The XC2S200E-6FTG256C is a versatile field-programmable gate array from Xilinx’s renowned Spartan-IIE family, delivering exceptional performance for complex programmable logic applications. This FPGA combines 200,000 system gates with 5,292 logic cells in a compact 256-pin FTBGA package, making it an ideal solution for embedded systems, digital signal processing, and communication applications.
Overview of XC2S200E-6FTG256C FPGA
The XC2S200E-6FTG256C represents second-generation ASIC replacement technology, offering designers unlimited in-system reprogrammability at a competitive price point. Built on advanced 0.15-micron technology, this Xilinx FPGA operates at 1.8V and achieves maximum clock frequencies of 357 MHz, ensuring fast and reliable performance across demanding digital design projects.
Key Technical Specifications
| Specification |
Value |
| Part Number |
XC2S200E-6FTG256C |
| Manufacturer |
Xilinx (AMD) |
| FPGA Family |
Spartan-IIE |
| Logic Cells |
5,292 |
| System Gates |
71,000 – 200,000 |
| Configurable Logic Blocks (CLBs) |
1,176 |
| Maximum Clock Frequency |
357 MHz |
| Operating Voltage |
1.8V |
| Package Type |
256-Pin FTBGA |
| Package Dimensions |
17mm x 17mm |
| Operating Temperature Range |
0°C to +85°C |
| Speed Grade |
-6 |
| Technology Node |
0.15μm |
Core Features and Capabilities
Advanced Logic Resources
The XC2S200E-6FTG256C delivers impressive logic density with 1,176 configurable logic blocks arranged in a 28 x 42 array. Each CLB contains programmable logic elements that can be configured to implement complex digital functions, providing designers with exceptional flexibility.
Memory Architecture
| Memory Type |
Capacity |
| Block RAM |
56 Kbits |
| Distributed RAM |
75,264 bits |
| Total Memory Resources |
Up to 131K bits |
The hierarchical SelectRAM memory structure includes:
- 16 bits per LUT distributed RAM for fast local storage
- Configurable 4K-bit true dual-port block RAM
- Flexible memory configuration options for diverse application needs
Input/Output Capabilities
| I/O Feature |
Specification |
| User I/O Pins |
289 (including 4 global clock inputs) |
| Maximum User I/O |
182 pins |
| Supported I/O Standards |
19 selectable standards |
| Voltage Compatibility |
Multiple voltage levels supported |
Performance Characteristics
Timing and Speed
The speed grade -6 designation indicates robust performance characteristics:
- Maximum System Clock: 357 MHz
- Combinatorial CLB Delay: 470 picoseconds (maximum)
- Fast, Predictable Interconnect: Ensures consistent timing across design iterations
Power Efficiency
Operating at 1.8V, the XC2S200E-6FTG256C offers excellent power efficiency compared to earlier FPGA generations. The low-voltage operation reduces overall system power consumption while maintaining high-speed performance.
Package Details: 256-Pin FTBGA
| Package Attribute |
Details |
| Package Code |
FTBGA256 |
| JESD-30 Code |
S-PBGA-B256 |
| Ball Grid Configuration |
16 x 16 array |
| Package Material |
Plastic/Epoxy |
| Moisture Sensitivity Level |
MSL 3 |
| RoHS Compliance |
Compliant versions available |
| Pin Pitch |
Fine-pitch ball grid array |
The fine-pitch ball grid array package provides excellent thermal performance and signal integrity, making it suitable for high-density PCB layouts.
