The XC2S200-6FGG813C is a premium field-programmable gate array from AMD Xilinx’s renowned Spartan-II family, engineered to deliver exceptional performance for demanding digital applications. This advanced FPGA features 200,000 system gates, 5,292 logic cells, and comes in an 813-ball Fine-Pitch Ball Grid Array (FGG813) package, making it ideal for complex embedded systems, industrial automation, and high-speed communication applications.
As a member of the Spartan-II series, the XC2S200-6FGG813C represents a cost-effective alternative to traditional ASICs while offering superior flexibility, faster time-to-market, and field-upgradeable capabilities that conventional mask-programmed solutions cannot match.
Key Specifications of XC2S200-6FGG813C
Technical Specifications Summary
| Specification |
Value |
| Part Number |
XC2S200-6FGG813C |
| Family |
Spartan-II FPGA |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 (1,176 total CLBs) |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Maximum User I/O |
284 pins |
| Package Type |
FGG813 (813-ball Fine-Pitch BGA) |
| Speed Grade |
-6 (Commercial) |
| Operating Voltage |
2.5V |
| Technology Node |
0.18µm |
| Temperature Range |
Commercial (0°C to +85°C) |
Package Information
| Package Parameter |
Specification |
| Package Type |
Fine-Pitch Ball Grid Array |
| Ball Count |
813 balls |
| Package Designation |
FGG813C |
| Lead-Free |
Yes (RoHS Compliant) |
| Ball Material |
Pb-free solder |
Core Features of XC2S200-6FGG813C
Advanced Architecture Benefits
The XC2S200-6FGG813C incorporates cutting-edge architectural features that make it a superior choice for modern digital designs:
Configurable Logic Blocks (CLBs): With 1,176 CLBs arranged in a 28×42 array, this FPGA provides extensive logic resources for implementing complex digital circuits, state machines, and arithmetic functions.
Flexible Memory Options: The device offers dual memory architectures including 75,264 bits of distributed RAM integrated within CLBs for high-speed data storage, plus 56 Kbits of dedicated block RAM for efficient buffer implementation and data processing tasks.
High I/O Capacity: Supporting up to 284 user I/O pins, the XC2S200-6FGG813C enables extensive interfacing capabilities for multi-protocol communication systems and complex peripheral connections.
Delay-Locked Loops (DLLs): Four integrated DLLs positioned at each corner of the die provide precise clock management, enabling designers to achieve optimal timing performance and reduce clock skew.
Performance Characteristics
| Performance Metric |
Specification |
| Maximum Operating Frequency |
Up to 200 MHz system performance |
| Logic Cell Speed |
263 MHz |
| Speed Grade |
-6 (fastest commercial grade) |
| Power Supply Voltage |
2.5V core voltage |
| I/O Standards Support |
Multiple LVCMOS, LVTTL, and differential standards |
Applications of XC2S200-6FGG813C FPGA
Industrial and Embedded Systems
The XC2S200-6FGG813C excels in industrial automation applications requiring robust digital control, real-time processing, and reliable operation in demanding environments. Its high gate count and extensive I/O capabilities make it perfect for motor control systems, process automation controllers, and industrial HMI interfaces.
Communication Infrastructure
For telecommunication applications, this Spartan-II FPGA delivers the performance and flexibility needed for protocol implementation, data encoding/decoding, channel coding, and network switching applications. The high-speed capabilities support modern communication standards and enable efficient data throughput.
Consumer Electronics
The cost-effective nature of the XC2S200-6FGG813C makes it ideal for consumer electronics applications including digital set-top boxes, multimedia processors, and embedded vision systems where high performance must be balanced with production costs.
Medical Equipment
In medical device applications, the XC2S200-6FGG813C provides the reliability and processing power required for diagnostic equipment, patient monitoring systems, and medical imaging devices where accuracy and dependability are paramount.
Design Advantages of XC2S200-6FGG813C
Superior Alternative to ASICs
| Comparison Factor |
XC2S200-6FGG813C FPGA |
Traditional ASIC |
| Initial Cost |
Low (no NRE fees) |
High (mask and setup costs) |
| Development Time |
Days to weeks |
Months to years |
| Design Flexibility |
Fully reprogrammable |
Fixed after fabrication |
| Risk Level |
Minimal |
High (no design changes post-production) |
| Field Updates |
Full support |
Impossible |
| Prototyping |
Immediate |
Expensive and time-consuming |
FGG813 Package Advantages
The 813-ball Fine-Pitch BGA package provides several critical advantages for high-performance designs:
Maximum I/O Access: The larger ball count ensures all 284 user I/O pins are accessible, providing complete design flexibility without pin limitations that smaller packages may impose.
Enhanced Thermal Performance: The increased package size and ball grid array configuration enable superior heat dissipation, supporting higher performance operation and improved reliability in thermally challenging environments.
