The XC2S200-6FGG808C is a premium field-programmable gate array (FPGA) from AMD Xilinx’s renowned Spartan-II family, delivering exceptional performance for complex digital designs. This 808-ball fine-pitch BGA packaged device combines 200,000 system gates with 5,292 logic cells, making it an ideal solution for engineers seeking cost-effective programmable logic with enterprise-grade capabilities.
As part of the Spartan-II architecture, the XC2S200-6FGG808C offers superior flexibility compared to traditional ASICs, enabling rapid prototyping, field upgrades, and design modifications without hardware replacement costs.
Key Technical Specifications of XC2S200-6FGG808C
Core Performance Features
| Specification |
Value |
| Device Family |
Spartan-II |
| Part Number |
XC2S200-6FGG808C |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array Configuration |
28 x 42 (1,176 total CLBs) |
| Maximum User I/O |
284 pins |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits |
| Speed Grade |
-6 (Commercial) |
| Operating Voltage |
2.5V |
Package Specifications
| Package Parameter |
Details |
| Package Type |
Fine-Pitch Ball Grid Array (FPGA) |
| Total Balls |
808 |
| Package Code |
FGG808 |
| Form Factor |
Ball Grid Array |
| Temperature Range |
Commercial (0°C to +85°C) |
| Lead-Free Option |
Available (G suffix) |
Architecture and Design Capabilities
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG808C features 1,176 configurable logic blocks arranged in a 28×42 matrix, providing extensive resources for implementing complex digital circuits. Each CLB contains:
- Look-Up Tables (LUTs) for combinational logic
- Flip-flops for sequential logic implementation
- Multiplexers for routing flexibility
- Fast carry logic for arithmetic operations
Memory Resources
This FPGA offers dual memory architectures:
Distributed RAM: 75,264 bits spread across the logic fabric for small, fast memory structures
Block RAM: 56K bits organized in dedicated memory blocks for larger data storage requirements
I/O Capabilities
With 284 maximum user I/O pins, the XC2S200-6FGG808C supports extensive interfacing options:
- Multiple I/O standards support
- Programmable drive strength
- Input delay compensation
- Flexible voltage compatibility
XC2S200-6FGG808C Applications and Use Cases
Communications and Networking
The device excels in communication protocol implementation, packet processing, and network interface designs where reconfigurability and performance converge.
Industrial Control Systems
Perfect for automation controllers, motor drive systems, and process control applications requiring reliable, deterministic logic execution.
Digital Signal Processing
Implements custom DSP algorithms, filter designs, and signal conditioning circuits with dedicated multiplier resources and high-speed block RAM.
Embedded System Development
Serves as a flexible co-processor or custom peripheral controller in embedded applications, offering hardware acceleration without ASIC costs.
Medical Equipment
Suitable for diagnostic equipment, imaging systems, and patient monitoring devices where reliability and upgrade capability are essential.
Performance and Speed Characteristics
Speed Grade -6 Benefits
| Performance Metric |
Specification |
| Maximum Frequency |
Up to 263 MHz system performance |
| Speed Grade |
-6 (optimized for commercial applications) |
| Technology Node |
0.18μm CMOS process |
| Clock Management |
Four Delay-Locked Loops (DLLs) |
The -6 speed grade designation indicates this device is optimized for commercial temperature ranges, providing excellent performance-to-cost ratio for standard operating environments.
Configuration and Programming Options
Configuration Modes
The XC2S200-6FGG808C supports multiple configuration methods:
| Configuration Mode |
CCLK Direction |
Data Width |
Features |
| Master Serial |
Output |
1-bit |
Self-configuring from external PROM |
| Slave Serial |
Input |
1-bit |
External controller configuration |
| Slave Parallel |
Input |
8-bit |
Fast configuration via parallel bus |
| Boundary-Scan (JTAG) |
N/A |
1-bit |
Debug and programming interface |
Configuration Memory
Total configuration bits: 1,335,840 bits, enabling complete device customization.
Advantages Over Alternative Solutions
Why Choose XC2S200-6FGG808C?
Cost-Effective Development: Eliminates NRE costs associated with ASIC development, reducing upfront investment and risk.
Field Upgradability: Update designs remotely or on-site without hardware changes, extending product lifecycle.
Rapid Prototyping: Implement and test designs in hours rather than months required for ASIC fabrication.
Scalability: Easy migration to larger or smaller Spartan-II family members as requirements evolve.
