The XC2S200-6FGG802C represents a flagship member of the Spartan-II FPGA family, engineered by Xilinx (now AMD) to deliver exceptional programmable logic capabilities in a compact 802-ball Fine-Pitch Ball Grid Array package. This advanced Xilinx FPGA solution combines 200,000 system gates with 5,292 logic cells, making it an ideal choice for complex digital design implementations across telecommunications, industrial automation, and embedded systems applications.
Key Technical Specifications and Features
Core Architecture Performance
The XC2S200-6FGG802C is built on a cost-effective 0.18-micron CMOS process technology, offering robust performance characteristics that meet demanding application requirements. This Spartan-II device operates at a core voltage of 2.5V while supporting flexible I/O voltages of 1.5V, 2.5V, and 3.3V across different banking configurations.
| Specification |
Value |
Description |
| Logic Cells |
5,292 |
Configurable logic blocks for digital circuit implementation |
| System Gates |
200,000 |
Total gate equivalent including logic and RAM resources |
| CLB Array |
28 x 42 (1,176 CLBs) |
Organized configurable logic block structure |
| Maximum User I/O |
284 pins |
Available general-purpose input/output connections |
| Operating Frequency |
263 MHz |
Maximum system performance capability |
| Speed Grade |
-6 |
Commercial temperature range performance rating |
Memory Architecture and Resources
The XC2S200-6FGG802C incorporates a hierarchical memory structure designed to optimize both performance and flexibility in digital design applications.
Distributed RAM Resources:
- Total Distributed RAM: 75,264 bits
- Implementation: 16 bits per Look-Up Table (LUT)
- Configuration: Flexible single-port and dual-port arrangements
Block RAM Configuration:
- Total Block RAM: 56K bits (14 blocks × 4,096 bits)
- Dual-Port Architecture: Independent control signals per port
- Configurable Aspect Ratios: 1×4096, 2×2048, 4×1024, 8×512, 16×256
- Synchronous Operation: Fully synchronous read/write operations
Package Configuration: FGG802 Fine-Pitch BGA
Physical Characteristics
The XC2S200-6FGG802C utilizes an 802-ball Fine-Pitch Ball Grid Array (FBGA) package, providing superior electrical performance and thermal characteristics compared to standard packaging options.
| Package Parameter |
Specification |
| Package Type |
FGG802 (Fine-Pitch BGA) |
| Total Balls |
802 balls |
| Ball Material |
Pb-free (RoHS compliant – G designation) |
| Mounting Type |
Surface mount technology |
| Thermal Performance |
Enhanced heat dissipation capability |
I/O Banking and Interface Standards
The XC2S200-6FGG802C supports 16 high-performance I/O interface standards, enabling seamless integration with contemporary memory interfaces, communication protocols, and peripheral devices. The device implements an 8-bank I/O architecture, allowing designers to mix compatible voltage standards within the same application.
Supported I/O Standards:
- LVTTL (2-24 mA drive strength)
- LVCMOS2
- PCI (3V/5V, 33 MHz/66 MHz compliance)
- GTL and GTL+
- HSTL Class I, III, and IV
- SSTL2 and SSTL3 (Class I and II)
- CTT
- AGP-2X
Advanced Clock Management with Delay-Locked Loops
DLL Capabilities
The XC2S200-6FGG802C incorporates four dedicated Delay-Locked Loop (DLL) circuits strategically positioned at each corner of the die. These fully digital DLLs provide sophisticated clock distribution and management capabilities essential for high-performance synchronous designs.
DLL Features and Benefits:
- Zero propagation delay from input clock to internal flip-flops
- Automatic clock distribution skew elimination
- Quadrature phase generation (0°, 90°, 180°, 270°)
- Clock multiplication (2X doubling capability)
- Clock division ratios: 1.5, 2, 2.5, 3, 4, 5, 8, and 16
- Clock mirroring for board-level synchronization
Configuration and Programming Options
Flexible Configuration Modes
The XC2S200-6FGG802C supports multiple configuration methodologies, providing designers with implementation flexibility based on system architecture requirements.
| Configuration Mode |
Data Width |
Clock Direction |
DOUT Available |
| Master Serial |
1-bit |
Output (generated internally) |
Yes |
| Slave Serial |
1-bit |
Input (external source) |
Yes |
| Slave Parallel |
8-bit |
Input (external source) |
No |
| Boundary-Scan (JTAG) |
1-bit |
N/A (TCK controlled) |
No |
Configuration Data Size: 1,335,840 bits (167.48 KB)
Serial PROM Compatibility
Master Serial mode operation enables direct configuration from Xilinx serial PROMs, with configurable CCLK frequencies ranging from 4 MHz to 60 MHz (default 4 MHz). The internal oscillator provides convenient configuration timing with +45%/-30% frequency tolerance.
