Product Overview
The XC2S150E-6FT256C is a powerful field-programmable gate array from AMD Xilinx’s Spartan-IIE family, designed to deliver exceptional performance for cost-sensitive embedded applications. This FPGA combines 150,000 system gates with advanced features and flexible I/O capabilities, making it an ideal solution for communications equipment, industrial automation, consumer electronics, and enterprise systems.
As part of the proven Xilinx FPGA portfolio, the XC2S150E-6FT256C offers designers a reliable alternative to application-specific integrated circuits (ASICs) with the added benefits of in-system reprogrammability and faster time-to-market.
Key Technical Specifications
Core Architecture Features
| Parameter |
Specification |
| Logic Cells |
3,888 cells |
| System Gates |
150,000 gates |
| CLB Array |
24 x 36 |
| Maximum Frequency |
357 MHz |
| Process Technology |
0.15μm (150nm) |
| Operating Voltage |
1.8V |
Memory Configuration
| Memory Type |
Capacity |
| Block RAM |
48 Kbits (6 KB) |
| Distributed RAM |
55,296 bits |
| Total Available IOBs |
265 |
| User I/O Pins |
114 |
Package Details
| Specification |
Value |
| Package Type |
FTBGA (Fine-Pitch Ball Grid Array) |
| Pin Count |
256 pins |
| Speed Grade |
-6 (Commercial) |
| Operating Temperature |
0°C to +85°C |
| RoHS Compliance |
Yes (Lead-free) |
Advanced Features and Capabilities
Flexible I/O Standards Support
The XC2S150E-6FT256C supports 19 different I/O standards, providing exceptional flexibility for interfacing with various system components:
- LVTTL, LVCMOS (3.3V, 2.5V, 1.8V, 1.5V)
- SSTL2, SSTL3
- HSTL Classes I, III, IV
- GTL, GTL+
- AGP-2X
- CTT
- PCI (33MHz, 66MHz)
Delay-Locked Loop (DLL) Technology
Four integrated DLLs enable precise clock management and distribution:
- Clock multiplication and division
- Phase shifting capabilities
- Deskew functionality
- Improved timing closure
Hot-Swap Capability
The XC2S150E-6FT256C includes built-in hot-swap support:
- Signals can be applied before powering the device
- High-impedance I/O pins during power-up
- Latch-up immunity during hot insertion
- No current path to power supplies from I/O pins
Performance Specifications
Timing Characteristics
| Parameter |
Specification |
| System Clock Frequency |
Up to 357 MHz |
| Toggle Rate |
263 MHz typical |
| CLB Propagation Delay |
1.4ns typical |
| Global Clock Distribution |
Low-skew, high-speed |
Power Consumption Profile
| Condition |
Typical Current |
| Static Power (VCCINT) |
50mA @ 1.8V |
| Dynamic Power |
Application dependent |
| I/O Power (VCCO) |
Varies by standard |
Applications and Use Cases
Communication Systems
- Network routers and switches
- Broadband access equipment
- Protocol converters
- Wireless base stations
Industrial Automation
- Motor control systems
- Programmable logic controllers (PLCs)
- Factory automation
- Real-time control systems
Consumer Electronics
- Set-top boxes
- Gaming consoles
- Digital signal processing
- Multimedia applications
Enterprise Equipment
- Data center equipment
- Storage systems
- Server interfaces
- High-speed interconnects
Design Advantages Over ASICs
Cost-Effectiveness
- No NRE Costs: Eliminate expensive mask charges
- No Minimum Orders: Order only what you need
- Reduced Risk: No silicon respins required
Time-to-Market Benefits
- Immediate Availability: Off-the-shelf deployment
- Rapid Prototyping: Test and iterate quickly
- Field Updates: Reprogram without hardware changes
Development Flexibility
- Design Iterations: Modify logic without new hardware
- Feature Upgrades: Add functionality post-deployment
- Bug Fixes: Correct issues in the field
Development Tools and Support
Compatible Software
- Xilinx ISE Design Suite: Complete design environment
- ChipScope Pro: Integrated logic analyzer
- FPGA Editor: Low-level design viewing and editing
- Timing Analyzer: Comprehensive timing verification
Programming Options
- JTAG boundary scan
- Master/Slave serial configuration
- SelectMAP parallel configuration
- Daisy-chain support
Package and Ordering Information
Part Number Breakdown
XC2S150E-6FT256C
- XC2S150E: Device family and density
- 6: Speed grade (commercial temperature)
- FT256: Package type (256-pin FTBGA)
- C: Commercial temperature range (0°C to +85°C)
Related Part Numbers
| Part Number |
Temperature Range |
Package |
| XC2S150E-6FT256I |
Industrial (-40°C to +100°C) |
256-FTBGA |
| XC2S150E-6FG456C |
Commercial |
456-FBGA |
| XC2S150E-6PQ208C |
Commercial |
208-PQFP |
Quality and Reliability
Manufacturing Standards
- Built on proven 0.15μm CMOS process
- Comprehensive testing and screening
- Quality assurance per automotive standards
- Long-term availability commitment
Reliability Metrics
- MTBF: >1,000,000 hours
- ESD Protection: Human Body Model compliant
- Latch-Up Immunity: >200mA per pin
- Moisture Sensitivity: Level 3
Technical Support Resources
Documentation Available
- Complete datasheet with AC/DC specifications
- Application notes and design guides
- Reference designs and examples
- Packaging and PCB layout guidelines
Community Resources
- Xilinx community forums
- Technical support portal
- Training webinars and videos
- Design consulting services
Why Choose XC2S150E-6FT256C?
Proven Technology
The Spartan-IIE family represents mature, battle-tested FPGA technology with thousands of successful deployments worldwide. The XC2S150E-6FT256C specifically offers the optimal balance of logic density, I/O capability, and cost-effectiveness.
Design Security
With in-system reprogrammability, you maintain complete control over your intellectual property while retaining the ability to update and improve products throughout their lifecycle.
Supply Chain Stability
As a widely-adopted industry standard component, the XC2S150E-6FT256C benefits from multiple authorized distributors and reliable supply channels, ensuring availability for production requirements.
Conclusion
The XC2S150E-6FT256C delivers exceptional value for embedded system designers requiring a balance of performance, flexibility, and cost-efficiency. With 150,000 system gates, 357 MHz performance, comprehensive I/O support, and the reliability of Xilinx’s proven FPGA architecture, this device serves as an excellent foundation for next-generation electronic designs across multiple industries.
Whether you’re designing communication infrastructure, industrial control systems, or consumer electronics, the XC2S150E-6FT256C provides the programmable logic resources and features needed to bring your innovative ideas to market quickly and cost-effectively.
Frequently Asked Questions
Q: What is the difference between XC2S150E-6FT256C and XC2S150E-6FT256I? A: The “C” suffix indicates commercial temperature range (0°C to +85°C), while “I” designates industrial temperature range (-40°C to +100°C).
Q: Is the XC2S150E-6FT256C compatible with lead-free soldering processes? A: Yes, this device is RoHS compliant and compatible with lead-free reflow profiles.
Q: What development software is required? A: Xilinx ISE Design Suite is the recommended development environment for Spartan-IIE FPGAs.
Q: Can I upgrade from Spartan-II to Spartan-IIE? A: Yes, Spartan-IIE maintains architectural compatibility with Spartan-II while offering enhanced features and lower power consumption.
Q: What is the maximum user I/O count? A: The 256-pin FTBGA package provides 114 user I/O pins plus additional dedicated configuration and clock pins.
