The XC2S200-6FGG812C is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Spartan-II family, designed to deliver exceptional performance for demanding digital processing applications. This advanced FPGA combines 200,000 system gates with 5,292 logic cells in an 812-ball Fine-Pitch Ball Grid Array (FBGA) package, making it an ideal solution for engineers seeking powerful, space-efficient programmable logic solutions.
As part of the Spartan-II series, the XC2S200-6FGG812C represents a superior alternative to traditional mask-programmed ASICs, offering unparalleled flexibility, reduced development time, and the ability to implement field upgrades without hardware replacement. Whether you’re developing telecommunications equipment, industrial control systems, or consumer electronics, this FPGA delivers the performance and versatility your project demands.
Key Technical Specifications of XC2S200-6FGG812C
Core Performance Features
| Specification |
Details |
| Part Number |
XC2S200-6FGG812C |
| Manufacturer |
AMD Xilinx (formerly Xilinx Inc.) |
| Product Family |
Spartan-II FPGA |
| System Gates |
200,000 gates |
| Logic Cells |
5,292 cells |
| CLB Array |
28 × 42 (1,176 total CLBs) |
| Speed Grade |
-6 (commercial temperature) |
| Maximum Frequency |
263 MHz |
| Process Technology |
0.18μm CMOS |
| Core Voltage |
2.5V |
Memory and I/O Specifications
| Feature |
Specification |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (56,576 bits total) |
| Maximum User I/O |
284 pins |
| Package Type |
812-ball Fine-Pitch BGA (FGG812) |
| Package Footprint |
Fine-pitch ball grid array |
| Temperature Range |
Commercial (0°C to +85°C) |
Package Information
| Parameter |
Value |
| Package Code |
FGG812 |
| Total Balls |
812 |
| Package Type |
Fine-Pitch Ball Grid Array |
| Terminal Form |
Solder balls |
| Mounting Type |
Surface mount |
| Lead-Free Status |
Available with G suffix (FGG812G) |
Advanced Features and Capabilities
Configurable Logic Architecture
The XC2S200-6FGG812C features Xilinx’s proven Configurable Logic Block (CLB) architecture, providing maximum flexibility for implementing complex digital designs. Each CLB contains lookup tables (LUTs), flip-flops, and multiplexers that enable efficient implementation of combinational and sequential logic functions.
High-Speed Performance
With a speed grade of -6 and maximum operating frequency of 263 MHz, this FPGA excels in applications requiring rapid data processing and real-time signal manipulation. The optimized silicon architecture ensures minimal propagation delays and maximum throughput for demanding applications.
Embedded Memory Resources
The device incorporates both distributed RAM and dedicated Block RAM resources, providing flexible memory options for buffering, data processing, and temporary storage requirements. The 56K bits of Block RAM can be configured to support various data widths and depths, while the 75,264 bits of distributed RAM offer fast, local memory within the logic fabric.
Flexible I/O Capabilities
With up to 284 user I/O pins available in the FGG812 package, the XC2S200-6FGG812C supports extensive connectivity requirements. The multivolt I/O interface allows communication with devices operating at different voltage levels, enhancing system integration flexibility.
Delay-Locked Loop (DLL) Technology
Four integrated DLLs positioned at each corner of the die provide advanced clock management capabilities, including clock multiplication, division, and phase shifting. These features are essential for synchronizing high-speed interfaces and optimizing system timing performance.
Primary Applications and Use Cases
Telecommunications and Networking
The XC2S200-6FGG812C excels in telecommunications applications, including:
- Protocol converters and bridges
- Network routers and switches
- Base station signal processing
- Wireless infrastructure equipment
- High-speed data transmission systems
- Telecommunications test equipment
Industrial Automation and Control
Industrial applications leverage the FPGA’s reliability and performance:
- Motor control and drive systems
- Process control automation
- PLC (Programmable Logic Controller) implementations
- Factory automation systems
- Robotic control interfaces
- Industrial sensor data acquisition
Consumer Electronics
The device supports various consumer applications:
- Digital signal processing units
- Video processing and encoding
- Audio/video equipment
- Set-top box functionality
- Gaming console components
- Smart home control systems
Medical and Healthcare Equipment
Medical device manufacturers utilize the XC2S200-6FGG812C for:
- Medical imaging systems
- Patient monitoring equipment
- Diagnostic instrumentation
- Laboratory analysis equipment
- Portable medical devices
- Healthcare data processing
Advantages of XC2S200-6FGG812C FPGA
Superior Flexibility
Unlike fixed-function ASICs, the XC2S200-6FGG812C offers complete reprogrammability, allowing design modifications and feature enhancements without hardware changes. This flexibility accelerates development cycles and reduces time-to-market for new products.
Cost-Effective Solution
By eliminating the high Non-Recurring Engineering (NRE) costs associated with ASIC development, the XC2S200-6FGG812C provides a cost-effective solution for both prototyping and production volumes. The ability to implement design changes in software rather than silicon further reduces development expenses.
