Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S600E-6FG456I: High-Performance Spartan-IIE FPGA for Industrial Applications

Product Details

Product Overview: AMD Xilinx XC2S600E-6FG456I FPGA

The XC2S600E-6FG456I is a powerful Field-Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Spartan-IIE family. This industrial-grade programmable logic device delivers exceptional performance with 600,000 system gates and 15,552 logic cells, making it an ideal solution for demanding embedded systems, telecommunications infrastructure, and digital signal processing applications.

Built on advanced 0.15-micron technology, this Xilinx FPGA combines high-speed operation with low power consumption in a compact 456-pin Fine-pitch Ball Grid Array (FBGA) package, offering engineers a cost-effective alternative to traditional ASIC designs.

Key Technical Specifications

Specification Details
Part Number XC2S600E-6FG456I
Manufacturer AMD Xilinx (formerly Xilinx Inc.)
Product Family Spartan-IIE FPGA
System Gates 600,000 gates
Logic Cells 15,552 cells
Block RAM 2.5 Mb (288 Kbits total)
Distributed RAM Up to 221,184 bits
Maximum Frequency 357 MHz internal clock
Operating Voltage 1.8V core (VCCINT)
Package Type 456-pin FBGA (Fine-pitch Ball Grid Array)
Technology Node 0.15µm CMOS process
Temperature Grade Industrial (-40°C to +100°C)
Speed Grade -6 (standard performance)

FPGA Architecture and Performance Features

Logic Resources

The XC2S600E-6FG456I features a robust architecture based on Xilinx’s proven Virtex-E technology, optimized for cost-sensitive applications. Each Configurable Logic Block (CLB) contains four Logic Cells (LCs) organized in two slices, providing flexible implementation of complex digital functions.

Memory Capabilities:

  • Block RAM: Six columns of dual-port block RAM totaling 2.5 Mb
  • Distributed RAM: 16 bits per Look-Up Table (LUT)
  • RAM Configuration: Configurable as 4K-bit true dual-port blocks
  • Memory Flexibility: Supports both synchronous and asynchronous operations

Input/Output Specifications

I/O Feature Specification
User I/O Pins Up to 329 pins (package dependent)
I/O Standards 19 selectable standards including LVTTL, LVCMOS, GTL, SSTL, HSTL
Voltage Support 1.5V to 3.3V I/O banks
Differential Pairs Support for LVDS, RSDS, mini-LVDS
Hot Swap Hot-swap and hot-insertion capable
I/O Banking Multiple independent I/O voltage banks

Clock Management System

The XC2S600E-6FG456I integrates advanced clock management resources:

  • DLL (Delay-Locked Loops): Four integrated DLLs for precise clock distribution
  • Clock Frequency: Maximum internal frequency of 357 MHz
  • Clock Networks: Dedicated low-skew global clock distribution
  • Clock Multiplication/Division: Programmable frequency synthesis
  • Phase Shifting: Adjustable phase relationships between clocks

Programming and Configuration Options

Configuration Modes

The Spartan-IIE FPGA supports multiple configuration interfaces:

  1. Master Serial Mode: External serial PROM with automatic configuration
  2. Slave Serial Mode: Host processor or microcontroller driven
  3. Slave Parallel Mode: 8-bit parallel configuration interface
  4. Boundary Scan (JTAG): IEEE 1149.1 compliant configuration and debugging
  5. SelectMAP: Fast parallel configuration for rapid reconfiguration

Programming Features

Feature Description
Configuration Memory Static RAM-based (SRAM)
Reprogramming Cycles Unlimited in-system reprogrammability
Configuration Time Typically milliseconds (mode dependent)
Bitstream Security Readback protection available
PROM Support Compatible with Platform Flash PROMs

Application Areas and Use Cases

Industrial Control Systems

The XC2S600E-6FG456I excels in industrial automation applications:

  • Motor control and drive systems
  • Programmable Logic Controllers (PLCs)
  • Process monitoring and control
  • Factory automation interfaces
  • Machine vision processing

Telecommunications Infrastructure

Ideal for networking and communication equipment:

  • Protocol conversion and bridging
  • Digital signal processing for baseband processing
  • Channel encoding/decoding
  • Network packet processing
  • Wireless infrastructure equipment

Medical Instrumentation

High-reliability applications in healthcare:

  • Medical imaging equipment
  • Patient monitoring systems
  • Diagnostic instrument control
  • Laboratory automation
  • Portable medical devices

Automotive Electronics

Suitable for automotive-grade applications:

  • Advanced driver assistance systems (ADAS)
  • Infotainment system controllers
  • Engine control units
  • Body electronics modules
  • Sensor fusion processing

Design Tools and Development Support

Compatible Development Software

Tool Purpose
ISE Design Suite Primary design entry, synthesis, and implementation
Vivado (Legacy Support) Modern tool suite with backward compatibility
ModelSim/Questa HDL simulation and verification
ChipScope Pro In-system debugging and analysis
EDK (Embedded Development Kit) Embedded processor system design

HDL Language Support

  • VHDL: Full IEEE 1076 standard compliance
  • Verilog: IEEE 1364 standard support
  • SystemVerilog: Synthesis subset supported
  • Schematic Entry: Graphical design entry option

Package Information: 456-Pin FBGA

Physical Dimensions

Parameter Specification
Package Type FBGA456 (Fine-pitch Ball Grid Array)
Body Size 23mm x 23mm nominal
Ball Pitch 1.0mm
Total Balls 456
Package Height ~2.23mm (max)
Thermal Resistance θJA: ~35°C/W (with airflow)

PCB Design Considerations

When designing with the XC2S600E-6FG456I FBGA package:

