Overview of XA3S200-4FTG256Q Automotive FPGA
The XA3S200-4FTG256Q is a high-performance automotive-grade Field-Programmable Gate Array (FPGA) from AMD Xilinx’s XA Spartan-3A family. Specifically designed for automotive and industrial applications, this FPGA delivers exceptional reliability, cost-effectiveness, and programmable logic capabilities in a compact 256-pin FTBGA package.
Key Features and Specifications
Technical Specifications Table
| Specification |
Details |
| Part Number |
XA3S200-4FTG256Q |
| Manufacturer |
AMD (formerly Xilinx) |
| Product Family |
XA Spartan-3A Automotive |
| Logic Cells |
4,032 cells |
| System Gates |
200,000 gates |
| Speed Grade |
-4 (667 MHz) |
| Process Technology |
90nm CMOS |
| Operating Voltage |
1.2V core (VCCINT) |
| Package Type |
256-Pin FTBGA (Fine-Pitch Ball Grid Array) |
| Package Size |
16mm x 16mm |
| I/O Pins |
Up to 195 user I/O |
| Temperature Grade |
Automotive Extended (-40°C to +125°C) |
| RoHS Compliance |
Yes (Lead-free) |
| REACH Compliant |
Yes |
| ECCN Code |
EAR99 |
Memory and Block Resources
| Resource Type |
Quantity |
| CLBs (Configurable Logic Blocks) |
504 CLBs |
| Distributed RAM |
28 Kbits |
| Block RAM (18-Kbit blocks) |
12 blocks (216 Kbits total) |
| Multipliers (18×18) |
12 dedicated multipliers |
| DCMs (Digital Clock Managers) |
4 DCMs |
| Maximum Differential I/O Pairs |
65 pairs |
XA3S200-4FTG256Q Applications
Automotive Electronics
The XA3S200-4FTG256Q is specifically qualified for automotive applications, making it ideal for:
- Infotainment Systems: Audio/video processing, navigation displays
- Driver Information Systems: Instrument clusters, heads-up displays
- Advanced Driver Assistance Systems (ADAS): Sensor fusion, image processing
- Body Control Modules: Lighting control, climate systems
- Telematics: Communication interfaces, GPS tracking
- Electric Vehicle (EV) Systems: Battery management, motor control interfaces
Industrial Control Applications
Beyond automotive, this Xilinx FPGA excels in:
- Building automation systems
- Industrial control and monitoring
- Data acquisition systems
- Communications equipment
- Datacom modules
- Motor control applications
Why Choose XA3S200-4FTG256Q?
Automotive-Grade Reliability
- AEC-Q100 Qualified: Meets stringent automotive reliability standards
- Extended Temperature Range: Operates reliably from -40°C to +125°C
- Enhanced Testing: Comprehensive qualification for harsh automotive environments
- Long Product Lifecycle: Guaranteed availability for automotive production cycles
Cost-Effective FPGA Solution
- Low-Cost Alternative to ASICs: Eliminates expensive mask sets and NRE costs
- Rapid Development: Faster time-to-market compared to ASIC development
- Field Upgradeable: Update functionality without hardware changes
- Flexible Architecture: Adapt to changing requirements easily
High Performance Features
- 667 MHz Maximum Frequency: Fast clock speeds for demanding applications
- 90nm Technology: Balance of performance and power efficiency
- Multiple Clock Domains: Four DCMs enable complex timing architectures
- DSP-Optimized: Dedicated 18×18 multipliers for signal processing
Package and Pin Configuration
256-Pin FTBGA Package Details
| Package Characteristic |
Specification |
| Package Type |
FTBGA (Fine-Pitch Ball Grid Array) |
| Total Pins |
256 |
| Body Size |
16mm x 16mm x 1.4mm |
| Ball Pitch |
1.0mm |
| Mounting Type |
Surface Mount |
| Moisture Sensitivity Level |
MSL 3 |
| Peak Reflow Temperature |
260°C |
I/O Banking Structure
The XA3S200-4FTG256Q features four I/O banks with independent VCCO supplies:
- Bank 0: Up to 48 I/O pins
- Bank 1: Up to 48 I/O pins
- Bank 2: Up to 48 I/O pins
- Bank 3: Up to 51 I/O pins
Supported I/O Standards
Single-Ended Standards
- LVCMOS (1.2V, 1.5V, 1.8V, 2.5V, 3.3V)
- LVTTL
- PCI (33MHz, 66MHz)
- HSTL Class I, II, III, IV
- SSTL2, SSTL3
Differential Standards
- LVDS (Low-Voltage Differential Signaling)
- Mini-LVDS
- RSDS (Reduced Swing Differential Signaling)
- PPDS (Point-to-Point Differential Signaling)
- BLVDS (Bus LVDS)
Power Supply Requirements
| Supply Rail |
Voltage |
Tolerance |
Purpose |
| VCCINT |
1.2V |
±5% |
Core logic voltage |
| VCCAUX |
2.5V or 3.3V |
±5% |
Auxiliary circuits |
| VCCO |
1.2V to 3.3V |
±5% |
I/O banks voltage |
Typical Power Consumption
- Static Power: 100-200 mW (typical)
- Dynamic Power: Depends on design utilization and frequency
- Low-Power Modes: Supports various power-saving configurations
Design and Development Support
Compatible Design Tools
- Vivado Design Suite: Latest AMD/Xilinx development environment
- ISE Design Suite: Legacy support for Spartan-3A family
- IP Core Library: Pre-verified IP for faster development
- ChipScope Pro: Integrated logic analyzer for debugging
Programming and Configuration
The XA3S200-4FTG256Q supports multiple configuration modes:
- Master Serial Mode: FPGA controls configuration device
- Slave Serial Mode: External controller manages configuration
- Master SPI Mode: SPI Flash memory configuration
- JTAG Mode: Boundary scan and programming