High Integration Density
The 812-ball package provides exceptional I/O density while maintaining a compact footprint, enabling complex system integration in space-constrained applications. This high pin count supports extensive connectivity requirements without compromising board real estate.
Proven Reliability
Built on Xilinx’s mature 0.18μm process technology, the Spartan-II family has demonstrated excellent reliability across millions of deployed units worldwide. The robust architecture ensures long-term operation in demanding environments.
Comprehensive Development Tools
The XC2S200-6FGG812C is fully supported by Xilinx’s ISE (Integrated Software Environment) development tools, providing:
- Comprehensive design entry options (schematic, HDL, IP cores)
- Advanced synthesis and optimization
- Timing analysis and verification
- In-system debugging capabilities
- Extensive IP core library
Design Considerations and Best Practices
Power Supply Requirements
The XC2S200-6FGG812C operates from a 2.5V core supply with separate I/O supply rails supporting multiple voltage standards. Proper power supply decoupling and voltage regulation are essential for optimal performance and reliability.
Thermal Management
While the device features efficient power consumption characteristics, adequate thermal management should be implemented based on utilization and switching frequency. The large 812-ball package provides excellent thermal dissipation capabilities.
PCB Layout Guidelines
For optimal signal integrity and performance:
- Follow Xilinx’s recommended PCB design guidelines for FGG812 package
- Implement proper grounding and power plane strategies
- Maintain appropriate trace impedance for high-speed signals
- Consider signal integrity for I/O pins operating at maximum frequencies
- Ensure adequate clearance for ball grid array soldering
Configuration and Programming
The XC2S200-6FGG812C supports multiple configuration modes:
- Master Serial mode
- Slave Serial mode
- SelectMAP mode (parallel configuration)
- Boundary Scan (JTAG) programming
Comparison with Alternative FPGAs
XC2S200-6FGG812C vs. Smaller Packages
While other XC2S200 variants offer 256-ball (FG256) or 456-ball (FG456) packages, the FGG812 package provides:
- Significantly more user I/O pins (284 vs. 176)
- Enhanced thermal performance
- Greater routing flexibility for complex designs
- Better signal integrity for high-speed applications
Evolution from Spartan-II Family
The Spartan-II architecture represents a proven platform that has successfully deployed in millions of systems. While newer Spartan families offer enhanced features, the XC2S200-6FGG812C remains an excellent choice for applications requiring mature, well-documented technology.
Procurement and Availability
Part Number Nomenclature
Understanding the XC2S200-6FGG812C part number:
- XC2S200: Device family and density (200K gates)
- -6: Speed grade (commercial temperature range)
- FGG: Fine-pitch Ball Grid Array package
- 812: Ball count (812 balls)
- C: Commercial temperature range (0°C to +85°C)
Ordering Information
When ordering the XC2S200-6FGG812C, specify:
- Complete part number including speed grade
- Temperature range requirements
- Lead-free (G suffix) or standard packaging
- Quantity and delivery requirements
- Any special testing or screening requirements
Quality and Compliance
AMD Xilinx maintains rigorous quality standards:
- ISO 9001 certified manufacturing
- RoHS compliance options available
- Comprehensive reliability testing
- Full traceability and authenticity verification
- Extended temperature and automotive-grade variants for specific applications
Getting Started with XC2S200-6FGG812C
Development Resources
Engineers can access comprehensive resources for the XC2S200-6FGG812C:
- Complete datasheets and technical documentation
- Application notes and design guides
- Reference designs and IP cores
- Development board support (various third-party options)
- Active online community and technical forums
Software Tools
The primary development tool is Xilinx ISE Design Suite, which provides:
- HDL synthesis (VHDL and Verilog)
- Implementation and place-and-route
- Timing analysis and optimization
- Power analysis tools
- ChipScope debugging capability
Why Choose XC2S200-6FGG812C for Your Design
The XC2S200-6FGG812C stands out as an exceptional choice for engineers requiring a balance of performance, flexibility, and proven reliability. Its combination of 200,000 system gates, extensive I/O capabilities through the 812-ball package, and mature development ecosystem makes it ideal for both prototyping and production applications.
Whether you’re developing next-generation telecommunications equipment, advanced industrial control systems, or innovative consumer electronics, the XC2S200-6FGG812C delivers the programmable logic performance your design demands. The device’s reprogrammability ensures your investment is protected against future requirement changes while eliminating the risks and costs associated with traditional ASIC development.
For engineers seeking comprehensive FPGA solutions across various applications, exploring the complete Xilinx FPGA portfolio can provide valuable insights into selecting the optimal device for specific project requirements.
Conclusion
The XC2S200-6FGG812C represents a mature, reliable FPGA solution that continues to serve demanding applications across multiple industries. Its proven architecture, extensive I/O capabilities, and comprehensive development tool support make it an excellent choice for designs requiring robust programmable logic functionality. By combining the flexibility of FPGAs with the performance of custom silicon, the XC2S200-6FGG812C enables engineers to develop innovative solutions while maintaining cost-effectiveness and time-to-market advantages.