  • Recommended PCB stack-up: 6-8 layers for optimal signal integrity
  • Via-in-pad technology recommended for dense routing
  • Power plane partitioning for separate VCCINT and VCCO domains
  • Thermal vias for enhanced heat dissipation
  • Minimum trace width/spacing: 4/4 mil for standard routing

Power Supply Requirements

Voltage Rails and Current

Rail Voltage Typical Current Purpose
VCCINT 1.8V ±5% 500-800mA Core logic power
VCCO 1.5V-3.3V 200-500mA I/O banks (selectable)
VCCAUX 2.5V/3.3V 50-100mA Auxiliary circuits

Power Consumption

  • Static Power: ~200-400mW (design dependent)
  • Dynamic Power: Varies with design utilization and switching frequency
  • Sleep/Standby: Low-power modes available
  • Typical Total: 1-3W in most applications

Quality and Reliability

Manufacturing Standards

  • RoHS compliant (lead-free options available)
  • JEDEC moisture sensitivity level: MSL 3
  • Operating temperature range: -40°C to +100°C (industrial grade)
  • Storage temperature: -65°C to +150°C
  • ESD protection: HBM Class 1C (>1000V)

Longevity and Lifecycle

Important Note: The XC2S600E family has been designated as not recommended for new designs by AMD Xilinx. Designers should consider newer Spartan-6 or Spartan-7 alternatives for new projects. However, existing designs can continue production with available inventory.

Comparison Table: XC2S600E Variants

Part Number Speed Grade Temperature Package I/O Count
XC2S600E-6FG456I -6 Industrial FBGA-456 329
XC2S600E-6FG456C -6 Commercial FBGA-456 329
XC2S600E-7FG456I -7 Industrial FBGA-456 329
XC2S600E-6FG676I -6 Industrial FBGA-676 408

Getting Started: Development Workflow

Step 1: Design Entry

Create your digital logic design using VHDL, Verilog, or schematic entry tools within ISE Design Suite.

Step 2: Synthesis and Implementation

Synthesize your HDL code into gate-level netlists, then implement (map, place, and route) onto the XC2S600E architecture.

Step 3: Timing Analysis

Verify timing constraints are met using static timing analysis tools. The -6 speed grade provides balanced performance for most applications.

Step 4: Configuration File Generation

Generate the .bit configuration bitstream file for programming the FPGA.

Step 5: Programming and Debugging

Use JTAG interface for initial programming and debugging. Configure via serial PROM for production deployment.

Common Applications Circuit Examples

Digital Signal Processing

  • FIR/IIR filter implementations
  • FFT/IFFT processors
  • Correlation engines
  • Adaptive filtering

Interface Bridging

  • PCI to UART/SPI conversion
  • Ethernet MAC implementations
  • USB peripheral controllers
  • CAN bus interfaces

Protocol Processing

  • Custom communication protocols
  • Data encryption/decryption
  • Error correction coding
  • Frame synchronization

Frequently Asked Questions

Q: Is the XC2S600E-6FG456I suitable for aerospace applications? A: While the industrial temperature grade (-I suffix) can operate in harsh environments, for aerospace applications requiring extended temperature ranges or radiation tolerance, consult AMD Xilinx’s aerospace-grade product lines.

Q: What is the difference between -6 and -7 speed grades? A: The speed grade indicates timing performance. The -6 grade is standard performance, while -7 offers faster propagation delays. Choose based on your timing requirements and budget.

Q: Can I migrate designs from Spartan-IIE to newer families? A: Yes, most designs can be migrated to Spartan-6 or Spartan-7 families with minimal modifications. Consult Xilinx migration guides for specific guidance.

Q: What development boards support this FPGA? A: Several third-party vendors offered Spartan-IIE development boards. Contact distributors for availability of evaluation platforms.

Alternative and Replacement Options

Recommended Upgrades

For new designs, consider these modern alternatives:

  • Spartan-6 LX75: Similar gate count, lower power, more features
  • Spartan-7 XC7S50: Modern 7-series architecture, enhanced performance
  • Artix-7 XC7A50T: Higher performance with lower power consumption

Pin-Compatible Alternatives

  • XC2S600E-7FG456I (faster speed grade)
  • XC2S400E-6FG456I (lower capacity, same package)

Ordering Information

Part Number Breakdown

XC2S600E-6FG456I

  • XC: Xilinx commercial FPGA
  • 2S: Spartan-II family
  • 600E: 600K gates, Enhanced version
  • -6: Speed grade 6
  • FG456: Fine-pitch BGA, 456 pins
  • I: Industrial temperature grade

Availability

Check with authorized AMD Xilinx distributors for current stock levels. As this is a mature product, verify lead times before committing to production schedules.

Technical Support Resources

  • AMD Xilinx Documentation: Official datasheets and reference manuals
  • Community Forums: User-to-user technical discussions
  • FAE Support: Contact local Field Application Engineers
  • Design Services: Third-party FPGA design consultants available

Conclusion: Why Choose the XC2S600E-6FG456I

The XC2S600E-6FG456I Spartan-IIE FPGA represents proven, reliable programmable logic technology ideal for cost-sensitive applications requiring moderate logic density and performance. Its 600,000-gate capacity, comprehensive I/O support, and flexible configuration options make it suitable for diverse industrial, telecommunications, and embedded applications.

While newer FPGA families offer enhanced features and lower power consumption, the XC2S600E continues to serve existing designs effectively. Its unlimited reprogrammability, extensive development tool support, and robust industrial temperature rating ensure reliable operation in demanding environments.

For engineers seeking a balance of performance, cost, and proven reliability, the XC2S600E-6FG456I remains a solid choice for legacy designs and cost-optimized applications where cutting-edge performance is not required.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.