Configuration Memory Options
- Platform Flash XL devices
- SPI Flash memory (M25P series)
- Parallel NOR Flash
- External microcontroller configuration
Quality and Compliance
Certifications and Standards
| Standard |
Compliance Status |
| AEC-Q100 |
Qualified |
| RoHS |
Compliant (Lead-free) |
| REACH |
Compliant |
| ISO 26262 |
Design guidelines available |
| Moisture Sensitivity |
Level 3 |
| ESD Protection |
HBM Class 2 (2kV) |
Testing and Reliability
- 100% production tested
- Burn-in testing available
- Comprehensive functional testing
- Quality Management System certified
- Traceability documentation provided
Ordering Information
Part Number Breakdown
XA3S200-4FTG256Q
- XA: Automotive-grade product
- 3S200: Spartan-3A, 200K gates
- -4: Speed grade (commercial -4)
- FT: Fine-pitch FTBGA package
- G256: 256 pins, 16x16mm body
- Q: Pb-free (RoHS compliant)
Package Marking
All devices include:
- Part number
- Speed grade
- Date code
- Lot traceability code
- Country of origin
Comparison with Similar FPGAs
XA3S200A vs XA3S200
| Feature |
XA3S200-4FTG256Q |
XA3S200A-4FTG256Q |
| Logic Cells |
4,032 |
4,032 |
| System Gates |
200K |
200K |
| Block RAM |
216 Kbits |
216 Kbits |
| Process |
90nm |
90nm (enhanced) |
| Power |
Baseline |
~15% lower |
Note: The XA3S200A is an enhanced version with improved power efficiency.
Thermal Management
Thermal Characteristics
| Parameter |
Value |
| Junction Temperature (Max) |
125°C |
| Ambient Temperature Range |
-40°C to +125°C |
| Package Thermal Resistance (θJA) |
~35°C/W (typical) |
| Package Thermal Resistance (θJC) |
~8°C/W (typical) |
Cooling Recommendations
- Natural convection suitable for typical applications
- Heatsink recommended for high-utilization designs
- Consider PCB copper planes for thermal dissipation
- Monitor junction temperature during operation
PCB Design Guidelines
Layout Considerations
- Decoupling Capacitors: Place close to power pins
- 0.1µF ceramic capacitors at each VCCINT pin
- 10µF bulk capacitors for each supply rail
- Power Plane Design:
- Separate power planes for VCCINT, VCCAUX, and VCCO
- Adequate copper weight (1-2 oz minimum)
- Signal Integrity:
- Controlled impedance for high-speed signals
- Differential pair routing for LVDS
- Ground plane for return paths
- Thermal Via Design:
- Use thermal vias under package
- Connect to ground plane for heat dissipation
Storage and Handling
Environmental Requirements
- Storage Temperature: -55°C to +150°C
- Storage Humidity: <90% RH non-condensing
- Baking: Required before assembly if MSL exceeded
- Shelf Life: 12 months in original packaging
ESD Precautions
- Handle in ESD-protected environment
- Use grounded wrist straps
- Store in ESD-protective packaging
- Follow JEDEC standards for handling
Frequently Asked Questions
What is the difference between XA and XC Spartan-3A FPGAs?
The XA series are automotive-qualified versions with extended temperature range (-40°C to +125°C) and enhanced reliability testing, while XC series are commercial-grade devices.
Can the XA3S200-4FTG256Q be used in non-automotive applications?
Yes, while designed for automotive use, the enhanced reliability and extended temperature range make it suitable for any harsh-environment industrial application.
What development boards support the XA3S200-4FTG256Q?
While specific automotive boards may be limited, standard Spartan-3A development boards can be used for initial development, with custom boards for production.
Is this FPGA suitable for AI/ML applications?
The XA3S200-4FTG256Q is optimized for control and interface applications. For AI/ML workloads, consider newer FPGA families with enhanced DSP capabilities.
What is the expected product lifecycle?
Automotive-grade FPGAs typically have 10-15 year production commitments with advance notice before discontinuation.
Technical Support and Resources
Documentation Available
- Product datasheet (DS681)
- User guide (UG331)
- Packaging specification
- PCB design guidelines
- Application notes
- Reference designs
Where to Buy
The XA3S200-4FTG256Q is available through:
- Authorized distributors (DigiKey, Mouser, Avnet, Arrow)
- AMD Xilinx direct sales
- Certified electronic component suppliers
- Regional distributors worldwide
Getting Started
- Download development tools (Vivado or ISE)
- Review reference designs and tutorials
- Evaluate on development board
- Design custom application
- Prototype and test
- Production release
Conclusion
The XA3S200-4FTG256Q represents an excellent choice for automotive and industrial applications requiring reliable, cost-effective programmable logic. With its automotive qualification, extended temperature range, and comprehensive I/O capabilities, this Xilinx FPGA delivers the performance and reliability needed for mission-critical embedded systems.
Whether you’re developing next-generation infotainment systems, advanced driver assistance features, or industrial control applications, the XA3S200-4FTG256Q provides the flexibility, performance, and longevity your project demands.
