The XC2S200-6FGG803C is a professional-grade Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Spartan-II family, engineered to deliver exceptional performance for complex digital design applications. This advanced programmable logic device combines 200,000 system gates with industrial-grade reliability, making it an ideal choice for telecommunications, automotive, industrial automation, and embedded systems.
Overview of XC2S200-6FGG803C FPGA
The XC2S200-6FGG803C represents the pinnacle of the Spartan-II XC2S200 series, featuring an 803-ball Fine-Pitch Ball Grid Array (FBGA) package that provides maximum I/O capabilities and robust performance. Built on proven 0.18µm CMOS technology, this FPGA delivers a cost-effective solution for demanding applications requiring high logic density and extensive connectivity options.
Key Features and Specifications
| Feature |
Specification |
| System Gates |
200,000 gates |
| Logic Cells |
5,292 cells |
| Configurable Logic Blocks (CLBs) |
1,176 blocks (28 x 42 array) |
| Maximum User I/O |
284 pins |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits |
| Operating Voltage |
2.5V core voltage |
| Speed Grade |
-6 (high-performance) |
| Package Type |
FGG803C (803-ball FBGA) |
| Technology Node |
0.18µm CMOS |
| Temperature Range |
Commercial (0°C to +85°C) |
Technical Architecture and Design
Core Logic Resources
The XC2S200-6FGG803C incorporates a sophisticated architecture designed for maximum flexibility and performance:
Configurable Logic Blocks (CLBs): The device features 1,176 CLBs arranged in a 28 x 42 matrix, providing substantial logic resources for implementing complex digital designs. Each CLB contains look-up tables (LUTs), flip-flops, and multiplexers, enabling flexible implementation of combinatorial and sequential logic.
Memory Architecture: With 56K bits of dedicated block RAM and 75,264 bits of distributed RAM, the XC2S200-6FGG803C offers ample embedded memory for data buffering, FIFO implementations, and small memory arrays without consuming external resources.
I/O Capabilities: The FGG803C package provides up to 284 user I/O pins, supporting various industry-standard I/O protocols and voltage levels, making it ideal for applications requiring extensive external connectivity.
Performance Specifications
| Parameter |
Value |
| Maximum Operating Frequency |
Up to 263 MHz |
| CLB Array Configuration |
28 rows × 42 columns |
| Delay-Locked Loops (DLLs) |
4 DLLs (one per corner) |
| Global Clock Networks |
4 dedicated clock inputs |
| Process Technology |
0.18µm 6-layer metal CMOS |
Applications and Use Cases
Telecommunications and Networking
The XC2S200-6FGG803C excels in telecommunications applications, including protocol converters, network packet processing, and baseband signal processing. Its high I/O count makes it perfect for multi-channel communication systems and data routing applications.
Industrial Control Systems
With 200,000 system gates and robust I/O capabilities, this FPGA is ideal for industrial automation controllers, motor control systems, and process monitoring applications. The commercial temperature range ensures reliable operation in typical industrial environments.
Embedded Systems Development
The XC2S200-6FGG803C provides an excellent platform for embedded system prototyping and development, offering sufficient logic resources for implementing custom peripherals, co-processors, and interface controllers.
Digital Signal Processing
The combination of distributed RAM, block RAM, and high-speed logic makes this FPGA suitable for DSP applications including digital filtering, FFT implementations, and real-time data acquisition systems.