Application Areas and Use Cases
Industrial Automation and Control
The XC2S200-6FGG802C excels in industrial environments requiring precise digital control, motor management, and process automation. The device’s robust architecture and extensive I/O capabilities support complex control algorithms while maintaining real-time responsiveness.
Telecommunications and Networking
With support for high-speed interfaces and substantial logic resources, this FPGA implementation enables protocol processing, data path management, and communication interface bridging in telecommunications infrastructure equipment.
Medical and Instrumentation Systems
The reconfigurability and reliability characteristics of the XC2S200-6FGG802C make it suitable for medical imaging systems, diagnostic equipment, and patient monitoring devices where field upgradability provides significant lifecycle advantages.
Consumer Electronics and Embedded Systems
Applications in consumer electronics benefit from the XC2S200-6FGG802C’s combination of performance, power efficiency, and cost-effectiveness, particularly in digital signal processing, image processing, and multimedia applications.
Design Tools and Development Support
ISE Development System Integration
The XC2S200-6FGG802C receives full support through Xilinx ISE development tools, providing comprehensive design entry, synthesis, implementation, and verification capabilities.
Development Environment Features:
- Automatic place-and-route optimization
- Timing-driven implementation
- Hierarchical design methodology support
- Hardware co-simulation capability
- In-system debugging and readback
- Boundary-scan testing (IEEE 1149.1)
Power and Thermal Considerations
Voltage Requirements
| Supply Rail |
Voltage |
Function |
| VCCINT |
2.5V |
Core logic power supply |
| VCCO (Banks 0-7) |
1.5V, 2.5V, or 3.3V |
I/O interface voltage (bank-dependent) |
Temperature Operating Ranges
- Commercial Grade (C): 0°C to +85°C junction temperature
- Package thermal characteristics optimize heat dissipation in space-constrained applications
Competitive Advantages and Benefits
ASIC Replacement Strategy
The XC2S200-6FGG802C provides a superior alternative to mask-programmed ASICs, eliminating initial non-recurring engineering costs, reducing development cycles, and mitigating the inherent risks associated with fixed-function silicon. Unlimited reprogrammability enables field upgrades without hardware replacement, impossible with traditional ASIC implementations.
Cost-Effective High-Volume Solution
Leveraging advanced 0.18-micron process technology, the Spartan-II family delivers ASIC-level pricing while maintaining FPGA flexibility benefits. This combination makes the XC2S200-6FGG802C particularly attractive for high-volume production environments.
Design Security and IP Protection
Configuration readback capabilities enable design verification while supporting secure IP implementation strategies. The device supports both volatile and non-volatile configuration storage methodologies.
Quality and Reliability Standards
The XC2S200-6FGG802C meets rigorous quality standards with comprehensive environmental testing and qualification. The lead-free (Pb-free) package variant, denoted by the “G” suffix in FGG802, complies with RoHS environmental directives.
Migration and Scalability Path
Spartan-II Family Footprint Compatibility
The FGG802 package maintains pin compatibility across multiple Spartan-II density options, enabling seamless device migration as design requirements evolve. Common package pinouts facilitate prototype-to-production transitions with minimal PCB redesign.
Upgrade Considerations
Designers can leverage the same development infrastructure across the complete Spartan-II product range, from the entry-level XC2S15 to the flagship XC2S200, maximizing tool investment and design methodology reuse.
Ordering Information and Part Number Decoder
Part Number Format: XC2S200-6FGG802C
- XC2S200: Device designation (Spartan-II, 200K gates)
- -6: Speed grade (highest performance, commercial temperature)
- F: Fine-pitch BGA package family
- G: Lead-free (Pb-free) package variant
- G: Enhanced package marking (second G)
- 802: Total ball count
- C: Commercial temperature range (0°C to +85°C)
Conclusion
The XC2S200-6FGG802C represents a comprehensive programmable logic solution combining substantial logic density, flexible I/O capabilities, advanced clock management, and multiple configuration options in a compact, thermally-efficient package. Whether implementing complex communication protocols, sophisticated control algorithms, or high-performance digital signal processing functions, this Spartan-II FPGA provides the resources, performance, and flexibility required for demanding contemporary applications.
For designers seeking a proven, cost-effective programmable logic platform with extensive support resources and established reliability, the XC2S200-6FGG802C delivers exceptional value across diverse application domains from industrial automation to telecommunications infrastructure.
