Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XA3S500E-4CPG132I: Automotive-Grade FPGA Spartan-3E for High-Performance Applications

Product Details

The XA3S500E-4CPG132I is an automotive-grade Field Programmable Gate Array (FPGA) from the renowned Spartan-3E family, manufactured by AMD (formerly Xilinx). This robust FPGA solution delivers exceptional performance with 500K gates and 10,476 cells, making it ideal for cost-sensitive automotive electronics and industrial applications requiring reliable programmable logic.

Overview of XA3S500E-4CPG132I Specifications

The XA3S500E-4CPG132I combines advanced 90nm CMOS technology with automotive-grade reliability, operating at speeds up to 572MHz. This <a href=”https://pcbsync.com/xilinx-fpga/”>Xilinx FPGA</a> features a compact 132-pin CS-BGA package, providing an optimal balance between functionality and board space efficiency.

Key Technical Specifications

Parameter Specification
Part Number XA3S500E-4CPG132I
Manufacturer AMD / Xilinx
Product Family XA Spartan-3E
Logic Elements 10,476 Cells
System Gates 500,000 (500K)
Configurable Logic Blocks 1,164 CLBs
Operating Frequency 572 MHz
Supply Voltage 1.2V Core
Process Technology 90nm CMOS
Package Type 132-Pin CS-BGA (Chip Scale Ball Grid Array)
Temperature Grade Automotive (-40°C to +125°C)
Speed Grade -4 (Industrial)

XA3S500E-4CPG132I Features and Benefits

Automotive-Grade Reliability

The XA designation indicates this FPGA meets stringent automotive quality standards, making it suitable for mission-critical automotive applications including infotainment systems, driver assistance modules, and instrument clusters.

High-Performance Architecture

Feature Category Details
Logic Resources 1,164 CLBs providing flexible logic implementation
Memory Distributed RAM and dedicated block RAM resources
I/O Capabilities Multiple I/O standards support with 132 configurable pins
Clock Management Digital Clock Manager (DCM) for precise timing control
Configuration Multiple configuration modes including JTAG, SPI, and parallel

Cost-Effective FPGA Solution

The Spartan-3E architecture optimizes cost per logic cell, delivering more functionality per dollar compared to traditional ASIC solutions. This makes the XA3S500E-4CPG132I perfect for high-volume production environments.

Applications for XA3S500E-4CPG132I

Automotive Electronics

  • Infotainment Systems: Audio/video processing, connectivity modules
  • Driver Information Displays: Dashboard instrumentation, HUD systems
  • Advanced Driver Assistance Systems (ADAS): Sensor fusion, image processing
  • Body Control Modules: Lighting control, climate systems

Industrial Control Systems

  • Motor Drive Controllers: Precision motor control algorithms
  • Communication Equipment: Protocol conversion, data routing
  • Datacom Modules: High-speed data processing
  • Process Automation: Real-time control and monitoring

Technical Architecture Details

Configurable Logic Block Structure

The XA3S500E-4CPG132I features 1,164 CLBs arranged in a flexible fabric. Each CLB contains four logic slices with look-up tables (LUTs), flip-flops, and dedicated arithmetic logic for efficient digital design implementation.

Memory Resources

Memory Type Capacity Application
Block RAM Multiple 18Kb blocks Data buffering, FIFO implementation
Distributed RAM Within CLB slices Small memory arrays, shift registers
Configuration Memory SRAM-based Volatile configuration storage

Clock and Timing Management

The integrated Digital Clock Manager provides frequency synthesis, phase shifting, and clock distribution capabilities essential for multi-domain timing applications.

Package Information: 132-Pin CS-BGA

Physical Characteristics

  • Package Type: CS-BGA (Chip Scale Ball Grid Array)
  • Pin Count: 132 pins
  • Footprint: Compact surface-mount design
  • Ball Pitch: Fine-pitch for high-density PCB layouts
  • Thermal Performance: Enhanced heat dissipation characteristics

PCB Design Considerations

Design Aspect Recommendation
Layer Count Minimum 4-layer PCB recommended
Power Planes Dedicated planes for 1.2V core and I/O supplies
Decoupling Multiple capacitors per power pin
Signal Integrity Controlled impedance for high-speed signals
Thermal Management Adequate copper pour and thermal vias

Programming and Configuration

Supported Configuration Methods

The XA3S500E-4CPG132I supports multiple configuration interfaces:

  • JTAG: In-circuit programming and debugging
  • Master Serial: Direct SPI flash boot
  • Master Parallel: High-speed parallel configuration
  • Slave Serial: Daisy-chain configuration
  • Slave Parallel: Processor-controlled configuration

Development Tools

Compatible with industry-standard FPGA development tools including Xilinx ISE Design Suite and Vivado Design Suite (for legacy support).

