The XC2S200-6FGG790C is a high-performance Field Programmable Gate Array (FPGA) from the Xilinx Spartan-II family, designed to deliver a cost-effective solution for high-volume applications. Offering a robust balance of system performance and logic density, this device allows engineers to implement complex digital logic designs without the high upfront costs associated with ASICs. With its advanced architecture and programmable features, the XC2S200-6FGG790C is ideal for a wide range of industrial, consumer, and communications applications.

If you are looking for a reliable programmable logic solution, the Xilinx FPGA portfolio offers versatile options to meet your design requirements.

Technical Specifications Overview

The XC2S200-6FGG790C is built on a proven 0.18-micron process technology, providing high performance at a low price point. It features a specific “FGG790” package that optimizes board space while maintaining excellent signal integrity. Below are the key technical parameters of this device.

Key Features Table

Feature	Specification
Part Number	XC2S200-6FGG790C
Family	Spartan-II
System Gates	200,000
Logic Cells	5,292
CLB Array	28 x 42
Total CLBs	1,176
Block RAM	56 Kbits
Distributed RAM	75,264 Bits
Max User I/O	Dependent on Package Configuration
Speed Grade	-6 (High Performance)
Core Voltage	2.5V
Temperature Range	Commercial (0°C to +85°C)

Architectural Advantages of the XC2S200-6FGG790C

The Spartan-II architecture is derived from the highly successful Virtex series, bringing high-end capabilities to a cost-optimized platform. The XC2S200-6FGG790C leverages this architecture to provide significant design flexibility.

Configurable Logic Blocks (CLBs)

At the heart of the device are the Configurable Logic Blocks (CLBs), which provide the functional elements for implementing logic. Each CLB contains four logic cells, organized into two slices. This structure supports efficient implementation of logic functions, arithmetic operations, and memory storage. The abundant logic resources (5,292 Logic Cells) ensure that designers have sufficient capacity for complex algorithms and control logic.

Memory Hierarchy

The device features a flexible memory hierarchy, including:

• Block RAM: Dedicated 4K-bit blocks that can be configured as dual-port RAM, ideal for FIFOs and data buffering.

• Distributed RAM: The Look-Up Tables (LUTs) within the CLBs can be used as small, distributed memory blocks for shallow RAM requirements.

Advanced Clock Management

Timing is critical in high-speed digital designs. The XC2S200-6FGG790C includes four dedicated Delay-Locked Loops (DLLs). These DLLs provide advanced clock management capabilities, including:

• Clock De-skew: Eliminating clock distribution delays.

• Frequency Synthesis: Multiplying or dividing clock frequencies to generate required internal clocks.

• Phase Shifting: Adjusting clock phase for precise timing control.

These features ensure that the FPGA can operate reliably at high frequencies, supported by the -6 speed grade which offers superior performance over standard speed grades.

Applications and Use Cases

Due to its versatile I/O standards and substantial logic density, the XC2S200-6FGG790C is suitable for diverse applications.

Industrial Control

In industrial environments, reliability and reprogrammability are essential. This FPGA allows for the integration of motor control loops, sensor interfaces, and communication protocols (such as CAN or RS-485) into a single chip.

Communications

The device supports various I/O standards, making it an excellent choice for protocol bridging and data processing in telecommunications equipment. The dedicated Block RAM is particularly useful for packet buffering and framing operations.

Consumer Electronics

For high-volume consumer products, the low cost of the Spartan-II family makes the XC2S200-6FGG790C an attractive option for implementing custom display controllers, interface logic, and glue logic consolidation.

Ordering and Environmental Information

The “FGG790C” suffix indicates the package type and temperature grade. The “G” typically denotes a Pb-free (Lead-free) package, complying with RoHS directives, making it suitable for environmentally conscious manufacturing processes.

Environmental Specifications

Parameter	Rating
Operating Temperature	0°C to +85°C (Commercial)
RoHS Compliance	Yes (Pb-Free)
Moisture Sensitivity	Level 3
Package Type	Fine-Pitch Ball Grid Array

In summary, the XC2S200-6FGG790C provides a powerful combination of capacity, performance, and value. Its 200,000 system gates and flexible architecture enable engineers to innovate and bring products to market faster, replacing traditional ASICs with a more adaptable programmable solution.