The XC2S200-6FGG814C is a premium field-programmable gate array (FPGA) from AMD Xilinx’s renowned Spartan-II family, engineered to deliver exceptional performance for demanding digital design applications. This robust FPGA combines 200,000 system gates with 5,292 logic cells in an 814-ball Fine-Pitch Ball Grid Array package, making it an ideal solution for telecommunications, industrial automation, medical imaging, and embedded systems development.
With its advanced -6 speed grade and commercial temperature range operation, the XC2S200-6FGG814C stands out as a cost-effective alternative to traditional ASICs while offering superior flexibility and field-programmability that enables design upgrades without hardware replacement.
Key Technical Specifications
Core Features at a Glance
| Specification |
Details |
| Device Type |
XC2S200-6FGG814C |
| Product Family |
Spartan-II FPGA |
| System Gates |
200,000 gates |
| Logic Cells |
5,292 cells |
| CLB Configuration |
28 x 42 array (1,176 total CLBs) |
| User I/O Pins |
284 maximum available I/O |
| Speed Grade |
-6 (High Performance) |
| Package Type |
FGG814 (814-ball Fine-Pitch BGA) |
| Operating Voltage |
2.5V core voltage |
| Temperature Range |
Commercial (C): 0°C to +85°C |
Memory Architecture
| Memory Type |
Capacity |
Configuration |
| Distributed RAM |
75,264 bits |
Embedded in CLBs |
| Block RAM |
56 Kbits (57,344 bits) |
Dedicated memory blocks |
| Total RAM Resources |
132,608 bits |
Combined distributed + block RAM |
Advanced Architecture and Design Capabilities
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG814C features 1,176 configurable logic blocks arranged in a 28 x 42 matrix, providing extensive resources for implementing complex digital circuits. Each CLB contains:
- Four-input look-up tables (LUTs) for combinatorial logic
- Dedicated flip-flops for sequential logic functions
- Fast carry logic for arithmetic operations
- Distributed RAM capability for efficient memory implementation
High-Speed I/O Performance
With 284 maximum available user I/O pins, the XC2S200-6FGG814C supports diverse interfacing requirements across multiple digital standards. The 814-ball FGG package provides exceptional signal integrity and routing flexibility for high-density PCB designs.
Clock Management System
The integrated Delay-Locked Loop (DLL) technology ensures:
- Precise clock distribution across the FPGA fabric
- Low-skew clock networks for synchronous designs
- Support for multiple clock domains
- Enhanced timing performance for high-speed applications
Performance Specifications
Speed and Timing Characteristics
| Parameter |
Specification |
| Maximum Operating Frequency |
Up to 200 MHz (design-dependent) |
| Speed Grade |
-6 (fastest commercial grade) |
| Process Technology |
0.18μm CMOS |
| Programmable Routing |
Hierarchical interconnect architecture |
| System Performance |
263 MHz toggle rate capability |
Package Information: FGG814 Ball Grid Array
Physical Characteristics
The FGG814 package offers superior thermal performance and electrical characteristics:
| Package Feature |
Specification |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Total Balls |
814 balls |
| Ball Pitch |
Fine-pitch spacing for high-density routing |
| Package Dimensions |
Optimized for space-constrained applications |
| Thermal Performance |
Enhanced heat dissipation capabilities |
Pb-Free Compliance
The “G” designation in FGG814 indicates RoHS-compliant lead-free packaging, meeting modern environmental standards for electronic components.