Design Tools and Development Support
Compatible Development Environments
The XC2S200-6FGG808C integrates seamlessly with AMD Xilinx development tools:
- Vivado Design Suite for advanced synthesis and implementation
- ISE Design Suite for legacy project compatibility
- IP Core libraries for accelerated development
- Simulation tools for comprehensive verification
For comprehensive FPGA solutions and technical resources, visit Xilinx FPGA for expert guidance and component sourcing.
Power Management and Thermal Considerations
Power Specifications
| Power Parameter |
Typical Value |
| Core Voltage (VCCINT) |
2.5V ±5% |
| I/O Voltage (VCCO) |
1.8V to 3.3V (bank dependent) |
| Power Consumption |
Application dependent |
| Thermal Management |
Passive cooling sufficient for most applications |
Package Thermal Characteristics
The FGG808 package provides excellent thermal dissipation for reliable operation across the commercial temperature range, ensuring consistent performance in diverse deployment scenarios.
Quality and Reliability Standards
Manufacturing Excellence
- Process Technology: Advanced 0.18μm CMOS
- Quality Certifications: ISO-compliant manufacturing
- Reliability Testing: Full environmental and stress testing
- Authenticity: Genuine AMD Xilinx components
Ordering and Availability Information
Part Number Breakdown
XC2S200-6FGG808C decodes as:
- XC2S200: Device type (Spartan-II, 200K gates)
- -6: Speed grade (commercial performance)
- FGG808: Package type (808-ball fine-pitch BGA)
- C: Commercial temperature range (0°C to +85°C)
Lead-Free Variant
For RoHS-compliant applications, the XC2S200-6FGGG808C variant includes the additional “G” designation for lead-free packaging.
Comparison with Other Spartan-II Devices
Family Positioning
| Feature |
XC2S100 |
XC2S150 |
XC2S200 |
| Logic Cells |
2,700 |
3,888 |
5,292 |
| System Gates |
100,000 |
150,000 |
200,000 |
| CLBs |
600 |
864 |
1,176 |
| Block RAM |
40K |
48K |
56K |
| Max I/O (808-ball) |
– |
– |
284 |
The XC2S200-6FGG808C represents the high-capacity option within the Spartan-II family, offering maximum resources for demanding applications.
Technical Support and Resources
Documentation and Datasheets
Access comprehensive technical documentation including:
- Complete electrical specifications
- Pin assignment tables
- Timing characteristics
- Application notes
- Design examples
Design Considerations
Critical Success Factors:
- Proper power supply decoupling for each voltage domain
- Clock network planning using DLL resources
- I/O bank voltage planning for mixed-voltage interfaces
- Thermal management in high-utilization designs
Common Applications in Industry
Telecommunications Infrastructure
Implements custom protocol handlers, line interface circuits, and traffic management functions in carrier-grade equipment.
Test and Measurement Equipment
Provides flexible signal generation, capture, and analysis capabilities for oscilloscopes, logic analyzers, and automated test equipment.
Aerospace and Defense
Delivers reliable programmable logic for avionics, radar processing, and secure communication systems (subject to export controls).
Consumer Electronics
Enables feature-rich products with updatable functionality for video processing, audio enhancement, and interface conversion.
Conclusion: Why XC2S200-6FGG808C Excels
The XC2S200-6FGG808C FPGA combines robust performance, extensive I/O resources, and the proven Spartan-II architecture to deliver exceptional value for modern digital design challenges. With 200,000 system gates, 284 I/O pins in the FGG808 package, and commercial-grade reliability, this device represents an optimal choice for engineers requiring high-density programmable logic without ASIC complexity.
Whether you’re developing communication systems, industrial controllers, or embedded applications, the XC2S200-6FGG808C provides the flexibility, performance, and cost-effectiveness demanded by today’s competitive markets. Its field-programmable nature ensures your designs remain adaptable to future requirements while maintaining excellent performance standards.
Frequently Asked Questions
Q: What is the difference between -5 and -6 speed grades? A: The -6 speed grade is optimized for commercial temperature operation with excellent performance characteristics, while -5 offers slightly different timing specifications. Both deliver reliable operation within their rated parameters.
Q: Can the XC2S200-6FGG808C be used for safety-critical applications? A: While the device offers high reliability, safety-critical certification depends on your specific industry requirements and design validation processes.
Q: What development tools are required? A: AMD Xilinx ISE or Vivado Design Suite, along with appropriate synthesis and simulation tools. Many third-party EDA tools also support this device family.
Q: Is technical support available? A: Yes, comprehensive documentation, application notes, and community forums provide extensive technical resources for design implementation.
