The XC2S200-6FGG774C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx, designed to deliver a robust solution for cost-sensitive, high-volume applications. As part of the renowned Spartan-II family, this device leverages advanced 0.18-micron CMOS technology to provide substantial logic density and flexible memory resources. It is an ideal choice for engineers and designers seeking a versatile platform for telecommunications, consumer electronics, and industrial control systems.
Overview of the XC2S200-6FGG774C
At the heart of the XC2S200-6FGG774C lies a proven architecture that combines the programmability of an FPGA with the cost benefits typically associated with ASICs. With 200,000 system gates, this device offers the logic capacity required for complex digital processing tasks. The “6” speed grade ensures fast performance, while the “FGG774” package provides a high-density ball grid array layout for advanced board designs. Additionally, the “C” suffix indicates its operation within the commercial temperature range, making it reliable for standard operating environments.
For those looking to explore a wider range of programmable logic solutions, you can view our comprehensive catalog of Xilinx FPGA devices.
Key Features and Benefits
The XC2S200-6FGG774C is packed with features that streamline design implementation and enhance system performance.
High-Density Logic Resources
The device features 5,292 Logic Cells organized into Configurable Logic Blocks (CLBs). This structure allows for the efficient implementation of wide-input functions and complex logic circuits. The abundance of registers and latches ensures that your design can handle high-speed data paths with ease.
Advanced Memory Architecture
One of the standout features of this FPGA is its dual-level memory hierarchy:
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Block RAM: The device includes 56 Kbits of dedicated Block RAM, which can be configured for data buffering, FIFO implementation, and other storage-intensive tasks.
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Distributed RAM: In addition to Block RAM, the XC2S200-6FGG774C offers up to 75,264 bits of distributed RAM, providing flexible local storage directly within the logic slices.
Flexible I/O and Power Management
The XC2S200-6FGG774C supports a wide variety of I/O standards, including LVTTL, LVCMOS, and PCI, allowing seamless integration with other system components. The 2.5V core voltage ensures low power consumption while maintaining high switching speeds.
Technical Specifications
The following table outlines the critical technical specifications of the XC2S200-6FGG774C.
| Specification |
Detail |
| Part Number |
XC2S200-6FGG774C |
| Manufacturer |
Xilinx (now AMD) |
| Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| Total CLBs |
1,176 |
| Block RAM |
56 Kbits |
| Distributed RAM |
75,264 bits |
| Speed Grade |
-6 (High Performance) |
| Package |
FGG774 (Fine-Pitch BGA) |
| Temperature Range |
Commercial (0°C to +85°C) |
| Core Voltage |
2.5 V |
Applications for Spartan-II FPGAs
The versatility of the XC2S200-6FGG774C makes it suitable for a diverse array of applications. Its balanced mix of logic and memory is particularly beneficial in sectors where reliability and cost-efficiency are paramount.
Telecommunications and Networking
In the telecom sector, this FPGA is often used for protocol bridging, framing, and interface glue logic. The high I/O count of the FGG774 package supports wide data buses, facilitating high-throughput communication.
Industrial Automation
Industrial environments require robust components. The XC2S200-6FGG774C handles sensor interfacing, motor control logic, and real-time monitoring duties effectively, ensuring smooth operation in automated manufacturing lines.
Packaging and Environmental Compliance
The FGG774 package is a Fine-Pitch Ball Grid Array designed to maximize board space efficiency while providing excellent thermal and electrical performance. The “G” designation confirms that this component is Pb-free (Lead-free) and fully RoHS compliant, meeting modern environmental standards for electronics manufacturing.
Ordering Information
| Feature |
Value |
| Package Type |
Fine-Pitch BGA |
| Pin Count |
774 |
| RoHS Status |
Compliant (Pb-Free) |
| Process Technology |
0.18 µm CMOS |
Why Choose the XC2S200-6FGG774C?
Choosing the XC2S200-6FGG774C means investing in a legacy of reliability and performance. Whether you are maintaining an existing product line or prototyping a new design that requires a cost-effective logic solution, this Xilinx FPGA delivers the necessary resources. Its combination of programmable logic, embedded memory, and flexible I/O makes it a superior alternative to fixed-function ASICs, offering the adaptability needed in today’s fast-changing market.
