The XC2S200-6FGG759C is a powerful Field-Programmable Gate Array (FPGA) from AMD Xilinx’s acclaimed Spartan-II family, engineered to deliver exceptional performance, flexibility, and cost-effectiveness for demanding digital design applications. This advanced FPGA combines 200,000 system gates with a high-density 759-ball Fine-Pitch Ball Grid Array package, making it an ideal solution for complex embedded systems, telecommunications equipment, industrial automation, and signal processing applications.

Overview of XC2S200-6FGG759C FPGA

The XC2S200-6FGG759C represents the pinnacle of the Spartan-II family, offering designers a robust platform for implementing sophisticated digital logic designs. Built on advanced 0.18-micron CMOS technology, this FPGA delivers reliable performance while maintaining low power consumption. The device features 5,292 logic cells organized in a 28×42 Configurable Logic Block (CLB) array, providing extensive resources for complex digital circuits and system implementations.

Technical Specifications

Memory Architecture

Distributed RAM Resources

The XC2S200-6FGG759C incorporates extensive on-chip memory resources to support data-intensive applications:

The distributed RAM architecture enables designers to implement flexible memory structures directly within the logic fabric, while dedicated Block RAM modules provide high-speed data storage for buffering, lookup tables, and temporary data processing.

Key Features of XC2S200-6FGG759C

Advanced Logic Resources

• Configurable Logic Blocks (CLBs): 1,176 CLBs arranged in an optimized 28×42 array, each containing four logic slices with Look-Up Tables (LUTs), flip-flops, and multiplexers
• System Gates: 200,000 equivalent gates provide ample resources for complex digital designs
• High-Speed Performance: -6 speed grade ensures maximum operating frequencies up to 263 MHz
• Flexible Routing Architecture: Hierarchical routing resources enable efficient signal distribution

Enhanced I/O Capabilities

The FGG759 package provides maximum connectivity options:

• 284 User I/O Pins: Extensive I/O resources support multi-interface designs
• Programmable I/O Standards: Compatible with LVTTL, LVCMOS, SSTL, GTL, and other industry-standard I/O protocols
• Input/Output Blocks (IOBs): Programmable features including output slew rate control, pull-up/pull-down resistors, and tri-state buffers
• Differential Signaling Support: Enables high-speed differential I/O implementations

Clock Management System

• Four Delay-Locked Loops (DLLs): Positioned at each corner of the die for optimized clock distribution
• Clock Multiplication and Division: Flexible clock management for multi-clock domain designs
• Low-Skew Clock Distribution: Global clock networks ensure synchronized operation across the device

Package Information: FGG759 Fine-Pitch BGA

The 759-ball Fine-Pitch Ball Grid Array package offers several advantages for high-density designs:

The FGG759 package provides the highest I/O count available in the XC2S200 family, making it the preferred choice for applications requiring maximum connectivity and signal routing flexibility.

Applications and Use Cases

Telecommunications Infrastructure

The XC2S200-6FGG759C excels in telecommunications applications requiring high-speed data processing, protocol implementation, and signal routing. Its abundant I/O resources support multi-channel communication interfaces, while the high-performance logic fabric enables complex protocol handling and data packet processing.

Industrial Control Systems

Manufacturing automation and process control systems benefit from the FPGA’s deterministic logic execution, extensive I/O capabilities, and real-time processing capabilities. The device supports motor control, sensor interfacing, safety systems, and human-machine interface (HMI) implementations.

Digital Signal Processing

With 56 Kbits of Block RAM and distributed memory resources, the XC2S200-6FGG759C provides efficient platforms for implementing digital filters, FFT processors, image processing pipelines, and audio/video processing algorithms.

Embedded Systems Development

The combination of logic resources, memory, and I/O flexibility makes this FPGA ideal for custom embedded system designs, including soft processor implementations, peripheral controllers, and system-on-chip (SoC) prototyping.

Test and Measurement Equipment

High-speed data acquisition systems, logic analyzers, and automated test equipment leverage the FPGA’s parallel processing capabilities and high I/O bandwidth for real-time data capture and analysis.

