The XC2S200-6FGG752C represents a premium field-programmable gate array solution from AMD Xilinx’s proven Spartan-II family. This high-density FPGA combines exceptional processing capabilities with cost-effective programmable logic, making it an ideal choice for telecommunications, industrial automation, and embedded systems development. Featuring 200,000 system gates and 5,292 logic cells, this device delivers outstanding performance for complex digital designs.
As a versatile programmable logic device, the XC2S200-6FGG752C offers engineers the flexibility to implement custom logic functions without the lengthy development cycles and substantial upfront costs associated with traditional application-specific integrated circuits. The 752-ball fine-pitch ball grid array package provides enhanced I/O density and superior electrical characteristics for demanding applications.
Technical Specifications and Key Features
Core Architecture Specifications
| Parameter |
Specification |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array Configuration |
28 x 42 (1,176 total CLBs) |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (57,344 bits) |
| Maximum User I/O Pins |
284 |
| Operating Voltage |
2.5V |
| Speed Grade |
-6 (commercial temperature range) |
| Package Type |
FGG752 (752-ball Fine-Pitch BGA) |
| Technology Node |
0.18µm CMOS |
Performance Characteristics
| Feature |
Description |
| System Performance |
Up to 200 MHz |
| Logic Density |
263 MHz maximum toggle frequency |
| Configuration Memory |
SRAM-based |
| Delay-Locked Loops |
4 DLLs for advanced clock management |
| Temperature Range |
Commercial (0°C to +85°C) |
XC2S200-6FGG752C Package Advantages
The FGG752 package utilizes advanced ball grid array technology, offering significant advantages over traditional pin-based packages. This configuration provides 752 solder balls arranged in a fine-pitch grid pattern, enabling exceptional interconnect density and reliability.
Package Benefits
- Enhanced Thermal Performance: Direct heat dissipation through the package substrate ensures optimal thermal management for high-performance applications
- Superior Signal Integrity: Reduced inductance and shorter interconnect paths deliver improved electrical characteristics
- High I/O Density: Area-array configuration maximizes the number of available user I/O connections
- Reliable Connections: Ball grid array technology provides robust mechanical and electrical connections for production environments
- Compact Footprint: Space-efficient design optimizes printed circuit board real estate
Application Areas and Use Cases
Telecommunications Systems
The XC2S200-6FGG752C excels in telecommunications infrastructure, supporting protocol implementation, data encoding/decoding, and high-speed communication interfaces. Network equipment manufacturers leverage this FPGA for router development, switching systems, and signal processing applications.
Industrial Control and Automation
Manufacturing and process control systems benefit from the XC2S200-6FGG752C’s programmability and reliability. Applications include motor control, PLC functionality, sensor interfacing, and real-time monitoring systems that require precise digital logic implementation.
Digital Signal Processing
Engineers implement sophisticated signal processing algorithms using the abundant logic resources and embedded block RAM. Audio processing, video encoding, image filtering, and data compression applications take advantage of the device’s computational capabilities.
Embedded Systems Development
The XC2S200-6FGG752C serves as an excellent platform for rapid prototyping and production deployment of custom embedded solutions. Its reconfigurable nature allows for iterative design refinement and field upgrades without hardware modifications.
Design Implementation and Development Tools
| Tool Category |
Capability |
| Synthesis |
HDL-based design entry with Verilog and VHDL support |
| Place and Route |
Automated logic placement and interconnect routing |
| Timing Analysis |
Comprehensive static timing verification |
| Simulation |
Functional and timing simulation environments |
| Configuration |
Multiple configuration modes including JTAG, SelectMAP, and serial |
Memory Architecture and Resources
Configurable Logic Blocks
Each configurable logic block contains multiple lookup tables, flip-flops, and multiplexers, enabling flexible implementation of combinational and sequential logic circuits. The 28 x 42 CLB array provides 1,176 total CLBs for complex design requirements.
Embedded Memory Resources
| Memory Type |
Capacity |
Application |
| Distributed RAM |
75,264 bits |
Small, distributed data storage |
| Block RAM |
56K bits |
Larger data buffers, FIFOs, lookup tables |
The dual-port block RAM supports simultaneous read and write operations, making it ideal for buffering, data caching, and high-speed memory applications.
