of months
- Risk mitigation: Test and validate before committing to production
- Field updates: Fix bugs and add features without hardware changes
- Lower barriers to entry: No expensive mask costs or minimum order quantities
Power Consumption and Thermal Management
Power Specifications
| Power Parameter |
Typical Value |
Maximum Value |
| Core Supply (VCCINT) |
2.5V |
2.625V |
| I/O Supply (VCCO) |
Variable |
3.465V |
| Static Power |
~150mW |
Varies with configuration |
| Dynamic Power |
Application-dependent |
Design-specific |
Thermal Considerations
The FGG823 package provides excellent thermal dissipation characteristics:
- Large thermal pad for efficient heat transfer
- Suitable for natural convection cooling in many applications
- Compatible with heat sinks for high-performance requirements
- Junction temperature monitoring capability
Quality and Reliability
Manufacturing Standards
The XC2S200-6FGG823C meets stringent quality requirements:
- Manufactured in ISO 9001 certified facilities
- RoHS compliant (lead-free) packaging
- Comprehensive production testing
- Extended temperature screening available
Reliability Metrics
Proven reliability characteristics include:
- MTBF (Mean Time Between Failures): >1 million hours
- ESD protection: HBM >2000V, CDM >500V
- Latch-up immunity: >100mA
- Moisture sensitivity level: MSL-3
Purchasing and Availability
Ordering Information
When ordering the XC2S200-6FGG823C, the complete part number breakdown is:
- XC2S200: Device family and gate count
- -6: Speed grade (highest commercial grade)
- FGG823: Package type (823-ball FBGA)
- C: Commercial temperature range (0°C to +85°C)
Authorized Distribution Channels
Obtain genuine XC2S200-6FGG823C components through:
- Authorized Xilinx FPGA distributors
- Factory-direct procurement for volume orders
- Certified electronic component suppliers
- Regional sales representatives
Packaging Options
Standard packaging configurations include:
- Trays for automated pick-and-place assembly
- Anti-static handling and storage
- Moisture barrier bags for sensitive components
- Industry-standard shipping containers
Design Best Practices
PCB Layout Recommendations
For optimal performance when designing with the XC2S200-6FGG823C:
- Implement proper power plane distribution with adequate decoupling
- Route high-speed signals using controlled impedance traces
- Maintain appropriate clearances for signal integrity
- Use ground planes for EMI reduction
- Follow manufacturer spacing guidelines for BGA fanout
Configuration and Programming
The FPGA supports multiple configuration modes:
- Master Serial Mode: FPGA controls configuration PROM
- Slave Serial Mode: External controller manages configuration
- Boundary Scan (JTAG): Standard programming and debugging interface
- SelectMAP: Parallel configuration for faster loading
Technical Support and Resources
Documentation Access
Comprehensive technical documentation includes:
- Complete datasheet with electrical specifications
- User guides for architecture and programming
- Package mechanical drawings and land patterns
- Application notes for specific use cases
- Errata documents and known issues
Development Community
Join a vibrant ecosystem of FPGA developers:
- Online forums and discussion groups
- Design examples and reference implementations
- Video tutorials and training materials
- Regular webinars on advanced topics
- University programs and educational resources
Summary: Why Choose XC2S200-6FGG823C
The XC2S200-6FGG823C stands out as a versatile, high-performance FPGA solution offering:
✓ Substantial Logic Resources: 200,000 system gates for complex designs ✓ High I/O Count: 284 user I/O pins with flexible voltage support ✓ Advanced Package: 823-ball FBGA for maximum connectivity ✓ Proven Reliability: Established Spartan-II architecture ✓ Cost-Effective: Superior price-to-performance ratio ✓ Comprehensive Tools: Industry-leading design software support ✓ Field Programmable: Update designs without hardware changes ✓ Wide Application Range: Suitable for industrial, telecom, and consumer markets
Whether you’re developing next-generation telecommunications equipment, advanced industrial control systems, or innovative consumer electronics, the XC2S200-6FGG823C provides the programmable logic foundation needed to bring your designs to life efficiently and economically.
Frequently Asked Questions
Q: What development software is required for the XC2S200-6FGG823C? A: The primary tool is Xilinx ISE Design Suite (webpack or full version), which provides synthesis, implementation, and programming capabilities. The free webpack version supports Spartan-II devices.
Q: Can the XC2S200-6FGG823C be reprogrammed in-circuit? A: Yes, the device supports in-system programming through JTAG interface, allowing field updates and design modifications without removing the chip from the board.
Q: What is the difference between speed grades -5 and -6? A: The -6 speed grade offers better performance with lower propagation delays and higher maximum operating frequencies compared to -5, making it suitable for timing-critical applications.
Q: Is the FGG823 package compatible with standard PCB assembly processes? A: Yes, the FGG823 package is designed for standard surface mount technology (SMT) reflow assembly processes used in high-volume manufacturing.
Q: What configuration memory options are available? A: The XC2S200-6FGG823C can be configured from external serial PROMs, parallel Flash, or via JTAG. Xilinx Platform Flash PROMs provide a reliable, non-volatile configuration storage solution.