Application Areas and Use Cases
Telecommunications and Networking
The XC2S200-6FGG814C excels in communication infrastructure applications:
- Protocol converters and bridges
- Network routers and switches
- SDH/SONET equipment
- Wireless base station controllers
- Signal processing for telecommunications
Industrial Automation and Control
Industrial applications benefit from the FPGA’s reliability and reconfigurability:
- Programmable logic controllers (PLCs)
- Motion control systems
- Process automation controllers
- Factory automation equipment
- Robotic control interfaces
Medical Device Applications
The XC2S200-6FGG814C supports critical medical electronics:
- Diagnostic imaging systems
- Patient monitoring equipment
- Laboratory instrumentation
- Ultrasound processing units
- Medical data acquisition systems
Embedded System Development
Ideal for prototyping and production embedded systems:
- Custom processor implementations
- Hardware acceleration modules
- Real-time signal processing
- Data acquisition and control
- Sensor interface systems
Design Advantages Over Traditional ASICs
Cost-Effective Development
- No NRE costs: Eliminate expensive mask charges associated with ASICs
- Rapid prototyping: Immediate design verification and testing
- Lower initial investment: Reduced financial risk for development projects
- Flexible production: Scale volumes without minimum order requirements
Time-to-Market Benefits
- Instant programmability: Configure devices in seconds versus months for ASIC fabrication
- Iterative design refinement: Modify designs quickly based on testing results
- Field upgrades: Update functionality without hardware replacement
- Reduced development cycles: Accelerate product launch schedules
Memory Resources and Data Processing
Block RAM Architecture
The 56 Kbits of dedicated block RAM provides high-speed data storage organized in dual-port configurations, enabling:
- FIFO buffers for data streaming
- Lookup tables for DSP applications
- Frame buffers for video processing
- Packet buffers for networking
- Microprocessor code/data storage
Distributed RAM Utilization
With 75,264 bits of distributed RAM embedded within CLBs, designers can implement:
- Small, fast memories close to processing logic
- Register files for custom processors
- Cache memories for performance optimization
- State machines with large state spaces
Power and Thermal Considerations
Operating Voltage Specifications
| Voltage Parameter |
Specification |
| Core Voltage (VCCINT) |
2.5V ±5% |
| I/O Voltage (VCCO) |
1.5V to 3.3V (bank-dependent) |
| Auxiliary Voltage (VCCAUX) |
2.5V ±5% |
Thermal Management
The FGG814 package’s enhanced thermal characteristics support reliable operation in demanding environments, with proper PCB design and heat dissipation strategies.
Development Tool Support
Xilinx ISE Design Suite
The XC2S200-6FGG814C is fully supported by Xilinx ISE (Integrated Software Environment), providing comprehensive tools for:
- HDL synthesis (VHDL and Verilog)
- Implementation and place-and-route
- Timing analysis and optimization
- Simulation and verification
- Bitstream generation and programming
IP Core Libraries
Access to extensive pre-verified IP cores accelerates development:
- Communication protocols (UART, SPI, I2C)
- Memory controllers
- DSP functions and filters
- Mathematical operations
- Interface standards
Quality and Reliability Standards
Industrial-Grade Manufacturing
AMD Xilinx FPGAs undergo rigorous quality control:
- Comprehensive electrical testing
- Thermal cycling validation
- Long-term reliability verification
- ESD protection standards
- Quality management system certification
Extended Operational Life
Designed for applications requiring long-term availability and consistent performance across years of deployment.
Ordering and Part Number Breakdown
Understanding the Part Number: XC2S200-6FGG814C
- XC2S200: Spartan-II device with 200K system gates
- -6: Speed grade (fastest commercial option)
- FGG814: Fine-pitch BGA package with 814 balls
- C: Commercial temperature range (0°C to +85°C)
Pin Configuration and I/O Standards
Supported I/O Standards
The XC2S200-6FGG814C supports multiple industry-standard I/O interfaces:
- LVTTL: Low-Voltage TTL (3.3V)
- LVCMOS: Low-Voltage CMOS (1.5V, 1.8V, 2.5V, 3.3V)
- PCI: 33MHz and 66MHz PCI bus compatible
- GTL/GTL+: Gunning Transceiver Logic
- SSTL: Stub Series Terminated Logic
- HSTL: High-Speed Transceiver Logic
Flexible I/O Banking
The 284 user I/O pins are organized into independent banks, allowing mixed-voltage operation and optimal signal integrity for diverse interface requirements.