Programmable I/O Capabilities
The XC2S200-6FGG752C provides up to 284 user I/O pins, supporting various signaling standards and voltage levels. Each I/O block includes programmable features for:
- Multiple I/O standards support (LVTTL, LVCMOS, PCI, GTL, and more)
- Programmable slew rate control for signal integrity optimization
- Individual pull-up and pull-down resistors
- Input/output delay compensation
- Three-state buffer control
Clock Management and Distribution
Four delay-locked loops positioned at each corner of the die provide sophisticated clock management capabilities. These DLLs enable:
- Clock deskewing and phase alignment
- Frequency multiplication and division
- Duty cycle correction
- Low-jitter clock distribution across the FPGA fabric
Advantages Over ASIC Solutions
| Aspect |
XC2S200-6FGG752C FPGA |
Traditional ASIC |
| Initial Cost |
Low development costs |
High mask and NRE costs |
| Time to Market |
Rapid prototyping and deployment |
Extended development cycles |
| Design Flexibility |
Field-upgradeable and reconfigurable |
Fixed functionality |
| Risk Level |
Low risk with iterative refinement |
High risk with committed design |
| Volume Economics |
Cost-effective for low to medium volumes |
Economical only at high volumes |
Power Management Considerations
The 2.5V core voltage requirement simplifies power supply design while maintaining compatibility with standard logic families. Designers can implement power optimization strategies including:
- Clock gating for unused logic blocks
- Selective I/O standard selection
- Dynamic partial reconfiguration for power-critical applications
Quality and Reliability Standards
The XC2S200-6FGG752C undergoes rigorous testing and qualification processes to ensure reliable operation in commercial applications. Quality assurance measures include:
- Comprehensive electrical parameter testing
- Thermal cycling and stress testing
- Static and dynamic functional verification
- Long-term reliability validation
Integration with Development Ecosystems
The XC2S200-6FGG752C integrates seamlessly with industry-standard Xilinx FPGA development tools and methodologies. Engineers can leverage comprehensive IP core libraries, reference designs, and application notes to accelerate project development and reduce time-to-market.
Ordering Information and Availability
The complete part number XC2S200-6FGG752C breaks down as follows:
- XC2S200: Device family and gate count (Spartan-II, 200K gates)
- -6: Speed grade (commercial temperature range)
- FGG752: Package type (752-ball fine-pitch ball grid array)
- C: Commercial temperature range (0°C to +85°C)
Programming and Configuration Options
| Configuration Method |
Description |
Use Case |
| JTAG Boundary Scan |
IEEE 1149.1 compliant |
Development, debugging, production test |
| Master Serial |
FPGA controls configuration PROM |
Stand-alone operation |
| Slave Serial |
External controller manages configuration |
System-integrated designs |
| SelectMAP |
Parallel configuration interface |
High-speed configuration requirements |
Competitive Positioning
The XC2S200-6FGG752C delivers an optimal balance of logic density, I/O resources, and cost-effectiveness for mid-range FPGA applications. This positioning makes it particularly attractive for:
- Production designs requiring proven, mature technology
- Cost-sensitive applications demanding reliable performance
- Legacy system upgrades and modernization projects
- Educational and research applications
Technical Support and Documentation
Comprehensive technical documentation supports successful implementation of the XC2S200-6FGG752C, including detailed datasheets, application notes, reference designs, and design constraint files. Engineers can access pinout information, timing specifications, and electrical characteristics for accurate PCB design and signal integrity analysis.
Conclusion
The XC2S200-6FGG752C stands as a robust, feature-rich FPGA solution for diverse digital design challenges. Its combination of substantial logic resources, flexible I/O capabilities, advanced clock management, and proven reliability makes it an excellent choice for telecommunications, industrial, and embedded applications. The 752-ball fine-pitch BGA package provides enhanced density and performance characteristics, while the mature Spartan-II architecture ensures design stability and long-term availability for production systems.
Whether developing new products or upgrading existing platforms, the XC2S200-6FGG752C delivers the programmable logic capabilities, performance characteristics, and cost-effectiveness that modern digital systems demand. Its versatility and comprehensive feature set continue to make it a preferred choice for engineers implementing sophisticated digital solutions across multiple industries.