Power Specifications and Consumption

Voltage Requirements

Power Rail Typical Voltage Tolerance Purpose
VCCINT 1.2V ±5% Core logic supply
VCCO 1.2V to 3.3V Bank-dependent I/O supply voltage
VCCAUX 2.5V or 3.3V ±5% Auxiliary circuits

Power Management Features

  • Multiple power domains for flexible I/O voltage
  • Low-power modes for reduced standby consumption
  • Power sequencing requirements for reliable startup

Performance Characteristics

Speed Grade Analysis

The -4 speed grade represents an industrial-grade timing specification, offering:

  • Maximum operating frequency of 572 MHz
  • Optimized for cost-sensitive applications
  • Balanced performance and power consumption
  • Wide temperature range operation

Timing Performance

Parameter Value
Logic Delay ~4 speed grade
Clock-to-Out Fast propagation times
Setup/Hold Times Optimized for high-frequency operation
Global Clock Resources Multiple low-skew clock networks

Comparison with Related Parts

Spartan-3E Family Overview

The XA3S500E-4CPG132I sits in the middle of the Spartan-3E density range:

  • XA3S100E: 100K gates – smallest family member
  • XA3S250E: 250K gates – compact applications
  • XA3S500E: 500K gates – mainstream choice (this device)
  • XA3S1200E: 1.2M gates – high-density applications
  • XA3S1600E: 1.6M gates – maximum capacity

Package Variants

Part Number Package Pin Count Use Case
XA3S500E-4CPG132I CS-BGA 132 Space-constrained designs
XA3S500E-4PQG208I PQFP 208 Higher I/O count
XA3S500E-4FTG256I FTBGA 256 Maximum I/O availability
XA3S500E-4FG320I FBGA 320 Enhanced thermal performance

Quality and Compliance

Automotive Standards

  • AEC-Q100 Qualified: Meets automotive reliability standards
  • Extended Temperature Range: -40°C to +125°C junction temperature
  • Proven in Production: Widely deployed in automotive systems

Environmental Compliance

  • RoHS compliant (lead-free)
  • REACH compliant
  • Halogen-free options available
  • Moisture sensitivity level (MSL) rated

Design Resources and Support

Documentation Available

  • Complete datasheet with electrical specifications
  • User guide for Spartan-3E architecture
  • Application notes for automotive designs
  • PCB layout guidelines for CS-BGA packages
  • Thermal management application notes

Reference Designs

Multiple reference designs available for common automotive applications including CAN bus interfaces, motor control, and sensor interfacing.

Ordering Information and Availability

Part Number Breakdown

XA3S500E-4CPG132I

  • XA: Automotive-grade qualification
  • 3S500E: Spartan-3E, 500K gate density
  • -4: Speed grade (industrial)
  • CPG132: 132-pin CS-BGA package
  • I: Industrial temperature range

Lead Time and Availability

Available through authorized distributors including DigiKey, Mouser, and other major electronics suppliers. Consult your preferred distributor for current stock levels and pricing.

Why Choose XA3S500E-4CPG132I?

Advantages Over ASIC Solutions

The XA3S500E-4CPG132I offers significant advantages compared to traditional ASIC implementations:

  • No NRE Costs: Eliminate expensive mask set charges
  • Faster Time-to-Market: Immediate design iteration capability
  • Field Upgradability: Update functionality without hardware changes
  • Design Flexibility: Modify requirements during development
  • Lower Risk: Validate designs before production commitment

Cost-Performance Balance

This FPGA strikes an optimal balance between capability and cost, providing:

  • Sufficient logic resources for complex designs
  • Automotive-grade reliability without premium pricing
  • Compact package for space-efficient implementations
  • Industry-proven architecture with extensive support

Technical Support and Community

Manufacturer Resources

AMD/Xilinx provides comprehensive technical support including:

  • Online design tools and IP cores
  • Technical documentation library
  • Application engineering support
  • Training and certification programs
  • Active user community forums

Third-Party Ecosystem

Extensive ecosystem of development boards, IP vendors, and design services supporting Spartan-3E FPGAs ensures rapid development and proven solutions.

Frequently Asked Questions

Q: What is the difference between XA and XC Spartan-3E parts?
A: XA parts are automotive-grade with extended temperature range (-40°C to +125°C) and additional reliability screening. XC parts are commercial/industrial grade.

Q: Can I use commercial-grade development tools?
A: Yes, XA parts are fully compatible with standard Xilinx ISE and Vivado Design Suite software.

Q: What configuration memory is required?
A: The XA3S500E requires approximately 2.2 Mbit configuration memory, typically implemented with SPI flash.

Q: Is this FPGA suitable for safety-critical applications?
A: While automotive-grade, specific safety certification requirements should be evaluated for your application.

Conclusion

The XA3S500E-4CPG132I represents an excellent choice for automotive and industrial applications requiring reliable, cost-effective programmable logic. With 500K gates, automotive-grade qualification, and the proven Spartan-3E architecture, this FPGA delivers the performance and reliability needed for demanding applications while maintaining competitive pricing.

Whether you’re designing advanced driver assistance systems, industrial controllers, or communication equipment, the XA3S500E-4CPG132I provides the flexibility, performance, and quality required for successful product deployment.

For more information about this and other <a href=”https://pcbsync.com/xilinx-fpga/”>Xilinx FPGA</a> solutions, consult with your preferred authorized distributor or contact AMD/Xilinx technical support directly.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.