Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG786C Xilinx Spartan-II FPGA

Product Details

The XC2S200-6FGG786C is a high-performance Field-Programmable Gate Array (FPGA) from Xilinx’s renowned Spartan-II family. Designed to deliver a cost-effective solution for high-volume applications, this device combines the flexibility of programmable logic with the performance typically associated with ASICs. With 200,000 system gates and advanced architectural features, the XC2S200-6FGG786C is engineered to meet the rigorous demands of modern digital systems, offering a versatile platform for telecommunications, consumer electronics, and industrial control designs.

Key Features of the XC2S200-6FGG786C

The Spartan-II family is built on a proven 0.18-micron CMOS process, ensuring reliability and efficiency. The XC2S200-6FGG786C specifically offers a balance of logic density and I/O capability, making it an ideal choice for designers looking to optimize board space and power consumption without sacrificing performance.

  • High Logic Density: Features 200,000 system gates and 5,292 logic cells, providing ample resources for complex logic integration.

  • Advanced Memory: Includes 56 Kbits of dedicated Block RAM and up to 75 Kbits of distributed RAM for efficient data buffering and storage.

  • System Performance: Supports system speeds up to 200 MHz, driven by a -6 speed grade architecture.

  • Flexible Clocking: Equipped with four Digital Delay-Locked Loops (DLLs) for precise clock management and skew elimination.

  • Versatile I/O: Supports multiple I/O standards, including LVTTL, LVCMOS, and PCI, ensuring broad compatibility with peripheral devices.

  • Low Voltage Operation: Operates with a 2.5V core voltage, reducing overall power consumption while maintaining interface compatibility.

Technical Specifications

The following table outlines the core technical specifications of the XC2S200-6FGG786C, highlighting its capacity and operational parameters.

Specification Detail
Part Number XC2S200-6FGG786C
Manufacturer Xilinx (AMD)
Family Spartan-II
System Gates 200,000
Logic Cells 5,292
Total Block RAM 56 Kbits
CLB Array 28 x 42
Speed Grade -6
Core Voltage 2.5 V
Operating Temperature Commercial (0°C to 85°C)
Package FGG786 (Fine-Pitch Ball Grid Array)

Architectural Advantages

The XC2S200-6FGG786C leverages the Spartan-II architecture to provide significant advantages in design flexibility. Its Configurable Logic Blocks (CLBs) are interconnected by a powerful routing hierarchy, allowing for fast signal propagation and predictable timing. This architecture supports unlimited reprogrammability, enabling engineers to upgrade designs in the field without hardware replacement—a distinct advantage over traditional mask-programmed ASICs.

Furthermore, the device integrates dedicated carry logic for high-speed arithmetic functions and cascade chains for wide-input functions. These features streamline the implementation of digital signal processing (DSP) tasks and complex state machines, reducing development time and cost.

Optimized for High-Volume Production

Designers choosing the Xilinx FPGA platform benefit from a solution tailored for scalability. The XC2S200-6FGG786C minimizes initial engineering costs and eliminates the long lead times associated with custom silicon. Its availability in the FGG786 package ensures compatibility with modern surface-mount assembly processes, facilitating streamlined manufacturing flows.

Applications

Due to its robust feature set and cost-efficiency, the XC2S200-6FGG786C is deployed across a wide range of industries. Common applications include:

  • Telecommunications: Network switching, protocol bridging, and data packet processing.

  • Consumer Electronics: DVD players, set-top boxes, and digital display controllers.

  • Industrial Automation: Motor control systems, sensor interfacing, and robotics.

  • Automotive: Infotainment systems and dashboard control modules.

Conclusion

The XC2S200-6FGG786C stands out as a reliable and versatile FPGA solution within the Spartan-II lineage. By offering a substantial gate count, flexible memory resources, and high-speed performance at a competitive price point, it empowers engineers to innovate and deliver superior electronic products. Whether for legacy system maintenance or new cost-sensitive designs, this device remains a critical component in the programmable logic landscape.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.