Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG773C: High-Performance Spartan-II FPGA Solution

Product Details

The XC2S200-6FGG773C is a powerful and versatile Field Programmable Gate Array (FPGA) from the renowned Xilinx Spartan-II family. Designed to deliver a balance of high performance and cost-effectiveness, this device is an optimal choice for high-volume applications where density and programmability are paramount. With its advanced architecture and robust feature set, the XC2S200-6FGG773C enables engineers to implement complex digital logic designs efficiently.

Key Features of the XC2S200-6FGG773C

The XC2S200-6FGG773C stands out in the market due to its 0.18-micron CMOS process technology and architectural efficiency. It offers a significant logic capacity of 200,000 system gates, making it suitable for a wide array of logic processing tasks.

Advanced Architectural Logic

At the heart of the device lies a flexible Configurable Logic Block (CLB) structure. The array consists of 1,176 CLBs arranged in a 28 x 42 matrix, providing a total of 5,292 logic cells. This density allows for the integration of substantial system-level functions directly onto the chip, reducing the need for external glue logic.

Memory and I/O Capabilities

Data handling is streamlined through a combination of distributed and block memory. The XC2S200-6FGG773C features 56 Kbits of dedicated Block RAM and up to 75,264 bits of distributed RAM. Furthermore, the device supports versatile connectivity with a highly configurable I/O architecture. The FGG773 package ensures a high pin count, facilitating extensive interface options for complex board designs.

Technical Specifications

For a detailed understanding of the device’s capabilities, the following table outlines the core technical specifications of the XC2S200-6FGG773C.

Feature Specification
Part Number XC2S200-6FGG773C
Family Spartan-II
System Gates 200,000
Logic Cells 5,292
Total CLBs 1,176
Block RAM 56 Kbits
Distributed RAM 75,264 bits
Max Operating Frequency Up to 263 MHz
Core Voltage 2.5 V
Process Technology 0.18 µm
Speed Grade -6 (High Performance)
Package Type FGG773 (Fine-Pitch BGA)
Temperature Range Commercial (0°C to 85°C)

System-Level Advantages

The Spartan-II family, including the XC2S200-6FGG773C, is engineered to replace mask-programmed ASICs. This provides developers with the flexibility to upgrade designs in the field without hardware replacement, a critical advantage in rapidly evolving markets.

Superior Power and Performance

Operating at a standard 2.5V supply, the device maintains low power consumption while delivering high-speed performance. The -6 speed grade ensures that critical timing paths meet the rigorous demands of modern digital systems, supporting system clock rates exceeding 200 MHz.

Seamless Integration

Integration is simplified through the support of multiple I/O standards and four dedicated Delay-Locked Loops (DLLs) for effective clock management. This ensures that the XC2S200-6FGG773C can easily interface with various memory types and bus standards, enhancing overall system reliability.

For those looking to explore more about these programmable solutions, you can view our complete catalog at this Xilinx FPGA link.

Typical Applications

Due to its robust logic resources and memory capacity, the XC2S200-6FGG773C is deployed in diverse sectors:

  • Telecommunications: Signal processing and data routing.

  • Industrial Control: Motor control systems and automation logic.

  • Consumer Electronics: Digital video processing and interface bridging.

  • Automotive: Infotainment systems and driver assistance modules.

Conclusion

The XC2S200-6FGG773C remains a reliable component for designers seeking a proven FPGA architecture. Its combination of 200K system gates, ample memory, and high-speed I/O capabilities makes it a cornerstone for successful and scalable hardware designs.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.