The XC2S200-6FGG771C is a high-performance programmable logic solution from the renowned Spartan-II family. Designed to deliver a cost-effective alternative to ASICs, this Field Programmable Gate Array (FPGA) offers a robust density of 200,000 system gates. It combines advanced process technology with a versatile architecture, making it an ideal choice for high-volume applications requiring flexibility and speed. Whether you are designing for telecommunications, industrial control, or consumer electronics, this Xilinx FPGA provides the logic resources and performance needed to meet aggressive time-to-market goals.
Product Overview
The XC2S200-6FGG771C leverages a proven 0.18-micron CMOS process and a 2.5V core voltage to achieve high-speed operation. With a -6 speed grade, this device offers superior timing characteristics compared to standard versions, supporting system clock rates up to 200 MHz. The “FGG771” package designation indicates a high-density Fine-Pitch Ball Grid Array, designed to support complex I/O requirements while maintaining a compact footprint on your PCB.
This device is fully reprogrammable, allowing engineers to upgrade designs in the field—a critical advantage over fixed-logic solutions. Its architecture allows for seamless integration of complex digital functions, from logic consolidation to high-speed bus interfacing.
Key Technical Specifications
Below is a detailed breakdown of the technical attributes for the XC2S200-6FGG771C.
| Feature |
Specification |
| Part Number |
XC2S200-6FGG771C |
| Manufacturer |
Xilinx (now AMD) |
| Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| Logic Blocks (CLBs) |
1,176 |
| Speed Grade |
-6 (High Performance) |
| Total Block RAM |
56 Kbits |
| Distributed RAM |
75,264 bits |
| Core Voltage |
2.5 V |
| Operating Temperature |
0°C ~ 85°C (Commercial) |
| Package Type |
FGG771 (Fine-Pitch BGA) |
Advanced Architectural Features
The XC2S200-6FGG771C is not just about logic density; it includes sophisticated system-level features that enhance performance and simplify design.
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SelectRAM+ Memory Hierarchy: The device features a dual-level memory architecture. It includes fast, distributed RAM implemented in the Configurable Logic Blocks (CLBs) and dedicated Block RAM (56 Kbits) for larger data storage requirements.
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Clock Management: Equipped with four digital Delay-Locked Loops (DLLs), the FPGA provides precise clock management capabilities, including zero-propagation delay, clock division, and phase shifting.
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Versatile I/O Support: The device supports up to 16 high-performance interface standards, including LVTTL, LVCMOS, PCI, and GTL+, ensuring broad compatibility with other system components.
Applications of the XC2S200-6FGG771C
Thanks to its balance of cost, density, and performance, this Spartan-II device is widely utilized across various sectors:
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Communications: Used in protocol bridging, network interface cards, and switch fabric controllers.
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Industrial Automation: Ideal for motor control, sensor interfacing, and programmable logic controllers (PLCs).
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Consumer Electronics: processing video and image data, as well as handling custom glue logic in set-top boxes.
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Automotive Systems: In-vehicle infotainment and driver assistance logic (where commercial temp range applies).
Why Choose the Spartan-II XC2S200 Series?
The XC2S200-6FGG771C stands out because it minimizes the risks associated with mask-programmed ASICs. Designers avoid the high NRE (Non-Recurring Engineering) costs and long lead times of custom silicon. Furthermore, the extensive support from Xilinx development tools (like ISE) ensures that synthesis, mapping, and routing are efficient, helping you achieve timing closure faster.
Ordering and Availability
When sourcing the XC2S200-6FGG771C, ensure you verify the speed grade (-6) and package code (FGG771) to match your board layout requirements. This component remains a staple for legacy support and active designs requiring reliable 2.5V FPGA logic