Comparison with Similar FPGA Devices
Spartan-II Family Positioning
| Device |
System Gates |
Logic Cells |
CLBs |
User I/O |
Block RAM |
| XC2S50 |
50,000 |
1,728 |
384 |
176 |
32 Kbits |
| XC2S100 |
100,000 |
2,700 |
600 |
176 |
40 Kbits |
| XC2S150 |
150,000 |
3,888 |
864 |
260 |
48 Kbits |
| XC2S200 |
200,000 |
5,292 |
1,176 |
284 |
56 Kbits |
The XC2S200-6FGG814C represents the flagship device in the Spartan-II family, offering maximum logic density and I/O resources for the most demanding applications.
Design Considerations and Best Practices
PCB Design Guidelines
When integrating the XC2S200-6FGG814C into your hardware design:
- Follow AMD Xilinx PCB layout recommendations
- Implement proper power supply decoupling
- Consider signal integrity for high-speed I/O
- Plan adequate thermal management
- Use controlled impedance traces for critical signals
Power Supply Design
Ensure robust power delivery with:
- Dedicated voltage regulators for each power domain
- Low-ESR decoupling capacitors
- Power plane design for low impedance
- Current capacity matching device requirements
Environmental Compliance
The XC2S200-6FGG814C meets international environmental standards:
- RoHS compliant: Lead-free construction (indicated by “G” in package code)
- REACH compliance: Restricted substance regulations
- Conflict mineral free: Responsible sourcing practices
- Halogen-free options: Available for specific applications
Why Choose XC2S200-6FGG814C for Your Project?
Proven Technology Platform
The Spartan-II architecture has established itself as a reliable foundation for thousands of successful product deployments worldwide. With mature design tools, extensive documentation, and proven silicon, the XC2S200-6FGG814C minimizes development risk.
Scalability and Migration Path
The Spartan-II family architecture enables easy migration between devices as requirements evolve, protecting your design investment and allowing seamless scaling from prototypes to production.
Community and Support
Benefit from extensive Xilinx FPGA community resources, including design examples, reference designs, technical forums, and comprehensive documentation that accelerates development and problem-solving.
Cost-Performance Balance
The XC2S200-6FGG814C delivers an optimal balance between capability and cost, making advanced FPGA technology accessible for a wide range of applications from small-volume prototypes to high-volume production.
Programming and Configuration Options
Configuration Methods
Multiple configuration modes support various system architectures:
- Master Serial Mode: FPGA controls configuration process
- Slave Serial Mode: External controller drives configuration
- Boundary Scan (JTAG): Standard IEEE 1149.1 interface
- SelectMAP Mode: Parallel configuration for fast loading
Configuration Memory
Compatible with Xilinx Platform Flash PROMs and third-party configuration memory devices for standalone operation.
Conclusion: Your Gateway to Advanced FPGA Development
The XC2S200-6FGG814C represents a powerful, flexible, and cost-effective solution for engineers and designers seeking to implement sophisticated digital systems. With its extensive logic resources, versatile I/O capabilities, robust memory architecture, and proven reliability, this FPGA enables innovation across telecommunications, industrial, medical, and embedded system applications.
Whether you’re developing next-generation communication equipment, sophisticated control systems, advanced medical devices, or cutting-edge embedded solutions, the XC2S200-6FGG814C provides the performance, flexibility, and reliability your project demands. Its 814-ball package offers exceptional routing density while the -6 speed grade ensures your designs meet aggressive timing requirements.
Leverage the XC2S200-6FGG814C to accelerate your time-to-market, reduce development costs, and create adaptable products that can evolve with changing market demands. With comprehensive tool support, extensive IP libraries, and worldwide technical assistance, your path from concept to production has never been clearer.
