The XC2S200-6FGG785C is a highly versatile Field-Programmable Gate Array (FPGA) designed to deliver robust performance for cost-sensitive applications. Part of the renowned Spartan-II family, this device leverages advanced process technology to provide a streamlined architecture derived from the Virtex series. With its impressive logic density and flexible memory resources, the XC2S200-6FGG785C serves as an ideal solution for engineers seeking to optimize their digital designs without the high costs associated with custom ASICs.
If you are looking for a reliable Xilinx FPGA, this component offers the perfect balance of speed, programmability, and power efficiency.
Key Technical Specifications of XC2S200-6FGG785C
Understanding the technical capabilities of the XC2S200-6FGG785C is crucial for effective system integration. The device features 200,000 system gates and a high-speed -6 speed grade, ensuring it meets the rigorous timing requirements of modern electronics.
Performance and Logic Density
The table below outlines the core specifications that make this FPGA a powerhouse in its class.
| Feature |
Specification |
| Part Number |
XC2S200-6FGG785C |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| Speed Grade |
-6 (High Performance) |
| Block RAM |
56 Kbits |
| Distributed RAM |
75,264 Bits |
| Operating Temperature |
Commercial (0°C to +85°C) |
| Core Voltage |
2.5V |
Memory and I/O Capabilities
In addition to logic resources, the XC2S200-6FGG785C provides extensive memory and input/output options to support complex data processing tasks.
| Parameter |
Details |
| Total CLBs |
1,176 |
| CLB Array |
28 x 42 |
| Max User I/O |
Up to 284 (depending on configuration) |
| Supported I/O Standards |
LVTTL, LVCMOS, PCI, GTL, SSTL |
| Package Type |
Fine-Pitch Ball Grid Array (FGG) |
Architectural Features and Benefits
The Spartan-II architecture utilized by the XC2S200-6FGG785C allows for unlimited reprogrammability, enabling designers to upgrade systems in the field without replacing hardware. This flexibility significantly reduces development risks and time-to-market.
Advanced Process Technology
Built on a 0.18-micron six-layer metal process, the XC2S200-6FGG785C achieves high performance while maintaining low power consumption. The device operates with a 2.5V core voltage, making it compatible with various industry-standard power supplies.
Flexible Clock Management
The FPGA includes four dedicated Delay-Locked Loops (DLLs), providing advanced clock control capabilities. These DLLs help eliminate clock skew and support frequency synthesis, which is essential for high-speed communication interfaces.
Applications for the XC2S200-6FGG785C
Due to its robust feature set, the XC2S200-6FGG785C is suitable for a wide range of industrial and consumer applications.
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Telecommunications: Efficient signal processing and protocol management.
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Industrial Control: Reliable motor control and sensor data aggregation.
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Consumer Electronics: Cost-effective logic for display drivers and interface bridging.
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Automotive Systems: Flexible processing for infotainment and dashboard controls.
Why Choose This Xilinx FPGA?
Selecting the XC2S200-6FGG785C ensures you are building on a proven platform. Its combination of high gate count, abundant RAM, and flexible I/O support makes it superior to traditional mask-programmed ASICs. By choosing this programmable logic solution, you gain the ability to adapt to changing requirements instantly, securing the longevity and competitiveness of your final product.