The XA3S50-4PQG208Q is an automotive-qualified Field Programmable Gate Array (FPGA) from AMD Xilinx’s XA Spartan-3 family, specifically designed for high-volume, cost-sensitive automotive and industrial applications. This robust programmable logic device combines 50,000 system gates with AEC-Q100 qualification, making it an ideal choice for demanding embedded systems requiring exceptional reliability and performance.
Overview of XA3S50-4PQG208Q Automotive FPGA
The XA3S50-4PQG208Q represents a breakthrough in automotive electronics, offering programmable logic solutions that meet stringent automotive industry standards. Built on advanced 90nm CMOS technology, this Xilinx FPGA delivers superior performance while maintaining the flexibility and reconfigurability that modern automotive applications demand.
Key Technical Specifications
Core Architecture Features
| Specification |
Value |
| System Gates |
50,000 |
| Logic Cells |
1,728 |
| CLB Array |
8 x 16 |
| Total Block RAM |
36 Kbits (2 blocks) |
| Distributed RAM |
12 Kbits |
| Maximum User I/O |
124 pins |
| Differential I/O Pairs |
56 pairs |
| DCMs |
2 Digital Clock Managers |
| 18×18 Multipliers |
4 dedicated |
Package and Environmental Specifications
| Parameter |
Details |
| Package Type |
208-Pin Plastic Quad Flat Pack (PQFP) |
| Package Code |
PQG208 |
| Body Dimensions |
28mm × 28mm |
| Speed Grade |
-4 (630 MHz system performance) |
| Temperature Range |
-40°C to +125°C (Q-grade) |
| Core Voltage (VCCINT) |
1.2V (1.14V – 1.26V) |
| I/O Voltage (VCCO) |
1.2V to 3.3V |
| Automotive Qualification |
AEC-Q100 Grade 2 |
Advanced Performance Capabilities
High-Speed I/O Interface
The XA3S50-4PQG208Q supports multiple I/O standards for maximum design flexibility:
- Single-Ended Standards: LVTTL, LVCMOS (3.3V, 2.5V, 1.8V, 1.5V, 1.2V), PCI-33/66, HSTL, SSTL
- Differential Standards: LVDS, RSDS, mini-LVDS, PPDS with data rates up to 622+ Mb/s per I/O
- DCI Technology: Digitally Controlled Impedance for automatic termination
- DDR Support: DDR and DDR2 SDRAM interfaces up to 333 Mb/s
Memory Architecture
| Memory Type |
Capacity |
Configuration |
| Block RAM |
36 Kbits total |
2 × 18-Kbit blocks |
| Distributed RAM |
12 Kbits |
Within CLBs |
| Dual-Port RAM |
Supported |
Independent A/B port access |
| FIFO Support |
Yes |
Via CORE Generator |
Automotive-Specific Features
AEC-Q100 Qualification Benefits
The XA3S50-4PQG208Q meets the automotive industry’s most rigorous standards:
- Extended Temperature Performance: Operates reliably from -40°C to +125°C junction temperature
- Enhanced Reliability Testing: Comprehensive stress testing including HTOL, HTSL, and TC
- Production Part Approval Process (PPAP): Full documentation support for automotive supply chain
- Change Control: Strict PCN (Product Change Notification) procedures
- Moisture Sensitivity Level: MSL 3 rating for manufacturing confidence
Automotive Application Advantages
- Zero NRE Costs: Eliminates expensive ASIC development expenses
- Faster Time-to-Market: Rapid prototyping and deployment compared to custom silicon
- Field Upgradability: In-system programmability enables firmware updates without hardware changes
- Design Security: Configuration bitstream encryption protects intellectual property
- Obsolescence Management: Longer product lifecycle than traditional automotive semiconductors
Application Areas
Primary Automotive Applications
The XA3S50-4PQG208Q excels in automotive electronics requiring programmable logic:
- Advanced Driver Assistance Systems (ADAS): Sensor fusion, image processing, radar interfaces
- Infotainment Systems: Display controllers, audio/video processing, connectivity modules
- Instrument Clusters: Digital gauge control, CAN/LIN bus interfaces, graphics rendering
- Body Control Modules: Lighting control, door/window management, HVAC interfaces
- Gateway ECUs: Protocol translation, network routing, security functions
- Powertrain Electronics: Engine control interfaces, transmission controllers
- Battery Management Systems: Monitoring, balancing, communication in electric vehicles
Industrial and Embedded Applications
Beyond automotive, the XA3S50-4PQG208Q serves demanding industrial applications:
| Industry Sector |
Typical Applications |
| Industrial Automation |
PLC interfaces, motor control, sensor networks |
| Medical Electronics |
