The XC2S200-6FGG810C represents a powerful member of the AMD Xilinx Spartan-II FPGA family, delivering exceptional performance for demanding digital design applications. This field-programmable gate array combines 200,000 system gates with 5,292 logic cells, making it an ideal choice for engineers seeking reliable, cost-effective programmable logic solutions.

Built on advanced 0.18-micron CMOS technology, this FPGA offers superior flexibility and performance for applications ranging from telecommunications to industrial automation. The -6 speed grade ensures optimal performance in commercial temperature range applications, while the FGG810 package provides extensive I/O capabilities in a fine-pitch ball grid array format.

Key Technical Specifications

Core Architecture Features

Memory Resources

Performance Characteristics

Advanced Features and Capabilities

Configurable Logic Blocks (CLB)

The XC2S200-6FGG810C features 1,176 configurable logic blocks arranged in a 28 x 42 array, providing exceptional logic density for complex digital designs. Each CLB contains:

• Four 4-input look-up tables (LUTs)
• Eight flip-flops for sequential logic
• Dedicated carry logic for arithmetic operations
• Distributed RAM capability within each LUT
• Multiplexer resources for routing flexibility

SelectRAM Memory Architecture

This Spartan-II FPGA incorporates a hierarchical memory architecture combining both distributed and block RAM resources:

Distributed RAM Features:

• 16 bits per LUT configuration
• Flexible dual-port operation
• Configurable as 16×1, 32×1, or 16×2 synchronous RAM
• Ideal for small FIFO buffers and register files

Block RAM Features:

• Two columns of block RAM spanning chip height
• Each block is four CLBs high
• Configurable as single-port or dual-port memory
• Optimal for data buffering and packet processing

Input/Output Block (IOB) Capabilities

The FGG810 package provides extensive I/O capabilities with up to 284 user I/O pins (excluding four global clock pins). Key IOB features include:

• Support for 16 industry-standard I/O interfaces
• DDR (Double Data Rate) register support
• Individual tri-state control for each output
• Programmable pull-up/pull-down resistors
• Flexible I/O banking for voltage flexibility

Delay-Locked Loop (DLL) Technology

Four integrated DLLs provide advanced clock management capabilities:

• Clock de-skewing for synchronous designs
• Clock frequency multiplication and division
• Phase shifting for timing optimization
• Clock mirroring for multi-device synchronization
• Low-jitter clock distribution network

Application Areas and Use Cases

Telecommunications and Networking

The XC2S200-6FGG810C excels in telecommunications applications requiring high-speed data processing:

• Protocol implementation for network routers
• Digital signal processing for communications
• Data packet routing and switching
• Channel encoding and decoding
• Network interface controllers

Industrial Control Systems

This FPGA provides robust performance for industrial automation:

• Motor control applications
• Process control and monitoring
• Programmable logic controllers (PLCs)
• Factory automation systems
• Real-time control interfaces

Digital Signal Processing Applications

The combination of logic resources and embedded memory makes this device ideal for DSP:

• Digital filtering implementations
• Fast Fourier Transform (FFT) processing
• Image and video processing
• Audio signal processing
• Adaptive filtering algorithms

Medical Equipment

The XC2S200-6FGG810C supports critical medical device applications:

• Medical imaging systems
• Patient monitoring equipment
• Diagnostic instrumentation
• Laboratory analysis equipment
• Biometric data processing

Why Choose XC2S200-6FGG810C Over ASICs?

Cost-Effective Development

The Spartan-II FPGA eliminates the substantial upfront costs associated with ASIC development:

• No mask costs or NRE (Non-Recurring Engineering) charges
• Reduced time-to-market compared to ASIC development
• Lower minimum order quantities
• Design flexibility without fabrication delays

Design Flexibility and Upgradability

Unlike mask-programmed ASICs, this FPGA offers unprecedented flexibility:

• In-field programmability for design updates
• Multiple design iterations without hardware changes
• Prototype testing with production-grade hardware
• Bug fixes through firmware updates
• Feature additions post-deployment

Risk Mitigation

FPGA technology significantly reduces development risks:

• Design verification in actual hardware
• Incremental development approach
• Easy design modifications during testing
• No commitment to fixed silicon
• Market responsiveness through rapid updates

Programming and Configuration Options

Configuration Methods

The XC2S200-6FGG810C supports multiple configuration modes:

Design Tools and Support

Development is supported by industry-standard tools:

• Xilinx ISE (Integrated Software Environment)
• Vivado Design Suite compatibility
• VHDL and Verilog HDL support
• Schematic capture options
• Comprehensive IP core library

Package Information: FGG810 Ball Grid Array

Physical Characteristics

Thermal Management

The FGG810 package provides excellent thermal performance:

• Large thermal pad for heat dissipation
• Multiple ground balls for thermal conductivity
• Compatible with standard heat sink solutions
• Efficient power distribution across package

Competitive Advantages of Spartan-II Technology

Process Technology Benefits

The 0.18-micron process node delivers optimal balance:

• Lower power consumption than older technologies
• Higher integration density
• Improved signal integrity
• Cost-effective manufacturing
• Proven reliability and yield

