Overview of XC2S200E-4FG456C Field-Programmable Gate Array
The XC2S200E-4FG456C is a powerful field-programmable gate array (FPGA) from AMD/Xilinx’s renowned Spartan-IIE family, engineered to deliver exceptional performance for high-volume, cost-sensitive electronic applications. This Xilinx FPGA combines advanced 0.15-micron process technology with a streamlined architecture based on the proven Virtex-E platform, offering designers an ideal balance between functionality, performance, and affordability.
Key Technical Specifications
| Specification |
Value |
| Part Number |
XC2S200E-4FG456C |
| Manufacturer |
AMD/Xilinx |
| FPGA Family |
Spartan-IIE (Enhanced) |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| Speed Grade |
-4 (Standard Performance) |
| Package Type |
FG456 (Fine-pitch BGA) |
| Pin Count |
456 pins |
| Temperature Range |
Commercial (0°C to +85°C) |
| Supply Voltage |
1.8V Core |
| Process Technology |
0.15 micron |
Core Architecture and Features
Logic Resources and Configuration
The XC2S200E-4FG456C delivers robust logic capacity through its 5,292 configurable logic cells, providing designers with ample resources for implementing complex digital designs. This FPGA architecture supports unlimited in-system reprogrammability, allowing for design iterations and field upgrades without hardware replacement—a significant advantage over traditional ASICs.
Memory Architecture
| Memory Type |
Capacity |
Configuration |
| Distributed RAM |
Up to 84 Kbits |
16 bits per Look-Up Table (LUT) |
| Block RAM |
56 Kbits |
True dual-port 4K-bit blocks |
| Total RAM |
140 Kbits |
Flexible hierarchical memory |
The SelectRAM hierarchical memory architecture enables efficient data storage and retrieval, supporting both distributed RAM within logic cells and dedicated block RAM for larger memory requirements.
Input/Output Capabilities
The FG456 package configuration provides 289 maximum user I/O pins, offering extensive connectivity options for complex system integration. The device supports 19 selectable I/O standards, ensuring compatibility with a wide range of interface requirements including:
- LVTTL/LVCMOS
- SSTL (Stub Series Terminated Logic)
- HSTL (High-Speed Transceiver Logic)
- GTL/GTL+ (Gunning Transceiver Logic)
- PCI compliance at 33 MHz and 66 MHz
Performance Characteristics
Clock Management System
The XC2S200E-4FG456C incorporates four Delay-Locked Loops (DLLs) strategically positioned at each corner of the die, providing:
- Precise clock distribution with minimal skew
- Clock frequency synthesis and division
- Phase shifting capabilities
- Support for system-level clock management
Speed and Timing
| Performance Metric |
Specification |
| Maximum System Frequency |
200+ MHz |
| Speed Grade |
-4 (Standard) |
| Propagation Delay |
Optimized for standard applications |
| Clock-to-Out Time |
Fast predictable interconnect |
Application Areas
Industrial Automation and Control
The XC2S200E-4FG456C excels in industrial environments where reliable, programmable logic solutions are essential. Applications include:
- Motor control systems
- Factory automation
- Process monitoring and control
- Human-machine interfaces (HMI)
- Sensor data acquisition
Communications Infrastructure
This FPGA provides sufficient logic resources for implementing:
- Protocol conversion and bridging
- Data packet processing
- Network interface controllers
- Digital signal processing (DSP) functions
- Custom communication protocols
Consumer Electronics
The cost-effective nature of the Spartan-IIE family makes it ideal for:
- Digital video processing
- Audio/video equipment
- Gaming peripherals
- Smart home devices
- Embedded systems
Automotive and Medical Devices
For applications requiring reliable, field-upgradeable solutions:
- Automotive control units
- Medical diagnostic equipment
- Patient monitoring systems
- Laboratory instrumentation
Package Information and Physical Characteristics
FG456 Fine-Pitch Ball Grid Array
| Package Feature |
Detail |
| Package Type |
FBGA (Fine-pitch Ball Grid Array) |
| Total Pins |
456 |
| Pitch |
Fine-pitch for high-density mounting |
| Mounting |
Surface mount technology (SMT) |
| Thermal Performance |
Enhanced heat dissipation |
The FG456 package offers excellent thermal characteristics and signal integrity, making it suitable for high-performance applications requiring dense I/O connectivity.
Development and Design Tools
Supported Design Environments
Designers working with the XC2S200E-4FG456C have access to comprehensive development tools:
- ISE Design Suite: Traditional design environment for Spartan-IIE devices
- VHDL/Verilog Support: Industry-standard HDL languages
- IP Core Library: Pre-verified intellectual property blocks
- Schematic Entry: Graphical design capture
- Simulation Tools: Functional and timing verification
Configuration Options
The device supports multiple configuration modes for flexible system integration:
- Master Serial Mode (from external PROM)
- Slave Serial Mode
- Slave Parallel Mode
- Boundary Scan (JTAG) Mode
- Platform Flash in-system programmable configuration
Comparison with Related Devices
Spartan-IIE Family Positioning
| Device |
System Gates |
Logic Cells |
Max User I/O (FG456) |
| XC2S50E |
50,000 |
1,536 |
182 |
| XC2S100E |
100,000 |
2,700 |
202 |
| XC2S150E |
150,000 |
4,032 |
265 |
| XC2S200E |
200,000 |
5,292 |
289 |
| XC2S300E |
300,000 |
7,168 |
329 |
| XC2S400E |
400,000 |
10,800 |
329 |
The XC2S200E-4FG456C occupies a strategic position in the Spartan-IIE lineup, offering substantial logic capacity while maintaining cost-effectiveness for mid-range applications.
