Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG793C: High-Density Spartan-II FPGA for Advanced Logic Solutions

Product Details

The XC2S200-6FGG793C is a cornerstone of the Xilinx Spartan-II family, offering a cost-effective yet powerful solution for high-volume electronic applications. This Field Programmable Gate Array (FPGA) is specifically engineered to provide the performance of high-end gate arrays while maintaining the flexibility and short time-to-market advantages of programmable logic.

With a focus on versatility, the XC2S200-6FGG793C is an ideal choice for designers who require significant logic density and extensive I/O capabilities. For those sourcing high-quality components, you can find more information via this Xilinx FPGA LINK.


Technical Specifications of the XC2S200-6FGG793C

The XC2S200-6FGG793C is built on a proven 0.22µm process, delivering a balance of power efficiency and high speed. Below is a detailed breakdown of its core architectural features.

Core Performance Metrics

Feature Specification
System Gates 200,000
Logic Cells 5,292
Typical Gate Range 50,000 – 200,000
CLB Array 28 x 42
Total Block RAM 56,320 Bits
Distributed RAM 75,264 Bits
Maximum User I/O 432

Key Features of the Spartan-II XC2S200 Series

The XC2S200-6FGG793C stands out due to its comprehensive feature set, designed to simplify complex system integration.

1. Enhanced Clock Management

The device features four dedicated Delay-Locked Loops (DLLs). These are essential for:

  • Eliminating clock skew.

  • Clock multiplication and division.

  • High-precision frequency synthesis across the chip.

2. Flexible Memory Architecture

The Spartan-II architecture provides a dual-level memory hierarchy. It includes dedicated Block RAM (in 4,096-bit blocks) for deep data buffering and Distributed RAM, which utilizes the Look-Up Tables (LUTs) for fast, shallow memory requirements.

3. Multi-Standard I/O Support

The XC2S200-6FGG793C supports over 16 high-performance I/O standards, including:

  • LVTTL/LVCMOS (3.3V, 2.5V, 1.8V, 1.5V)

  • PCI (33MHz and 66MHz compliant)

  • GTL/GTL+ and HSTL

  • SSTL3 and SSTL2


Optimizing Designs with the FGG793 Package

The FGG793 package is a Fine-pitch Ball Grid Array (FBGA) that provides a high density of interconnects in a compact footprint. This is particularly beneficial for designs requiring extensive parallel data busing.

Package and Thermal Characteristics

Attribute Detail
Package Type FGG793 (Fine-pitch BGA)
Pin Count 793 Pins
Speed Grade -6 (High Performance)
Operating Temperature 0°C to 85°C (Commercial)
Core Voltage 2.5V

Target Applications for XC2S200-6FGG793C

Thanks to its 200,000-gate capacity and robust I/O flexibility, this FPGA is frequently utilized in several high-demand sectors:

Industrial Control Systems

Used for motor control, sensor fusion, and real-time industrial communication protocols where low latency is non-negotiable.

Telecommunications

Ideal for protocol bridging, frame processing, and interfacing between high-speed backplanes and local processing units.

Consumer Electronics

Provides the logic density required for digital video processing, set-top boxes, and advanced home automation hubs.


Why Choose XC2S200-6FGG793C for Your Project?

When comparing this device to other variants in the Spartan-II family, the XC2S200-6FGG793C offers the maximum available gate count and the highest I/O availability. While smaller packages might suffice for simple glue logic, the 793-pin configuration is the professional choice for comprehensive “System-on-a-Chip” (SoC) prototyping and implementation.

Advantages Summary:

  • Full PCI Compliance: Ready for integration into legacy and industrial PC architectures.

  • Low Power Consumption: The 2.5V core ensures minimal thermal overhead.

  • Unlimited Reprogrammability: Fast configuration times allow for easy in-system updates.


Final Thoughts on XC2S200-6FGG793C Integration

The XC2S200-6FGG793C remains a highly reliable and versatile component within the Xilinx ecosystem. Its combination of high-density logic, advanced clocking, and flexible I/O makes it a “workhorse” for engineers looking to balance cost with high-tier FPGA capabilities. Whether you are maintaining a legacy system or developing a cost-optimized industrial controller, the Spartan-II 200K gate FPGA delivers consistent results.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.