The XC2S200-6FGG795C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Xilinx Spartan-II family. Designed to deliver a cost-effective solution without compromising on feature set, this device is engineered for high-volume applications ranging from consumer electronics to advanced industrial control systems.
By leveraging a 0.22-micron architecture, the XC2S200-6FGG795C offers the ideal balance of system performance and low power consumption. For engineers looking to scale their projects with reliable programmable logic, this component provides a proven foundation. You can explore more about this technology and its ecosystem at the Xilinx FPGA LINK.
Technical Specifications of XC2S200-6FGG795C
To assist in your hardware design process, below is a detailed breakdown of the technical parameters defining the XC2S200-6FGG795C. This device is optimized for designs requiring significant logic density and extensive I/O capabilities.
Core Performance Metrics
| Parameter |
Specification |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 |
| Total Block RAM |
56,320 Bits |
| Speed Grade |
-6 (High Performance) |
| Package Type |
FGG795 (795-pin Fine-Pitch BGA) |
| Operating Temperature |
0°C to +85°C (Commercial) |
Key Features and Architectural Advantages
The XC2S200-6FGG795C distinguishes itself through a rich set of architectural features that streamline system integration and enhance design flexibility.
1. Robust Clock Management
The device includes four dedicated Delay-Locked Loops (DLLs). These DLLs are critical for effective clock distribution, offering zero-propagation delay, clock mirroring, and frequency synthesis. This ensures that high-speed data transmission remains synchronized across the extensive logic fabric.
2. Versatile Memory Hierarchy
Designers can utilize the 56K bits of dedicated on-chip Block RAM for efficient data buffering. Additionally, the distributed RAM capability allows for the implementation of shallow RAM structures, shift registers, and FIFOs directly within the Configurable Logic Blocks (CLBs).
3. Comprehensive I/O Standards
This FPGA supports a wide array of signaling standards, making it highly compatible with legacy and modern peripherals:
-
LVTTL & LVCMOS (3.3V, 2.5V, 1.8V)
-
PCI (33 MHz and 66 MHz compliant)
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GTL / GTL+
-
SSTL & HSTL (High-speed transceiver logic)
Target Applications for XC2S200-6FGG795C
With its high pin count and substantial gate density, the XC2S200-6FGG795C is uniquely positioned for complex embedded applications.
Telecommunications and Networking
The device is capable of handling protocol conversion, packet processing, and interface bridging in routers and switches. The -6 speed grade ensures that timing constraints for high-speed buses are met reliably.
Industrial Automation
In the industrial sector, reliability is paramount. The XC2S200-6FGG795C provides the durability required for Programmable Logic Controllers (PLCs), motor drive control systems, and machine vision interfaces.
Digital Signal Processing (DSP)
While cost-effective, the Spartan-II architecture efficiently executes parallel arithmetic operations, making it suitable for digital filtering, video processing, and encryption algorithms.
Why Select the FGG795 Package?
The selection of the FGG795 package offers specific benefits for PCB designers and system integrators.
High-Density Connectivity
The 795-pin Ball Grid Array (BGA) footprint allows for maximum user I/O utilization. This is particularly beneficial for designs that interface with wide memory buses or multiple peripheral devices simultaneously.
Thermal Management
The BGA design provides superior thermal performance compared to traditional leaded packages. The efficient heat dissipation paths via the solder balls ensure the device operates within its commercial temperature range even under heavy logic loads.
Conclusion
The XC2S200-6FGG795C remains a strategic choice for designers seeking a mature, stable, and highly capable FPGA platform. Its combination of 200,000 system gates, advanced clock management, and the extensive connectivity of the FGG795 package makes it a versatile solution for today’s competitive electronics market. Whether upgrading legacy systems or developing new products, this Xilinx Spartan-II device delivers the performance necessary to succeed.