Advantages Over ASICs
Cost-Effective Development
The programmable nature of the XC2S200E-4FG456C eliminates:
- High non-recurring engineering (NRE) costs
- Long development cycles typical of ASIC design
- Risk of design errors requiring costly mask revisions
- Minimum order quantities and inventory commitments
Design Flexibility
- Unlimited reprogramming cycles
- Field upgrades without hardware changes
- Rapid prototyping and iteration
- Version control through firmware updates
Power Management and Efficiency
Power Consumption Profile
The 1.8V core voltage design provides:
- Reduced power consumption compared to earlier generations
- Compatibility with modern low-power systems
- Efficient heat management
- Extended battery life in portable applications
Quality and Reliability Standards
Manufacturing and Testing
AMD/Xilinx FPGAs undergo rigorous quality control:
- Automotive-grade testing available
- Extended temperature range options
- Comprehensive screening procedures
- Long-term reliability validation
Environmental Compliance
- RoHS compliance options available
- Lead-free package variants
- Halogen-free options for specific requirements
- REACH regulation compliance
Design Considerations and Best Practices
Thermal Management
When implementing designs with the XC2S200E-4FG456C:
- Ensure adequate PCB thermal dissipation
- Consider heat sink requirements for high-utilization designs
- Monitor junction temperature under operational conditions
- Plan for worst-case thermal scenarios
Power Supply Design
Critical power considerations include:
- Stable 1.8V core supply with adequate current capacity
- Proper decoupling capacitor placement
- I/O bank voltage requirements (based on selected standards)
- Power sequencing for reliable startup
Signal Integrity
For optimal performance:
- Follow recommended PCB layout guidelines
- Maintain controlled impedance for high-speed signals
- Implement proper ground plane design
- Consider signal termination for critical paths
Ordering Information and Availability
Part Number Nomenclature
XC2S200E-4FG456C breaks down as:
- XC2S: Spartan-II family identifier
- 200E: 200,000 gates, Enhanced (IIE) version
- -4: Speed grade (standard performance)
- FG456: Fine-pitch BGA, 456 pins
- C: Commercial temperature range
Package Variants
Alternative packages for XC2S200E include:
- PQ208: Plastic Quad Flat Pack, 208 pins (146 user I/O)
- FT256: Fine-pitch BGA, 256 pins (182 user I/O)
- FG456: Fine-pitch BGA, 456 pins (289 user I/O) – Featured Package
Technical Support and Resources
Documentation
Comprehensive technical resources available:
- Complete datasheets with electrical specifications
- Application notes for common design scenarios
- PCB layout guidelines
- Thermal management guides
- Configuration and programming documentation
Community and Support
Access to extensive support network:
- AMD/Xilinx technical support team
- Online community forums
- Third-party development boards
- University program resources
- Design example repositories
Competitive Advantages
Market Position
The XC2S200E-4FG456C stands out through:
- Proven Virtex-E-based architecture
- Industry-leading price-performance ratio
- Extensive I/O flexibility with 19 standards
- Robust development tool ecosystem
- Long product lifecycle support
Value Proposition
Designers choose this FPGA for:
- Rapid time-to-market capabilities
- Reduced overall system cost
- Scalability within Spartan-IIE family
- Reliable performance in volume production
- Future-proof design with field upgrade capability
Migration and Upgrade Path
Pin-Compatible Options
The Spartan-IIE family offers straightforward migration paths:
- Upward compatibility within the family
- Similar pin assignments across package types
- Consistent development tool chain
- Reusable IP and design modules
Future Technology Considerations
While the Spartan-IIE represents mature technology, it continues to serve applications requiring:
- Stable, proven solutions
- Long-term availability
- Lower-cost alternatives to current-generation devices
- Legacy system support and replacement
Conclusion
The XC2S200E-4FG456C FPGA delivers exceptional value for designers requiring a balance of logic capacity, I/O flexibility, and cost-effectiveness. With 200,000 system gates, 289 user I/O pins, and comprehensive memory resources, this device addresses a wide range of digital design challenges across industrial, communications, consumer, and embedded applications.
Its proven architecture, extensive development tool support, and field-programmable flexibility make it an ideal choice for both prototype development and volume production. Whether replacing existing ASICs, implementing new designs, or upgrading legacy systems, the XC2S200E-4FG456C provides a robust, reliable, and economical solution backed by AMD/Xilinx’s industry-leading FPGA technology.