Patient monitoring, diagnostic equipment, imaging systems |
| Communications |
Protocol converters, network switches, telecom infrastructure |
| Aerospace/Defense |
Avionics interfaces, ruggedized systems, secure communications |
| Consumer Electronics |
Smart home devices, IoT gateways, embedded controllers |
Design and Development Resources
Supported Development Tools
- ISE Design Suite: Complete FPGA design environment (recommended for Spartan-3 family)
- Vivado Design Suite: Legacy device support for migration paths
- ChipScope Pro: Integrated logic analyzer for debugging
- CORE Generator: Pre-verified IP cores for common functions
- PlanAhead: Floorplanning and I/O planning tools
Programming and Configuration
| Configuration Mode |
Interface |
Description |
| Master Serial |
SPI Flash |
Self-booting from external memory |
| Master Parallel |
Parallel Flash |
Fast configuration from NOR flash |
| Slave Serial |
Microcontroller |
External processor-controlled configuration |
| JTAG |
IEEE 1149.1 |
Development programming and boundary scan |
| SelectMAP |
Parallel Bus |
High-speed reconfiguration interface |
Power Management and Thermal Considerations
Power Consumption Profiles
The XA3S50-4PQG208Q features efficient power management:
- Static Current: Typically 20-50 mA at 1.2V VCCINT
- Dynamic Power: Varies with logic utilization and switching frequency
- I/O Power: Dependent on VCCO voltage and output drive strength
- Configuration Power: <10 mA during FPGA programming
Thermal Management Guidelines
| Operating Condition |
Junction Temperature (TJ) |
Recommendations |
| Normal Operation |
0°C to +85°C |
Standard heatsinking for typical designs |
| Extended Automotive |
-40°C to +125°C |
Enhanced thermal management for high-reliability |
| Power-Up |
Controlled ramp |
Sequencing: VCCAUX → VCCINT → VCCO |
Comparison with Related Devices
XA Spartan-3 Family Overview
| Device |
System Gates |
Logic Cells |
Block RAM |
I/O (Max) |
Package Options |
| XA3S50 |
50,000 |
1,728 |
36 Kbits |
124 |
VQ100, PQ208 |
| XA3S200 |
200,000 |
4,320 |
216 Kbits |
141 |
VQ100, TQ144, PQ208 |
| XA3S400 |
400,000 |
8,064 |
288 Kbits |
173 |
FT256, FG456 |
| XA3S1000 |
1,000,000 |
17,280 |
432 Kbits |
221 |
FT256, FG456 |
| XA3S1500 |
1,500,000 |
29,952 |
576 Kbits |
304 |
FG456, FG676 |
Competitive Advantages
Compared to standard commercial FPGAs, the XA3S50-4PQG208Q offers:
- Automotive Qualification: Full AEC-Q100 compliance vs. commercial-grade alternatives
- Extended Temperature: -40°C to +125°C vs. 0°C to +85°C commercial range
- Enhanced Screening: Additional reliability testing beyond commercial standards
- Documentation: Complete PPAP support for automotive OEM requirements
- Longevity: Automotive product lifecycle planning and availability commitments
Quality and Reliability Standards
Testing and Validation
The XA3S50-4PQG208Q undergoes comprehensive testing:
- 100% Production Testing: Every device tested for functionality and parametrics
- Burn-In: Selected lot sampling for infant mortality elimination
- HTOL (High-Temperature Operating Life): 1000+ hours at elevated temperature
- Temperature Cycling: Multiple cycles across operating temperature range
- ESD Protection: Human Body Model >2000V, Charged Device Model >500V
Compliance and Certifications
- AEC-Q100: Automotive Electronics Council qualification
- RoHS Compliant: Lead-free and environmentally friendly
- REACH: Registration, Evaluation, Authorization of Chemicals compliance
- Conflict Minerals: Full supply chain disclosure
- ISO/TS 16949: Manufactured under automotive quality management standards
Design Guidelines and Best Practices
PCB Layout Recommendations
To ensure optimal performance of the XA3S50-4PQG208Q:
- Power Plane Design: Separate planes for VCCINT, VCCAUX, and VCCO with low-impedance distribution
- Decoupling Capacitors: Multiple ceramic capacitors (0.1µF, 0.01µF) near each power pin
- Ground Strategy: Solid ground plane with minimal discontinuities
- Signal Integrity: Controlled impedance for high-speed differential pairs
- Thermal Vias: Connect package thermal pad to ground plane for heat dissipation
Configuration Circuit Design
| Configuration Element |
Recommendation |
| Mode Pins (M[2:0]) |
10kΩ pull-up/pull-down resistors |
| PROG_B |
RC circuit with 100Ω resistor, 4.7µF capacitor |
