The XC2S200-6FGG779C is a premier Field Programmable Gate Array (FPGA) from the acclaimed Xilinx Spartan-II family. Designed to deliver a robust combination of performance, flexibility, and cost-efficiency, this device is engineered for high-volume applications where logic density and I/O versatility are paramount. With its advanced 0.18-micron architecture and 200,000 system gates, the XC2S200-6FGG779C serves as an ideal alternative to mask-programmed ASICs, offering unlimited reprogrammability and accelerated time-to-market.
Product Specifications Overview
To provide a clear understanding of the technical capabilities, the following table outlines the key specifications of the XC2S200-6FGG779C.
| Specification Category |
Detail |
| Part Number |
XC2S200-6FGG779C |
| Manufacturer |
Xilinx (AMD) |
| Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| Total RAM Bits |
57,344 Bits |
| Speed Grade |
-6 (High Performance) |
| Core Voltage |
2.5 V |
| Process Technology |
0.18 µm CMOS |
| Package Type |
FGG779 (Fine-Pitch Ball Grid Array) |
| Temperature Range |
Commercial (0°C to +85°C) |
Advanced Architectural Features
The XC2S200-6FGG779C leverages the proven Virtex® architecture, streamlined for cost-sensitive markets without compromising on power.
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Configurable Logic Blocks (CLBs): The device contains a flexible array of CLBs, each providing functional elements for synchronous and combinatorial logic. This structure supports complex digital processing tasks efficiently.
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SelectRAM+ Memory Hierarchy: It features a dual-level memory architecture. This includes fast distributed RAM for shallow memory structures and dedicated Block RAM for larger data storage requirements, ensuring optimal throughput for memory-intensive applications.
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Clock Management: Equipped with four digital Delay-Locked Loops (DLLs), the FPGA offers precise clock management capabilities. These DLLs eliminate clock skew and support advanced frequency synthesis, which is critical for high-speed system designs.
Key Benefits of the XC2S200-6FGG779C
Engineers and system designers choose the XC2S200-6FGG779C for its ability to bridge the gap between low-cost PLDs and high-density FPGAs.
Superior Performance and Flexibility
With a speed grade of -6, this device handles high-frequency operations with ease. The abundance of logic cells (5,292) allows for the integration of substantial system logic, reducing the need for external components. Furthermore, the unlimited reprogrammability allows for field upgrades, extending the product lifecycle and reducing maintenance costs.
Versatile I/O Connectivity
The “779C” package designation indicates a high-density connectivity solution. The device supports a wide range of I/O standards, including LVTTL, LVCMOS, and PCI. This extensive compatibility ensures seamless integration with other system components, such as processors, memory modules, and legacy peripherals.
| I/O Feature |
Description |
| Supported Standards |
16 High-Performance Standards (LVDS, GTL+, etc.) |
| Voltage Compatibility |
3.3V, 2.5V, and 1.5V signaling support |
| Drive Strength |
Programmable drive strength and slew rate |
Applications and Use Cases
The versatility of the XC2S200-6FGG779C makes it a preferred choice across various industry sectors:
1. Telecommunications
In telecom infrastructure, this FPGA manages data packet processing, framing, and protocol conversion. Its high-speed I/O capabilities are essential for maintaining signal integrity across transmission lines.
2. Industrial Automation
For industrial control systems, the device provides reliable logic for motor control, sensor interfacing, and real-time monitoring. The robust temperature range ensures stability in demanding environments.
3. Consumer Electronics
The cost-effective nature of the Spartan-II family allows it to be used in high-volume consumer devices, handling tasks such as video processing, display driving, and interface bridging.
Why Choose Xilinx Spartan-II?
The Spartan-II family, represented by the XC2S200-6FGG779C, is synonymous with reliability. Unlike traditional ASICs that require months for fabrication and carry high non-recurring engineering (NRE) costs, this FPGA offers an off-the-shelf solution that can be configured in minutes.
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Low Power Consumption: The segmented routing architecture and 2.5V core voltage significantly reduce power draw, making it suitable for energy-efficient designs.
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Development Support: Supported by industry-standard design tools, users can easily synthesize, simulate, and verify their designs before implementation.
Conclusion
The XC2S200-6FGG779C stands out as a powerful, versatile, and economical solution for modern digital circuit design. Whether you are developing complex communication systems or compact industrial controllers, this FPGA delivers the performance and logic density required to bring your innovative concepts to reality. By choosing this Xilinx device, you ensure a scalable and future-proof foundation for your electronic products.
