Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S100E-6PQG208C: High-Performance Spartan-IIE FPGA for Advanced Digital Design

Product Details

Overview of XC2S100E-6PQG208C FPGA

The XC2S100E-6PQG208C is a professional-grade field-programmable gate array from the renowned Spartan-IIE family, manufactured by Xilinx (now AMD). This powerful FPGA delivers exceptional performance with 100,000 system gates and 2,700 logic cells, making it an ideal solution for telecommunications, industrial automation, and embedded system applications. Built on advanced 0.15μm technology, this FPGA operates at speeds up to 357MHz while maintaining energy efficiency with its 1.8V core voltage.

Key Specifications and Technical Parameters

Core Technical Specifications

Parameter Specification
Part Number XC2S100E-6PQG208C
Manufacturer Xilinx (AMD)
Product Family Spartan-IIE
System Gates 100,000 gates
Logic Cells 2,700 cells
Maximum Frequency 357 MHz
Technology Node 0.15μm process
Core Voltage 1.8V
Package Type 208-Pin PQFP (Plastic Quad Flat Pack)
I/O Pins 146 user I/O
Operating Temperature Commercial (0°C to +85°C)
RoHS Compliance Yes (Lead-free compliant)

Memory and Logic Resources

Resource Type Capacity
Block RAM Up to 56K bits
Distributed RAM Up to 75,264 bits
Configurable Logic Blocks (CLBs) High-density architecture
Digital Clock Managers (DLLs) 4 DLLs
Supported I/O Standards 16 selectable standards

Advanced Features and Capabilities

High-Performance Architecture

The XC2S100E-6PQG208C features the proven Spartan-IIE architecture, which provides substantial logic resources at competitive pricing. The device leverages fast, predictable interconnect technology ensuring that successive design iterations consistently meet timing requirements without unexpected delays.

Flexible I/O Standards Support

This Xilinx FPGA supports 16 different I/O standards, enabling seamless interfacing with various system components and protocols. This versatility makes the XC2S100E-6PQG208C suitable for mixed-signal environments and multi-voltage systems.

Memory Hierarchy

The dual-memory architecture includes both block RAM and distributed SelectRAM, allowing designers to optimize memory allocation based on application requirements. Block RAM supports larger data structures, while distributed RAM provides fast, localized storage within logic cells.

Clock Management System

Four on-chip Digital Lock Loop (DLL) circuits provide advanced clock management capabilities, including clock de-skewing, frequency synthesis, and phase shifting. These features ensure reliable timing across complex digital designs.

Applications and Use Cases

Industrial Automation and Control

Application Area Implementation Benefits
Motor Control Systems High-speed PWM generation and encoder processing
Industrial Communication Protocol implementation (Profibus, Modbus, EtherCAT)
PLC Systems Real-time logic processing and I/O management
Sensor Interfaces Multi-channel data acquisition and processing

Telecommunications Infrastructure

The XC2S100E-6PQG208C excels in telecommunications applications including:

  • Broadband fixed-line access equipment
  • Wireless infrastructure base stations
  • Signal processing and filtering
  • Protocol conversion and data routing
  • Digital signal processing (DSP) acceleration

Consumer Electronics

  • Personal electronics devices
  • PC and notebook peripherals
  • Lighting control systems
  • Display controllers
  • Audio/video processing equipment

Embedded Systems Development

  • System-on-chip (SoC) prototyping
  • Custom computing architectures
  • Encryption and security modules
  • Real-time data processing
  • Communication protocol implementations

Technical Advantages Over Traditional ASICs

Cost-Effective Development

Aspect FPGA Advantage ASIC Limitation
Initial Investment Low NRE costs High mask and tooling costs
Development Time Rapid prototyping (days/weeks) Extended cycles (months/years)
Design Flexibility Unlimited reprogrammability Fixed functionality
Risk Mitigation In-field updates possible Hardware replacement required
Volume Flexibility Economic at low-to-medium volumes Only cost-effective at high volumes

Field Upgradability

Unlike mask-programmed ASICs, the XC2S100E-6PQG208C allows design modifications and feature upgrades without hardware replacement, significantly reducing maintenance costs and extending product lifecycle.