Development and Design Support
Software Tools Compatibility
| Tool |
Description |
| Xilinx ISE Design Suite |
Complete development environment for synthesis, implementation, and verification |
| VHDL/Verilog Support |
Full HDL language support for design entry |
| IP Core Library |
Access to pre-verified IP cores for common functions |
| Timing Analyzer |
Advanced timing analysis and constraint management |
Programming and Configuration
The XC2S200-6FGG803C supports multiple configuration modes:
- JTAG configuration for development and debugging
- Master Serial mode using configuration PROMs
- Slave Serial mode for processor-based configuration
- Boundary scan support for board-level testing
Package Information – FGG803C
The FGG803C package is an advanced fine-pitch ball grid array designed for high-density applications:
Package Advantages:
- Maximum I/O utilization with 803 balls
- Superior thermal performance
- Excellent signal integrity for high-speed designs
- Compact footprint for space-constrained applications
- Industry-standard ball pitch for reliable PCB assembly
Comparison with Alternative Packages
| Package Type |
Ball Count |
Max User I/O |
Application Focus |
| FGG803C |
803 |
284 |
Maximum I/O density |
| FG456/FGG456 |
456 |
284 |
Standard high-density |
| FG256/FGG256 |
256 |
176 |
Compact applications |
| PQ208/PQG208 |
208 |
140 |
Cost-sensitive designs |
Design Considerations and Best Practices
Power Management
Operating at 2.5V core voltage, the XC2S200-6FGG803C offers efficient power consumption characteristics. Designers should consider:
- Proper decoupling capacitor placement near power pins
- Dedicated power planes for clean power distribution
- Thermal management for high-utilization designs
- I/O voltage planning for mixed-voltage systems
PCB Layout Guidelines
For optimal performance with the FGG803C package:
- Use controlled impedance traces for high-speed signals
- Maintain proper ball grid array escape routing patterns
- Implement adequate thermal vias for heat dissipation
- Follow manufacturer recommendations for via-in-pad design
Quality and Compliance
Industry Standards
The XC2S200-6FGG803C meets stringent quality standards:
- Manufacturing Process: Advanced 0.18µm CMOS technology
- Quality Assurance: Comprehensive testing and screening
- Environmental: Commercial temperature range qualification
- Reliability: Proven Spartan-II architecture with extensive field deployment
RoHS and Export Compliance
The “G” designation in FGG803C indicates Pb-free (lead-free) packaging, meeting RoHS compliance requirements for environmentally responsible manufacturing. Standard export classifications apply, with proper documentation for international shipments.
Ordering Information and Availability
Part Number Breakdown
XC2S200-6FGG803C
- XC2S200: Device family and logic density (200K gates)
- -6: Speed grade (high performance)
- FGG803: Package type (fine-pitch BGA, 803 balls)
- C: Commercial temperature range (0°C to +85°C)
Procurement Considerations
When sourcing the XC2S200-6FGG803C, consider:
- Verify lead times with authorized distributors
- Request date codes for production planning
- Check inventory availability for volume requirements
- Confirm package marking and lot traceability
Related Products and Alternatives
Engineers considering the XC2S200-6FGG803C may also evaluate:
Within Spartan-II Family:
- XC2S150-6FGG803C (150K gates, similar package)
- XC2S100-6FGG456C (100K gates, smaller package)
Newer Xilinx Families: For new designs, consider exploring more recent Xilinx FPGA families that offer enhanced performance, lower power consumption, and advanced features while maintaining design methodology compatibility.
Technical Support and Resources
Documentation
Comprehensive technical resources available for the XC2S200-6FGG803C:
- Complete Datasheet: Detailed electrical characteristics and timing specifications
- User Guides: Architecture overview and design methodology
- Application Notes: Design examples and best practices
- PCB Design Files: Package footprints and 3D models
Development Resources
- Reference designs for common applications
- IP core catalog for accelerated development
- Online design tutorials and webinars
- Community forums and technical support
Why Choose XC2S200-6FGG803C?
Competitive Advantages
- Proven Architecture: Battle-tested Spartan-II platform with extensive deployment history
- Maximum I/O Density: FGG803C package provides superior connectivity options
- Cost-Effective Solution: Excellent price-to-performance ratio for 200K gate designs
- Design Tool Maturity: Comprehensive support in Xilinx ISE with extensive documentation
- Field Upgradeability: Reconfigurable design allows updates without hardware changes
Target Applications Summary
| Industry |
Applications |
| Telecommunications |
Protocol converters, base stations, network switches |
| Industrial |
PLCs, motor controllers, HMI systems |
| Automotive |
Sensor fusion, gateway modules, dashboard controllers |
| Medical |
Diagnostic equipment, imaging systems, patient monitors |
| Aerospace |
Avionics interfaces, data acquisition, control systems |
Conclusion
The XC2S200-6FGG803C represents a robust, high-performance FPGA solution for applications demanding 200,000 system gates and maximum I/O flexibility. With its 803-ball fine-pitch BGA package, industrial-grade reliability, and comprehensive development tool support, this Spartan-II device continues to serve as an excellent choice for cost-sensitive designs requiring proven technology and extensive connectivity.
Whether you’re developing telecommunications equipment, industrial controllers, or embedded systems, the XC2S200-6FGG803C delivers the logic resources, I/O capabilities, and performance characteristics needed for successful implementation. Its compatibility with established design methodologies and extensive ecosystem support ensures efficient development cycles and reliable production deployment.
For detailed technical specifications, ordering information, and application support, consult authorized AMD Xilinx distributors and access the complete datasheet documentation through official channels.