Primary Applications
Digital Signal Processing (DSP)
The XC2S200E-6FTG256C excels in implementing hardware-accelerated DSP algorithms, offering:
- High-speed processing capabilities
- Parallel processing architecture
- Efficient data path implementation
- Real-time signal processing performance
Embedded System Design
Ideal for embedded applications requiring:
- Reconfigurable logic functions
- Custom peripheral interfaces
- Protocol implementation
- System-on-chip integration
Communication Systems
Perfect for telecommunications applications including:
- Data encoding and decoding
- Protocol conversion
- Signal conditioning
- High-speed data processing
Industrial Control
Suitable for automation and control systems:
- Motor control implementations
- Sensor interface circuits
- Real-time control algorithms
- Custom industrial protocols
Design Development Features
Xilinx ISE Design Tools
The XC2S200E-6FTG256C is fully supported by Xilinx ISE Design Suite, providing:
- Comprehensive synthesis and implementation tools
- Timing analysis and optimization
- Power estimation utilities
- Hardware co-simulation capabilities
Reprogrammability Advantages
Unlike traditional ASICs, this FPGA offers:
- Unlimited In-System Reprogramming: Update designs without hardware changes
- Field Upgrades: Implement firmware improvements remotely
- Design Iteration: Rapid prototyping without manufacturing delays
- Risk Mitigation: Avoid costly ASIC respins
Configuration Options
Multiple configuration modes supported:
- Master Serial Mode
- Slave Serial Mode
- Boundary Scan (JTAG)
- SelectMAP parallel configuration
System-Level Features
Delay-Locked Loops (DLLs)
The device includes four DLLs providing:
- Clock deskewing and multiplication
- Precise timing control
- Reduced clock distribution delays
- Improved system timing margins
Clock Distribution
Robust global clock network featuring:
- Four dedicated global clock inputs
- Low-skew clock distribution
- Multiple clock domains support
- Flexible clock management
Comparison with Similar Devices
| Feature |
XC2S200E-6FTG256C |
XC2S100E |
XC2S300E |
| Logic Cells |
5,292 |
2,700 |
6,912 |
| System Gates |
200,000 |
100,000 |
300,000 |
| CLBs |
1,176 |
600 |
1,536 |
| Block RAM |
56 Kbits |
40 Kbits |
64 Kbits |
| User I/O |
182 max |
176 max |
182 max |
| Clock Speed |
357 MHz |
357 MHz |
357 MHz |
Environmental and Reliability Specifications
Operating Conditions
- Commercial Temperature Range: 0°C to +85°C
- Supply Voltage (VCCINT): 1.8V ±5%
- Auxiliary Supply (VCCAUX): 2.5V/3.3V
- Recommended Operating Conditions: Per datasheet specifications
Quality and Compliance
- RoHS Compliant: Lead-free packaging options available
- Moisture Sensitivity: Level 3 (MSL-3)
- JESD-609 Code: E1 environmental classification
- Package Body Material: Plastic/epoxy compound
Design Considerations
PCB Layout Recommendations
When designing with the XC2S200E-6FTG256C:
- Follow ball grid array layout guidelines
- Implement proper power supply decoupling
- Use controlled impedance routing for high-speed signals
- Provide adequate thermal management
- Follow Xilinx PCB design guide recommendations
Power Supply Design
Critical power supply considerations:
- Separate core (VCCINT) and I/O (VCCO) power domains
- Low-ESR decoupling capacitors near power pins
- Adequate current capacity for dynamic switching
- Power sequencing requirements per datasheet
Thermal Management
The 256-pin FTBGA package requires:
- Thermal vias in PCB layout
- Adequate airflow for convection cooling
- Thermal interface materials where applicable
- Junction temperature monitoring
Ordering and Availability
Part Number Breakdown
XC2S200E-6FTG256C decodes as:
- XC2S: Spartan-II family designator
- 200E: 200K gate density, extended features
- 6: Speed grade (commercial, fastest grade)
- FTG256: Fine-pitch BGA, 256 pins
- C: Commercial temperature range (0°C to +85°C)
Package Options
Additional package variants for XC2S200E include:
- FT256 (256-pin FTBGA) – This variant
- FG456 (456-pin FBGA)
- PQ208 (208-pin PQFP)
Why Choose XC2S200E-6FTG256C
Cost-Effective ASIC Alternative
The XC2S200E-6FTG256C eliminates:
- High NRE costs of ASIC development
- Long manufacturing lead times
- Inventory risk from design changes
- Expensive mask set creation
Proven Architecture
Based on successful Virtex-E FPGA technology:
- Streamlined, optimized feature set
- Mature, stable design platform
- Extensive documentation and support
- Large user community and resources
Future-Proof Design
Programmability advantages include:
- Adapt to changing requirements
- Implement design improvements post-deployment
- Extend product lifecycle
- Support multiple product variants from single hardware
Technical Support and Resources
Available Documentation
Designers can access:
- Complete datasheet (DS077)
- Application notes
- User guides
- Reference designs
- PCB layout guidelines
Development Tools
Compatible with:
- Xilinx ISE Design Suite
- Third-party synthesis tools
- ModelSim simulation
- ChipScope Pro analyzer
Conclusion
The XC2S200E-6FTG256C Spartan-IIE FPGA delivers an outstanding balance of logic density, performance, and cost-effectiveness. With 5,292 logic cells, 357 MHz operation, and extensive I/O capabilities in a compact 256-pin package, this device serves as an excellent solution for embedded systems, communications, and digital signal processing applications. Its unlimited reprogrammability and proven architecture make it a reliable choice for designs requiring flexibility without compromising performance.
Whether you’re developing cutting-edge telecommunications equipment, industrial control systems, or advanced embedded applications, the XC2S200E-6FTG256C provides the resources and performance needed to bring your designs to life quickly and cost-effectively.
