Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S100E-7FGG456C

Product Details

 

Overview of XC2S100E-7FGG456C FPGA

The XC2S100E-7FGG456C is a powerful Field-Programmable Gate Array from Xilinx’s Spartan-IIE family, designed to deliver exceptional performance for cost-sensitive applications. This FPGA combines 100,000 system gates with advanced features in a compact 456-ball Fine-Pitch BGA package, making it an ideal solution for telecommunications, industrial control, and embedded system designs.

As part of the renowned Xilinx FPGA product line, the XC2S100E-7FGG456C represents second-generation ASIC replacement technology that eliminates the high costs and lengthy development cycles associated with traditional ASICs.

Key Specifications of XC2S100E-7FGG456C

Core Architecture Parameters

Specification Value
Device Family Spartan-IIE
Part Number XC2S100E-7FGG456C
Logic Cells 2,700
System Gates 37,000 – 100,000
CLB Array 20 x 30 (600 total CLBs)
Speed Grade -7 (Higher Performance)
Package Type FGG456 (456-ball Fine-Pitch BGA)
Temperature Range Commercial (0°C to +85°C)

Memory Resources

Memory Type Capacity
Distributed RAM 38,400 bits
Block RAM 40K bits (10 blocks × 4096 bits)
Total Available Memory 78,400 bits

I/O and Interface Capabilities

Feature Specification
Maximum User I/O 202 pins
Differential I/O Pairs 86 pairs
Supported I/O Standards 19 standards (LVTTL, LVCMOS, LVDS, PCI, etc.)
PCI Compliance 3.3V PCI up to 64 bits @ 66 MHz

Advanced Features and Benefits

High-Performance Clock Management

The XC2S100E-7FGG456C integrates four Delay-Locked Loops (DLLs) that provide:

  • Clock distribution delay elimination for precise timing control
  • Clock multiplication and division capabilities (1.5x, 2x, 2.5x, 3x, 4x, 5x, 8x, 16x)
  • Phase shifting with quadrature outputs (0°, 90°, 180°, 270°)
  • System clock rates beyond 200 MHz for demanding applications

Flexible Memory Architecture

This FPGA offers hierarchical SelectRAM memory options:

  • 16 bits per LUT distributed RAM for shallow, fast-access memory
  • Configurable 4K-bit true dual-port block RAM for larger data storage
  • Synchronous dual-ported operation with independent control signals
  • Multiple aspect ratios (1×4096 to 16×256) for optimal data organization

Industry-Leading I/O Standards Support

The XC2S100E-7FGG456C supports 19 different I/O standards, including:

  • Single-ended standards: LVTTL, LVCMOS (2.5V, 1.8V), PCI, GTL, GTL+
  • Differential standards: LVDS, Bus LVDS, LVPECL
  • Memory interface standards: HSTL (Class I, III, IV), SSTL (Class I, II)
  • Advanced standards: AGP, CTT

Technical Specifications Deep Dive

Power Requirements

Power Rail Voltage Purpose
VCCINT 1.8V Core logic power
VCCO 1.5V / 2.5V / 3.3V I/O power (bank-dependent)

Environmental Specifications

Parameter Commercial Grade (-7C)
Operating Temperature (TJ) 0°C to +85°C
Storage Temperature -65°C to +150°C
ESD Protection Human Body Model compliant

Configuration Details

Configuration Parameter Specification
Configuration File Size 863,840 bits
Configuration Modes Master Serial, Slave Serial, Slave Parallel, JTAG
Reconfiguration Unlimited cycles
Hot Swap Support Yes (CompactPCI friendly)

Package Information: FGG456

FG456/FGG456 Package Characteristics

The Fine-Pitch Ball Grid Array (FGG456) package offers:

  • Total Balls: 456
  • Package Type: Pb-free compatible (RoHS compliant)
  • Footprint Compatibility: Family footprint compatibility for easy migration
  • Thermal Performance: Enhanced heat dissipation for reliable operation

Pin Configuration Benefits

  • 202 user I/O pins available in FGG456 package
  • Optimized pin-out for signal integrity
  • VersaRing routing for pin-swapping flexibility
  • Dedicated configuration and power pins

Application Areas for XC2S100E-7FGG456C

Industrial Control Systems

  • Motor control and drive systems
  • Process automation and monitoring
  • Sensor interface and data acquisition
  • Industrial communication protocols (Modbus, PROFIBUS, EtherCAT)

Telecommunications Equipment

  • Protocol conversion and bridging
  • Digital signal processing applications
  • Network interface cards
  • Wireless base station components

Consumer Electronics

  • Video processing and display controllers
  • Audio codec implementation
  • Interface bridging (USB, HDMI, DisplayPort)
  • Smart home automation systems

Embedded Computing

  • Soft processor implementations
  • Co-processor acceleration
  • Custom peripheral development
  • System-on-Chip (SoC) prototyping