Package and Physical Characteristics

PQFP208 Package Details

The 208-pin Plastic Quad Flat Pack (PQFP) package provides:

  • Compact footprint: 28mm × 28mm
  • 0.5mm lead pitch for high-density PCB designs
  • Excellent thermal performance
  • Industry-standard footprint for easy PCB integration
  • RoHS-compliant, lead-free construction

Power Supply Requirements

Supply Rail Voltage Function
VCCINT 1.8V Core logic supply
VCCO 1.8V – 3.3V I/O bank supply (configurable)
VCCAUX 2.5V Auxiliary circuits

Design and Development Support

Configuration Options

The XC2S100E-6PQG208C supports multiple configuration methods:

  • Master Serial mode
  • Slave Serial mode
  • Master Parallel mode
  • Boundary Scan (JTAG)
  • SelectMAP mode

Software Compatibility

Compatible with Xilinx ISE Design Suite and Vivado tools (with appropriate licenses), providing:

  • HDL synthesis (VHDL, Verilog)
  • Timing analysis and optimization
  • Place and route automation
  • Simulation and verification
  • ChipScope integrated logic analyzer

Quality and Reliability

Manufacturing Standards

  • Manufactured using proven 0.15μm CMOS technology
  • Comprehensive production testing
  • ESD protection on all pins
  • Built-in configuration CRC checking
  • MTBF ratings suitable for industrial applications

Environmental Compliance

  • RoHS compliant (lead-free)
  • Halogen-free options available
  • REACH regulation compliance
  • Conflict minerals reporting available

Comparison with Related Products

Spartan-IIE Family Positioning

Model Gates Logic Cells Max I/O
XC2S50E 50K 1,728 182
XC2S100E 100K 2,700 202
XC2S150E 150K 3,840 265
XC2S200E 200K 5,292 265
XC2S300E 300K 7,168 410
XC2S400E 400K 10,240 410

The XC2S100E-6PQG208C occupies the mid-range position, offering an optimal balance between logic resources and cost-effectiveness for moderate-complexity designs.

Procurement and Availability

Part Number Designation

Understanding the part number structure:

  • XC2S100E: Device family and gate count
  • 6: Speed grade (6ns max delay)
  • PQG: Package type (Plastic Quad Flat Pack, RoHS)
  • 208: Pin count
  • C: Commercial temperature range

Lifecycle Status

Current lifecycle status is marked as obsolete by the manufacturer. However, the part remains available through authorized distributors and component brokers specializing in legacy and hard-to-find semiconductors.

Quality Assurance When Purchasing

When sourcing XC2S100E-6PQG208C units:

  • Verify date codes and country of origin
  • Request Certificate of Conformance (CoC)
  • Ensure parts are stored in anti-static packaging
  • Confirm authenticity through authorized channels
  • Check moisture sensitivity level (MSL) ratings

Integration Guidelines

PCB Design Considerations

To maximize performance and reliability:

  1. Power Distribution: Implement proper decoupling with multiple ceramic capacitors (0.1μF and 0.01μF) near each power pin
  2. Signal Integrity: Maintain controlled impedance for high-speed signals
  3. Thermal Management: Provide adequate copper area for heat dissipation
  4. Ground Planes: Use solid ground planes to minimize noise and EMI
  5. Configuration Interface: Include proper pull-up/pull-down resistors on configuration pins

Programming and Configuration

The device requires external configuration memory (typically SPI Flash or Platform Flash PROM) to store the bitstream. Configuration time is typically less than 100ms for a complete device programming cycle.

Performance Optimization Tips

Maximizing System Performance

  • Utilize pipelining techniques for high-speed data paths
  • Leverage block RAM for data buffering and lookup tables
  • Apply proper timing constraints during synthesis
  • Use DLLs for clock domain synchronization
  • Implement resource sharing for area optimization

Power Optimization Strategies

  • Disable unused I/O banks
  • Implement clock gating for inactive logic
  • Select appropriate I/O standards for minimum power
  • Utilize sleep modes when applicable
  • Optimize logic levels to reduce switching activity

Conclusion

The XC2S100E-6PQG208C represents a proven FPGA solution for applications requiring moderate logic density, high performance, and cost-effectiveness. Its comprehensive feature set, including substantial block RAM, flexible I/O standards, and robust clock management, makes it suitable for diverse applications across industrial, telecommunications, and consumer electronics markets. While officially obsolete, the device continues to serve as a reliable component in legacy systems and applications where its specific feature set provides optimal value.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.