Power Management

Advanced power management features include:

• 2.5V core voltage operation
• Flexible I/O voltage options
• Low static power consumption
• Power-down modes for unused blocks
• Efficient clock distribution minimizing power

Quality and Reliability

Manufacturing Excellence

AMD Xilinx maintains the highest quality standards:

• ISO 9001 certified manufacturing
• Automotive-grade options available
• Extended temperature range variants
• Military-grade screening available
• Comprehensive quality testing

Long-Term Availability

Spartan-II devices offer excellent lifecycle support:

• Extended product lifecycle commitment
• Long-term supply agreements available
• Mature and stable product line
• Comprehensive documentation
• Ongoing technical support

Integration and System Design Considerations

PCB Layout Guidelines

Successful implementation requires attention to:

• Power supply decoupling strategies
• Controlled impedance routing for high-speed signals
• Ground plane design for signal integrity
• BGA fanout techniques for dense routing
• Thermal management in board design

Power Supply Requirements

Clock Distribution Strategy

Optimal performance requires proper clock planning:

• Use dedicated global clock buffers
• Minimize clock skew through DLL usage
• Regional clocking for power efficiency
• Careful fanout management
• Clock domain crossing considerations

Development Workflow and Best Practices

Design Entry Phase

Successful FPGA development follows proven methodologies:

1. Requirements specification and architecture planning
2. RTL code development in VHDL or Verilog
3. Functional simulation and verification
4. Synthesis optimization for target device
5. Place and route with timing constraints

Verification and Validation

Comprehensive testing ensures design success:

• Behavioral simulation before synthesis
• Post-synthesis timing simulation
• Static timing analysis verification
• Hardware prototyping and testing
• In-system debugging capabilities

Optimization Strategies

Maximize performance through:

• Resource utilization optimization
• Critical path identification and improvement
• Power consumption reduction techniques
• Area minimization strategies
• Timing closure methodologies

Comparison with Alternative Solutions

Spartan-II vs. Spartan-3

While Spartan-3 offers newer features, the XC2S200-6FGG810C provides:

• Cost advantages for mature designs
• Proven track record in production
• Simplified architecture for straightforward applications
• Lower learning curve for existing users
• Adequate performance for many applications

FPGA vs. CPLD Decision

Choose the XC2S200-6FGG810C when you need:

• Higher logic density than CPLDs provide
• Block RAM for data buffering
• Complex state machines and algorithms
• DSP functionality
• Flexible I/O standards support

Environmental and Safety Compliance

Regulatory Standards

The XC2S200-6FGG810C meets international requirements:

• RoHS compliant options available
• REACH regulation compliance
• WEEE directive conformance
• UL recognition where applicable
• CE marking for European markets

Environmental Specifications

Ordering Information and Part Number Decoding

Part Number Breakdown: XC2S200-6FGG810C

• XC2S200: Device family and density (200K gates)
• -6: Speed grade (fastest commercial grade)
• FGG: Package type (Fine-pitch Ball Grid Array)
• 810: Pin count
• C: Commercial temperature range

Available Variants

Multiple configurations support diverse requirements:

• Different speed grades (-5, -6)
• Temperature range options (C, I)
• Lead-free packaging (G designation)
• Screened versions for critical applications

Support Resources and Documentation

Technical Documentation

Comprehensive resources support development:

• Complete datasheet with electrical specifications
• User guides and application notes
• Reference designs and example projects
• Packaging and PCB layout guidelines
• Errata and known issues documentation

Training and Education

AMD Xilinx provides extensive learning resources:

• Online training modules
• Webinar series on FPGA development
• University program support
• Community forums and user groups
• Technical support channels

Why Choose Xilinx FPGA for Your Design?

The Spartan-II family represents decades of FPGA innovation and reliability. The XC2S200-6FGG810C delivers proven performance for applications requiring:

• Reliable, cost-effective programmable logic
• Sufficient logic density for complex designs
• Comprehensive I/O flexibility
• Established development ecosystem
• Long-term product availability

Design Success Factors

Successful implementation depends on:

• Clear requirements specification
• Appropriate tool selection and usage
• Following established design practices
• Comprehensive testing and validation
• Leveraging available support resources

Conclusion: Future-Proof Your Design with XC2S200-6FGG810C

The XC2S200-6FGG810C Spartan-II FPGA combines proven technology, extensive features, and cost-effective pricing to deliver exceptional value for digital design projects. Whether developing telecommunications equipment, industrial control systems, or medical devices, this FPGA provides the logic density, memory resources, and I/O flexibility required for success.

By choosing this device, engineers gain access to mature development tools, comprehensive documentation, and a large community of experienced users. The flexibility of FPGA technology enables rapid prototyping, iterative development, and in-field updates—advantages impossible with traditional ASIC approaches.

For projects requiring 200,000 system gates, robust I/O capabilities, and proven reliability, the XC2S200-6FGG810C represents an optimal choice. Its combination of performance, features, and cost-effectiveness makes it suitable for both new designs and production replacement scenarios.

Explore the full potential of programmable logic technology and accelerate your next design with the XC2S200-6FGG810C Spartan-II FPGA.