Design Resources and Development Support

Xilinx ISE Development Tools

The XC2S100E-7FGG456C is fully supported by Xilinx ISE development software, providing:

  • Automatic place-and-route for optimized implementation
  • Timing-driven optimization for meeting critical path requirements
  • IP core library with pre-verified functions
  • Simulation and verification tools integration

Design Implementation Flow

  1. Design Entry: HDL (VHDL/Verilog), schematic, or IP core integration
  2. Synthesis: Automatic logic optimization and mapping
  3. Implementation: Place-and-route with timing closure
  4. Verification: Static timing analysis and functional simulation
  5. Configuration: Bitstream generation and device programming

Competitive Advantages

vs. Traditional ASICs

  • No NRE costs or minimum order quantities
  • Rapid prototyping with same-day design iterations
  • In-field upgrades without hardware replacement
  • Risk-free development with instant design validation

vs. Other FPGAs

  • Cost-optimized for high-volume production
  • Proven architecture based on Virtex-E technology
  • Extensive IP library reducing development time
  • Long product lifecycle with migration path options

Quality and Reliability

Manufacturing Standards

  • 0.15 micron CMOS technology for optimal performance/power balance
  • Full industrial temperature testing for each device
  • ESD protection on all pins
  • JEDEC-compliant packaging standards

Boundary Scan Support

  • IEEE 1149.1 compliant JTAG interface
  • Complete boundary scan coverage for board-level testing
  • In-system debugging capabilities
  • Production test support with BSDL files available

Ordering Information and Part Number Breakdown

XC2S100E-7FGG456C Decoded

  • XC2S100E: Device type (Spartan-IIE, 100,000 gates)
  • 7: Speed grade (higher performance)
  • FGG: Package type (Fine-pitch BGA, Pb-free)
  • 456: Number of balls in package
  • C: Commercial temperature range (0°C to +85°C)

Available Variants

The XC2S100E is available in multiple package options:

Package Pins/Balls User I/O Differential Pairs
TQ(G)144 144 102 N/A
PQ(G)208 208 146 N/A
FT(G)256 256 182 N/A
FG(G)456 456 202 86

Configuration and Programming

Supported Configuration Methods

  1. Master Serial Mode: FPGA controls configuration from external PROM
  2. Slave Serial Mode: External controller provides configuration data
  3. Slave Parallel (SelectMAP) Mode: 8-bit parallel configuration for fast programming
  4. Boundary Scan (JTAG) Mode: IEEE 1149.1 standard interface

Configuration Memory Clearing

The device features automatic configuration memory clearing with:

  • CRC error checking for data integrity
  • Programmable start-up sequence
  • DONE pin status indication
  • Power-on automatic configuration

Performance Specifications Summary

Operating Conditions

Parameter Min Typ Max Unit
Core Voltage (VCCINT) 1.71 1.8 1.89 V
I/O Voltage (VCCO) Varies by standard 3.3 V
System Clock Frequency >200 MHz
Junction Temperature (Commercial) 0 85 °C

Switching Characteristics

  • Fast carry logic for high-speed arithmetic operations
  • Dedicated cascade chains for wide-input functions
  • Low-skew clock distribution with <500ps typical skew
  • DLL precision of ±100ps jitter

Migration and Scalability

Family Migration Path

The Spartan-IIE family provides seamless migration options:

  • Density scaling: XC2S50E → XC2S100E → XC2S150E → XC2S200E → XC2S300E → XC2S400E → XC2S600E
  • Footprint compatibility in common packages
  • Pin-compatible options for easy PCB reuse
  • Software compatibility across entire family

Why Choose XC2S100E-7FGG456C?

Key Decision Factors

  1. Proven Technology: Second-generation ASIC replacement with established reliability
  2. Cost-Effective: Optimal price/performance ratio for mid-density applications
  3. Rich Feature Set: Block RAM, DLLs, and 19 I/O standards in single device
  4. Design Flexibility: Unlimited reprogrammability for iterative development
  5. Industry Support: Comprehensive development tools and IP ecosystem

Ideal Use Cases

The XC2S100E-7FGG456C excels in applications requiring:

  • 50,000 to 100,000 system gates
  • Multiple I/O standards on single board
  • PCI bus interface capability
  • Clock domain crossing and management
  • Mixed synchronous/asynchronous designs
  • Moderate block RAM requirements (40Kb)

Conclusion

The XC2S100E-7FGG456C represents an excellent choice for engineers seeking a reliable, cost-effective FPGA solution with proven performance. Its combination of 100,000 system gates, 202 user I/O pins, advanced clock management, and support for 19 I/O standards makes it suitable for diverse applications across industrial, telecommunications, and consumer electronics markets.

With comprehensive development tool support, unlimited reprogrammability, and the backing of Xilinx’s extensive IP library and technical resources, the XC2S100E-7FGG456C enables rapid product development while maintaining the flexibility to adapt to changing requirements throughout the product lifecycle.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.