Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG777C: High-Performance Spartan-II FPGA for Advanced Logic Integration

Product Details

The XC2S200-6FGG777C is a premier Field-Programmable Gate Array (FPGA) from the renowned Xilinx Spartan-II family. Designed to deliver a robust balance of performance and cost-effectiveness, this device offers 200,000 system gates and high-speed processing capabilities suitable for high-volume applications. With its advanced 0.18-micron architecture, the XC2S200-6FGG777C provides a flexible, programmable alternative to ASICs, allowing designers to implement complex logic functions with unlimited reprogrammability.

This component is engineered for demanding digital environments, featuring a -6 speed grade that ensures superior timing performance compared to standard versions. Ideally suited for telecommunications, consumer electronics, and industrial control systems, the XC2S200-6FGG777C integrates rich on-chip memory resources and versatile I/O standards to streamline system design.

Key Features and Benefits

Advanced Logic Architecture

At the heart of the XC2S200-6FGG777C lies a highly efficient Configurable Logic Block (CLB) array. This architecture supports up to 5,292 logic cells, enabling the execution of intricate parallel processing tasks. The device utilizes a flexible routing hierarchy that minimizes signal delay, ensuring that high-speed designs meet their timing closure requirements effortlessly.

Integrated Memory Resources

Data-intensive applications benefit significantly from the XC2S200-6FGG777C’s embedded memory capabilities. It features 56 Kbits of dedicated Block RAM, organized into configurable blocks that can serve as data buffers, FIFOs, or dual-port memory. Additionally, the device supports up to 75,264 bits of distributed RAM, allowing for highly efficient scratchpad memory implementation directly within the logic fabric.

Flexible I/O and Connectivity

The FGG777 package offers an extensive number of user input/output pins, supporting up to 16 high-performance interface standards. Whether your design requires LVTTL, PCI, or GTL+, the XC2S200-6FGG777C provides the necessary compliance and drive strength. This versatility simplifies board-level integration and reduces the need for external voltage translators.

System-Level Management

To ensure reliable operation, the FPGA includes four dedicated Delay-Locked Loops (DLLs) for precise clock management. These DLLs eliminate clock skew and provide advanced frequency synthesis capabilities, vital for synchronized high-speed systems.

Technical Specifications

The following tables detail the operational parameters and logic resources of the XC2S200-6FGG777C.

Logic & Performance Characteristics

Specification Value
System Gates 200,000
Logic Cells 5,292
CLB Array (Row x Col) 28 x 42
Total CLBs 1,176
Speed Grade -6 (High Performance)
Process Technology 0.18 µm CMOS

Memory Configuration

Memory Type Capacity
Dedicated Block RAM 56,384 bits
Distributed RAM (Max) 75,264 bits
Block RAM Blocks 14
Bits per Block 4,096

Operating Conditions

Parameter Specification
Core Supply Voltage (Vccint) 2.5 V
I/O Voltage Compatibility 3.3 V, 2.5 V, 1.8 V
Operating Temperature 0°C to +85°C (Commercial)
Junction Temperature (Tj Max) +85°C
Package Type FGG777 (Fine-Pitch BGA)

Applications

The XC2S200-6FGG777C is optimized for a wide array of embedded applications, including but not limited to:

  • Network Switching: Efficient packet processing and routing logic.

  • Digital Signal Processing (DSP): Parallel filtering and arithmetic operations.

  • Industrial Automation: Real-time motor control and sensor interfacing.

  • Consumer Electronics: Display controllers and video processing engines.

For engineers looking to source high-quality programmable logic solutions, this device represents a stable and proven platform. To learn more about available stock and technical support for this series, please visit our Xilinx FPGA LINK.

Conclusion

The XC2S200-6FGG777C stands out as a versatile and powerful FPGA solution, delivering the density and speed required for modern digital designs. Its combination of abundant logic cells, flexible memory, and robust clock management makes it a superior choice for developers seeking to optimize performance while maintaining design flexibility. By leveraging the Spartan-II architecture, your projects can achieve faster time-to-market and lower overall system costs.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.