| DONE |
330Ω pull-up resistor to VCCO |
| CCLK |
22Ω series resistor for impedance matching |
| Configuration Memory |
SPI Flash (M25P, W25Q series) or parallel NOR |
Ordering Information and Package Details
Complete Part Number Breakdown
XA3S50-4PQG208Q
- XA: Automotive qualified Xilinx device
- 3S: Spartan-3 architecture family
- 50: 50,000 system gates
- -4: Speed grade (-4 = 630 MHz performance)
- PQ: Plastic Quad Flat Pack package
- G: RoHS-compliant lead-free (Green) package
- 208: Total pin count
- Q: Extended automotive temperature range (-40°C to +125°C)
Package Dimensions and Specifications
- Package Body: 28mm × 28mm × 3.4mm maximum
- Lead Pitch: 0.5mm
- Lead Count: 208 pins
- Mounting: Surface mount technology (SMT)
- Weight: Approximately 1.5 grams
- Moisture Sensitivity: MSL 3 (168 hours at 30°C/60% RH after bag opening)
Supply Chain and Availability
Distribution Channels
The XA3S50-4PQG208Q is available through:
- Authorized Distributors: Digi-Key, Mouser, Avnet, Arrow Electronics
- Regional Distributors: Local automotive electronics suppliers
- Direct from AMD Xilinx: For high-volume automotive OEM customers
- Electronic Component Brokers: For spot purchases and urgent requirements
Lead Time Considerations
| Purchase Quantity |
Typical Lead Time |
Packaging |
| 1-25 pieces |
2-4 weeks |
Tube (40 units/tube) |
| 26-500 pieces |
4-8 weeks |
Tape & Reel (500 units/reel) |
| 500+ pieces |
8-16 weeks |
Tape & Reel or tray |
| Custom Orders |
Negotiable |
Customer-specified packaging |
Technical Support and Documentation
Available Resources
Designers working with the XA3S50-4PQG208Q have access to comprehensive documentation:
- DS314: XA Spartan-3 Automotive Family Datasheet
- DS099: Spartan-3 FPGA Family Complete Data Sheet
- UG331: Spartan-3 Generation FPGA User Guide
- UG332: Spartan-3 Generation Configuration User Guide
- XAPP458: Using a Microcontroller to Configure Xilinx FPGAs
- XAPP694: Designing with Automotive-Grade Xilinx FPGAs
Community and Professional Support
- AMD Xilinx Forums: Active community for design questions and solutions
- Application Engineers: Regional FAEs for automotive design support
- Training Resources: Online webinars, application notes, reference designs
- Third-Party Tools: EDA vendor support for simulation and synthesis
Migration Path and Future-Proofing
Upgrade Options within XA Spartan-3 Family
For designs requiring more resources, consider these pin-compatible alternatives:
- XA3S200-4PQG208Q: 200K gates, compatible footprint for simple upgrades
- XA3S400-4FT256Q: 400K gates, more I/O and memory
- Next-Gen Alternatives: Consider XA Spartan-6 or Artix-7 Automotive for new designs
Design Longevity
The XA3S50-4PQG208Q offers excellent long-term availability:
- Automotive Lifecycle: Typically 10-15 years minimum production commitment
- Last-Time Buy: Advance notification (typically 12-18 months) before discontinuation
- Legacy Support: Continued technical documentation and design support
- Alternative Sources: Second-source options and authorized aftermarket suppliers
Conclusion: Why Choose XA3S50-4PQG208Q
The XA3S50-4PQG208Q stands out as a premier choice for automotive and industrial embedded systems requiring:
✓ Automotive-Grade Reliability: AEC-Q100 qualified for harsh environments ✓ Cost-Effective Programmability: Avoids ASIC NRE costs while maintaining flexibility ✓ Proven Architecture: Based on mature Spartan-3 technology with extensive deployment history ✓ Comprehensive I/O Support: 124 user I/Os with multiple voltage and standard options ✓ Extended Temperature Range: -40°C to +125°C operation for demanding applications ✓ Strong Ecosystem: Backed by AMD Xilinx tools, documentation, and community support
Whether you’re developing next-generation ADAS systems, robust industrial controllers, or mission-critical embedded applications, the XA3S50-4PQG208Q delivers the perfect balance of performance, reliability, and cost-effectiveness. Its automotive qualification, combined with the flexibility of FPGA technology, makes it an ideal platform for both current designs and future innovations.
For detailed technical specifications, application notes, and design resources, consult the official AMD Xilinx documentation or contact your local authorized distributor for sampling and volume pricing information.
