The XC2S200-6FGG789C is a high-density Field Programmable Gate Array (FPGA) from the Xilinx Spartan-II family. Designed to offer a cost-effective alternative to ASICs, this device delivers 200,000 system gates of programmable logic. It combines advanced process technology with a versatile architecture, making it an ideal choice for high-volume consumer and industrial applications.
With its -6 speed grade, this FPGA offers superior performance for demanding digital designs. The “FGG789” package designation indicates a high-density Fine-Pitch Ball Grid Array (FBGA) configuration, providing extensive I/O connectivity for complex system integration.
Key Features of XC2S200-6FGG789C
The XC2S200-6FGG789C is built on a 0.18-micron CMOS process, optimizing both speed and power consumption. It features a flexible Configurable Logic Block (CLB) structure that supports efficient logic implementation.
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System Gates: 200,000 equivalent system gates.
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Logic Cells: 5,292 logic cells for complex processing.
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Memory: Includes 56K bits of dedicated Block RAM and up to 75K bits of distributed RAM.
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Clock Management: Four on-chip Delay-Locked Loops (DLLs) for precise clock control and skew elimination.
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I/O Standards: Supports 16 high-performance interface standards, including LVTTL, LVCMOS, and PCI.
Technical Specifications
The following table outlines the core technical specifications of the XC2S200-6FGG789C.
| Specification |
Detail |
| Part Number |
XC2S200-6FGG789C |
| Family |
Spartan-II |
| Logic Cells |
5,292 |
| System Gates |
200,000 |
| Total RAM |
~131,000 bits (Block + Distributed) |
| Core Voltage |
2.5V |
| Speed Grade |
-6 (High Performance) |
| Package |
789-pin Fine-Pitch BGA (FGG789) |
| Temperature Range |
Commercial (0°C to +85°C) |
| Process Technology |
0.18 µm / 6-layer Metal CMOS |
Advanced Architecture and Performance
The Spartan-II architecture is derived from the renowned Virtex series, bringing high-end capabilities to a cost-optimized platform. The device’s segmented routing architecture ensures fast, predictable interconnect delays.
Flexible Memory Resources
Designers can utilize the versatile block RAM for efficient data buffering and storage. The dual-port nature of these blocks allows for simultaneous read and write operations, which is essential for FIFO implementation and video line buffering.
Clock Management
The four dedicated DLLs provide advanced clock management capabilities. They can be used for clock division, multiplication, and phase shifting, ensuring that high-speed designs operate reliably across the board.
Applications
The XC2S200-6FGG789C is versatile enough to be used in a wide range of industries. Its high I/O count and logic density make it suitable for:
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Telecommunications: Protocol bridging and high-speed data switching.
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Industrial Control: Motor control loops and sensor interfacing.
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Consumer Electronics: Digital signal processing for audio and video equipment.
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Automotive: Infotainment systems and dashboard controllers.
For engineers looking to integrate this powerful Xilinx FPGA into their next design, the Spartan-II family offers a proven track record of reliability and ease of use.
Package and Handling
The FGG789C package is a surface-mount Fine-Pitch Ball Grid Array. This packaging technology maximizes board space efficiency while providing a robust thermal and electrical connection. The “C” suffix denotes the commercial temperature range, making it suitable for standard operating environments.
Designers should ensure proper thermal management and PCB layout practices are followed to leverage the full performance of the -6 speed grade. The device supports IEEE 1149.1 boundary-scan (JTAG) for easy testing and configuration.