Development and Programming

Configuration Options

The XC2S200-6FGG759C supports multiple configuration modes:

Design Tools Compatibility

• Vivado Design Suite: Modern design environment with advanced synthesis and implementation
• ISE Design Suite: Legacy tool support for existing projects
• Third-Party Tools: Compatible with Synopsys, Mentor Graphics, and other EDA tools
• IP Core Library: Access to Xilinx’s extensive library of pre-verified IP cores

Performance Advantages

Speed Grade -6 Benefits

The -6 speed grade designation indicates this device operates at the fastest speed bin in the Spartan-II family:

• Maximum Toggle Frequency: Up to 263 MHz for high-speed applications
• Reduced Setup and Hold Times: Optimized for timing-critical designs
• Enhanced Signal Integrity: Faster edge rates enable high-bandwidth interfaces
• Commercial Temperature Range: Optimized for standard operating conditions

Power Efficiency

Despite its high performance, the XC2S200-6FGG759C maintains excellent power efficiency:

• 2.5V Core Voltage: Reduced power consumption compared to 3.3V alternatives
• Programmable Power Management: Unused logic can be powered down
• Low Static Power: Advanced CMOS process minimizes leakage current
• Thermal Management: Package design facilitates efficient heat dissipation

Competitive Advantages Over ASICs

Flexibility and Reconfigurability

Unlike mask-programmed ASICs, the XC2S200-6FGG759C offers:

• In-Field Updates: Design modifications without hardware replacement
• Reduced Development Risk: Test and validate before final production
• Multi-Version Support: Single hardware platform supporting multiple firmware versions
• Rapid Prototyping: Accelerated time-to-market for new products

Cost-Effective Solution

• No NRE Costs: Eliminates expensive mask sets and fabrication setup fees
• Lower MOQ Requirements: Practical for medium-volume production runs
• Design Reuse: IP cores and modules can be reused across product families
• Inventory Flexibility: Single FPGA supports multiple product variants

Quality and Reliability

Manufacturing Standards

• RoHS Compliant: Pb-free (lead-free) package option with “G” designation
• Automotive Grade Available: Extended temperature range options for demanding environments
• ISO Certified Production: Manufactured in AMD Xilinx’s certified facilities
• Comprehensive Testing: 100% testing ensures device functionality and reliability

Long-Term Availability

AMD Xilinx maintains long product lifecycles for the Spartan-II family, ensuring:

• Extended Product Support: Long-term availability for production designs
• Stable Supply Chain: Established manufacturing and distribution networks
• Technical Documentation: Comprehensive datasheets, application notes, and reference designs
• Design Migration Path: Clear upgrade path to newer FPGA families when needed

Getting Started with XC2S200-6FGG759C

Design Resources

Designers can access comprehensive resources including:

• Complete Datasheets: Detailed electrical and timing specifications
• Application Notes: Best practices and design guidelines
• Reference Designs: Proven starting points for common applications
• Technical Support: Access to AMD Xilinx’s global support network

For more information about Xilinx FPGA products and comprehensive design resources, explore the latest tools and documentation to accelerate your FPGA development projects.

Evaluation and Development

• Development Boards: Third-party boards available with XC2S200 devices
• Evaluation Kits: Pre-configured hardware for rapid prototyping
• Software Tools: Free WebPACK edition for small to medium designs
• Online Training: Comprehensive tutorials and training materials

Ordering Information

When ordering the XC2S200-6FGG759C, the part number nomenclature indicates:

• XC2S200: Device family and gate count (200K gates)
• -6: Speed grade (fastest commercial grade)
• FGG: Fine-Pitch Ball Grid Array package
• 759: 759-ball count
• C: Commercial temperature range (0°C to +85°C)

For lead-free (RoHS compliant) versions, the part number includes an additional “G” as XC2S200-6FGGG759C.

Conclusion

The XC2S200-6FGG759C delivers an exceptional combination of performance, flexibility, and connectivity in a high-density package format. With 200,000 system gates, 5,292 logic cells, comprehensive memory resources, and 284 user I/O pins housed in the 759-ball Fine-Pitch BGA package, this FPGA provides designers with the resources needed to implement sophisticated digital designs across telecommunications, industrial, automotive, and embedded system applications.

The -6 speed grade ensures maximum performance at frequencies up to 263 MHz, while the advanced package technology provides excellent thermal management and signal integrity. Whether you’re developing next-generation communication equipment, implementing complex control systems, or prototyping custom embedded solutions, the XC2S200-6FGG759C from AMD Xilinx’s Spartan-II family offers the perfect balance of capability, reliability, and value.

Invest in proven FPGA technology that delivers long-term availability, comprehensive design support, and the flexibility to adapt to changing requirements—choose the XC2S200-6FGG759C for your next programmable logic design.