Reliable PCB Assembly: Fine-pitch BGA technology offers excellent solder joint reliability, shorter electrical paths for reduced inductance, and improved signal integrity compared to traditional packages.
Space Efficiency: Despite having more balls than standard packages, the BGA configuration maintains a compact footprint while delivering maximum connectivity.
Programming and Configuration
Configuration Options
| Configuration Method |
Description |
| JTAG |
IEEE 1149.1 boundary scan for programming and debugging |
| Master Serial |
Direct configuration from SPI Flash memory |
| Slave Serial |
Configuration via external controller |
| Slave Parallel |
High-speed parallel configuration interface |
| Boundary Scan |
IEEE 1149.1 compliant for testing and debugging |
Development Tools
Designers working with the XC2S200-6FGG813C benefit from comprehensive development tool support including Xilinx ISE Design Suite for synthesis, implementation, and timing analysis. The device is fully supported by industry-standard simulation tools and offers seamless integration with modern FPGA development workflows.
Power Management Features
Power Specifications
| Power Parameter |
Typical Value |
| Core Voltage (VCCINT) |
2.5V ±5% |
| I/O Voltage (VCCO) |
1.8V, 2.5V, 3.3V (bank-dependent) |
| Standby Power |
Low static power consumption |
| Dynamic Power |
Dependent on design utilization |
The XC2S200-6FGG813C implements efficient power management through its 0.18µm process technology, delivering optimal performance-per-watt for battery-powered and power-sensitive applications.
Quality and Reliability
Manufacturing Standards
The XC2S200-6FGG813C is manufactured using AMD Xilinx’s rigorous quality control processes, ensuring exceptional reliability and long-term performance:
- RoHS Compliant: Lead-free construction meeting international environmental standards
- Commercial Temperature Range: Guaranteed operation from 0°C to +85°C
- Moisture Sensitivity Level: Proper handling ensures maximum reliability
- ESD Protection: Built-in protection for safe handling and operation
Comparison with Other Spartan-II Devices
XC2S200 Package Variants
| Package |
Ball Count |
User I/O |
Best For |
| FG256/FGG256 |
256 |
176 |
General purpose designs |
| FGG813 |
813 |
284 |
Maximum I/O requirements |
| PQ208/PQG208 |
208 |
140 |
Cost-sensitive applications |
The XC2S200-6FGG813C stands out by offering the highest I/O count in the XC2S200 family, making it the optimal choice for applications requiring extensive external connectivity.
Getting Started with XC2S200-6FGG813C
Design Considerations
When implementing designs with the XC2S200-6FGG813C, engineers should consider:
PCB Design: The 813-ball BGA requires careful PCB layout with appropriate ball pad dimensions, typically matching the ball diameter with proper solder mask openings.
Thermal Management: While the package offers good thermal characteristics, high-utilization designs may benefit from additional heatsinking or thermal vias.
Power Supply Design: Multiple power planes and adequate decoupling capacitors ensure stable operation and optimal performance.
Signal Integrity: Controlled impedance routing and proper termination maintain signal quality for high-speed interfaces.
Why Choose XC2S200-6FGG813C for Your Next Project
The XC2S200-6FGG813C represents an exceptional value proposition for designers seeking a powerful, flexible FPGA solution. Its combination of 200,000 system gates, 284 user I/O pins, and advanced Spartan-II architecture delivers the performance and capabilities needed for sophisticated digital designs while maintaining cost-effectiveness.
Whether you’re developing industrial control systems, communication infrastructure, medical devices, or consumer electronics, the XC2S200-6FGG813C provides the logic resources, memory, and I/O capacity to bring your designs to life. The 813-ball package ensures you have access to all device capabilities without pin limitations.
For comprehensive FPGA solutions and expert support, explore our complete range of Xilinx FPGA products and development resources.
Technical Support and Resources
Available Documentation
- Complete datasheet with electrical specifications
- Application notes for common design patterns
- Reference designs and example projects
- PCB layout guidelines for FGG813 package
- Programming and configuration guides
Development Ecosystem
The XC2S200-6FGG813C is supported by a comprehensive ecosystem including development boards, programming cables, and extensive online resources from the AMD Xilinx community.
Ordering Information
When ordering the XC2S200-6FGG813C, note the complete part number breakdown:
- XC2S200: Device family and gate count (200K gates)
- -6: Speed grade (fastest commercial grade)
- FGG813: Package type (813-ball Fine-Pitch BGA)
- C: Commercial temperature range (0°C to +85°C)
Conclusion
The XC2S200-6FGG813C delivers outstanding performance, flexibility, and value for modern FPGA applications. With its robust architecture, extensive I/O capabilities, and proven Spartan-II technology, this device enables engineers to create innovative solutions across multiple industries. The 813-ball package provides maximum connectivity while maintaining reliable performance and cost-effectiveness, making the XC2S200-6FGG813C an excellent choice for your next high-performance digital design project.
